|
US6140144A
(en)
*
|
1996-08-08 |
2000-10-31 |
Integrated Sensing Systems, Inc. |
Method for packaging microsensors
|
|
EP1041628A3
(en)
*
|
1999-03-29 |
2008-05-28 |
Interuniversitair Microelektronica Centrum Vzw |
An image sensor ball grid array package and the fabrication thereof
|
|
JP4603231B2
(ja)
*
|
2002-07-19 |
2010-12-22 |
パナソニック電工株式会社 |
火災感知器
|
|
JP2005045034A
(ja)
*
|
2003-07-22 |
2005-02-17 |
Nippon Aleph Corp |
フォトインタラプタ用光学装置
|
|
CA2468924A1
(en)
*
|
2004-01-14 |
2005-07-14 |
Laser Diagnostic Instruments International Inc. |
A device and method for non-contact sensing of low-concentration and trace substances
|
|
US7442570B2
(en)
*
|
2005-03-18 |
2008-10-28 |
Invensence Inc. |
Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
|
|
JP2009042469A
(ja)
*
|
2007-08-08 |
2009-02-26 |
Sharp Corp |
光モジュール、光モジュールの製造方法、光モジュールを用いて構成された光・電子複合回路、およびその製造方法
|
|
US8809923B2
(en)
*
|
2008-02-06 |
2014-08-19 |
Omnivision Technologies, Inc. |
Backside illuminated imaging sensor having a carrier substrate and a redistribution layer
|
|
JP2010021219A
(ja)
*
|
2008-07-09 |
2010-01-28 |
Nec Schott Components Corp |
パッケージングデバイス装置およびパッケージ用ベース部材
|
|
US20100289104A1
(en)
*
|
2009-05-14 |
2010-11-18 |
Optopac Co., Ltd. |
Photosensor package
|
|
KR100976812B1
(ko)
*
|
2010-02-08 |
2010-08-20 |
옵토팩 주식회사 |
전자 소자 패키지 및 그 제조 방법
|
|
KR100976813B1
(ko)
*
|
2010-04-23 |
2010-08-20 |
옵토팩 주식회사 |
전자 소자 패키지 및 그 제조 방법
|
|
US8659148B2
(en)
*
|
2010-11-30 |
2014-02-25 |
General Electric Company |
Tileable sensor array
|
|
US8476087B2
(en)
*
|
2011-04-21 |
2013-07-02 |
Freescale Semiconductor, Inc. |
Methods for fabricating sensor device package using a sealing structure
|
|
US20130050227A1
(en)
*
|
2011-08-30 |
2013-02-28 |
Qualcomm Mems Technologies, Inc. |
Glass as a substrate material and a final package for mems and ic devices
|
|
US8824706B2
(en)
*
|
2011-08-30 |
2014-09-02 |
Qualcomm Mems Technologies, Inc. |
Piezoelectric microphone fabricated on glass
|
|
WO2013062533A1
(en)
*
|
2011-10-25 |
2013-05-02 |
Intel Corporation |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
|
|
US9368429B2
(en)
*
|
2011-10-25 |
2016-06-14 |
Intel Corporation |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
|
|
JP6027828B2
(ja)
*
|
2012-09-14 |
2016-11-16 |
国立大学法人東北大学 |
素子の実装方法および光モジュールの製造方法
|
|
JP2017022056A
(ja)
*
|
2015-07-14 |
2017-01-26 |
日本放送協会 |
基板処理方法及びパッケージの気密封止方法
|
|
JP6246879B1
(ja)
*
|
2016-09-20 |
2017-12-13 |
株式会社東芝 |
光半導体モジュール及びその製造方法
|