JP2024523149A - 電子部品ボンディング装置およびそのような装置上の距離を測定する方法 - Google Patents

電子部品ボンディング装置およびそのような装置上の距離を測定する方法 Download PDF

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Publication number
JP2024523149A
JP2024523149A JP2023573325A JP2023573325A JP2024523149A JP 2024523149 A JP2024523149 A JP 2024523149A JP 2023573325 A JP2023573325 A JP 2023573325A JP 2023573325 A JP2023573325 A JP 2023573325A JP 2024523149 A JP2024523149 A JP 2024523149A
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Japan
Prior art keywords
electronic component
bonding apparatus
target
component bonding
substrate
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JP2023573325A
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English (en)
Japanese (ja)
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JPWO2022256332A5 (https=
JP2024523149A5 (https=
Inventor
ワッサーマン、マシュー、ビー．
エーダー、ジェームス、イー．
シュミット－ランゲ、マイケル、ピー．
タラブルスキー、マシュー、イー．
Original Assignee
クリック アンド ソッファ インダストリーズ、インク．
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Publication of JP2024523149A publication Critical patent/JP2024523149A/ja
Publication of JPWO2022256332A5 publication Critical patent/JPWO2022256332A5/ja
Publication of JP2024523149A5 publication Critical patent/JP2024523149A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2023573325A 2021-06-01 2022-05-31 電子部品ボンディング装置およびそのような装置上の距離を測定する方法 Pending JP2024523149A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163195705P 2021-06-01 2021-06-01
US63/195,705 2021-06-01
PCT/US2022/031622 WO2022256332A1 (en) 2021-06-01 2022-05-31 Electronic component bonding machines, and methods of measuring a distance on such machines

Publications (3)

Publication Number Publication Date
JP2024523149A true JP2024523149A (ja) 2024-06-28
JPWO2022256332A5 JPWO2022256332A5 (https=) 2025-06-04
JP2024523149A5 JP2024523149A5 (https=) 2025-06-04

Family

ID=84194313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023573325A Pending JP2024523149A (ja) 2021-06-01 2022-05-31 電子部品ボンディング装置およびそのような装置上の距離を測定する方法

Country Status (6)

Country Link
US (1) US12599020B2 (https=)
JP (1) JP2024523149A (https=)
KR (1) KR20240015650A (https=)
CN (1) CN117355934A (https=)
TW (1) TW202312859A (https=)
WO (1) WO2022256332A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023200659A1 (en) 2022-04-12 2023-10-19 Kulicke And Soffa Industries, Inc. Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326638A (ja) * 1992-05-15 1993-12-10 Sumitomo Electric Ind Ltd 半導体チップ実装方法および実装装置
JP2000012623A (ja) * 1998-06-25 2000-01-14 Sharp Corp ボンディング装置及びボンディング方法
JP2000243762A (ja) * 1999-02-17 2000-09-08 Hitachi Ltd 光半導体装置の製造方法およびそれに使用するペレットボンディング装置
JP2015005726A (ja) * 2013-05-22 2015-01-08 パナソニックＩｐマネジメント株式会社 部品の実装方法及び実装装置
JP2016092350A (ja) * 2014-11-11 2016-05-23 ボンドテック株式会社 電子部品装着装置および電子部品装着方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326633A (ja) 1992-05-15 1993-12-10 Sumitomo Electric Ind Ltd 半導体チップ実装方法および実装装置
DE4332236A1 (de) * 1992-11-26 1995-03-23 F E S Used Electronics Elektro Anlage zur automatischen Entstückung
US5461472A (en) * 1993-06-28 1995-10-24 At&T Ipm Corp. Method and apparatus for measuring the parallelism of two surfaces
JP2000164626A (ja) * 1998-09-25 2000-06-16 Fuji Photo Film Co Ltd 部品のボンディング方法および装置
JP2001024400A (ja) * 1999-07-08 2001-01-26 Matsushita Electric Ind Co Ltd 電子部品の実装方法及びその装置
CH694931A5 (de) 2000-03-17 2005-09-15 Esec Trading Sa Einrichtung fuer die Montage von Halbleiterchips auf einem Substrat.
JP3608497B2 (ja) 2000-10-03 2005-01-12 三菱電機株式会社 ボンディング装置
US6705507B2 (en) 2001-07-24 2004-03-16 Kulicke & Soffa Investments, Inc. Die attach system and process using cornercube offset tool
JP5249073B2 (ja) 2009-02-12 2013-07-31 株式会社ニデック 光干渉式距離計測装置
JP5894745B2 (ja) 2011-05-31 2016-03-30 浜松ホトニクス株式会社 集積回路検査装置
US8875979B2 (en) * 2012-05-04 2014-11-04 Asm Technology Singapore Pte. Ltd. Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
US20150380379A1 (en) * 2014-06-26 2015-12-31 MRSI Systems, LLC System and method for thermo-compression bonding of high bump count semiconductors
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
US11031367B2 (en) * 2016-10-25 2021-06-08 Kulicke and Soffa Industries, In. Bond head assemblies including reflective optical elements, related bonding machines, and related methods
WO2023200659A1 (en) * 2022-04-12 2023-10-19 Kulicke And Soffa Industries, Inc. Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05326638A (ja) * 1992-05-15 1993-12-10 Sumitomo Electric Ind Ltd 半導体チップ実装方法および実装装置
JP2000012623A (ja) * 1998-06-25 2000-01-14 Sharp Corp ボンディング装置及びボンディング方法
JP2000243762A (ja) * 1999-02-17 2000-09-08 Hitachi Ltd 光半導体装置の製造方法およびそれに使用するペレットボンディング装置
JP2015005726A (ja) * 2013-05-22 2015-01-08 パナソニックＩｐマネジメント株式会社 部品の実装方法及び実装装置
JP2016092350A (ja) * 2014-11-11 2016-05-23 ボンドテック株式会社 電子部品装着装置および電子部品装着方法

Also Published As

Publication number Publication date
KR20240015650A (ko) 2024-02-05
CN117355934A (zh) 2024-01-05
US12599020B2 (en) 2026-04-07
TW202312859A (zh) 2023-03-16
WO2022256332A1 (en) 2022-12-08
US20220384384A1 (en) 2022-12-01

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