JP2021525956A - 半導体装置パッケージおよびその使用方法 - Google Patents

半導体装置パッケージおよびその使用方法 Download PDF

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Publication number
JP2021525956A
JP2021525956A JP2020566268A JP2020566268A JP2021525956A JP 2021525956 A JP2021525956 A JP 2021525956A JP 2020566268 A JP2020566268 A JP 2020566268A JP 2020566268 A JP2020566268 A JP 2020566268A JP 2021525956 A JP2021525956 A JP 2021525956A
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JP
Japan
Prior art keywords
glass substrate
semiconductor device
photodetector
conductive
light
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Pending
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JP2020566268A
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English (en)
Japanese (ja)
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JPWO2019231919A5 (https=
JP2021525956A5 (https=
Inventor
コトコ アララオ、ヴァージル
コトコ アララオ、ヴァージル
ハンス ラーソン、ブレント
ハンス ラーソン、ブレント
Original Assignee
ティティ エレクトロニクス ピーエルシー
ティティ エレクトロニクス ピーエルシー
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Application filed by ティティ エレクトロニクス ピーエルシー, ティティ エレクトロニクス ピーエルシー filed Critical ティティ エレクトロニクス ピーエルシー
Publication of JP2021525956A publication Critical patent/JP2021525956A/ja
Publication of JPWO2019231919A5 publication Critical patent/JPWO2019231919A5/ja
Publication of JP2021525956A5 publication Critical patent/JP2021525956A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00317—Packaging optical devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2020566268A 2018-06-01 2019-05-28 半導体装置パッケージおよびその使用方法 Pending JP2021525956A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/995,510 2018-06-01
US15/995,510 US10693020B2 (en) 2018-06-01 2018-06-01 Semiconductor device package and method for use thereof
PCT/US2019/034185 WO2019231919A1 (en) 2018-06-01 2019-05-28 Semiconductor device package and method for use thereof

Publications (3)

Publication Number Publication Date
JP2021525956A true JP2021525956A (ja) 2021-09-27
JPWO2019231919A5 JPWO2019231919A5 (https=) 2022-06-07
JP2021525956A5 JP2021525956A5 (https=) 2022-06-07

Family

ID=68693249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020566268A Pending JP2021525956A (ja) 2018-06-01 2019-05-28 半導体装置パッケージおよびその使用方法

Country Status (5)

Country Link
US (1) US10693020B2 (https=)
EP (1) EP3804478A4 (https=)
JP (1) JP2021525956A (https=)
TW (1) TW202013754A (https=)
WO (1) WO2019231919A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113200509B (zh) * 2021-04-08 2024-10-11 日月光半导体制造股份有限公司 电子元件及半导体封装装置
CN113200510B (zh) * 2021-04-29 2024-10-11 日月光半导体制造股份有限公司 半导体结构

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323614A (ja) * 1999-03-29 2000-11-24 Interuniv Micro Electronica Centrum Vzw イメージセンサ・ボールグリッドアレイ・パッケージ及びその製造方法
JP2004055848A (ja) * 2002-07-19 2004-02-19 Matsushita Electric Works Ltd チップ間端子接続方法及びそれを用いて作製した回路基板とそれを具備する火災感知器
JP2005045034A (ja) * 2003-07-22 2005-02-17 Nippon Aleph Corp フォトインタラプタ用光学装置
JP2009042469A (ja) * 2007-08-08 2009-02-26 Sharp Corp 光モジュール、光モジュールの製造方法、光モジュールを用いて構成された光・電子複合回路、およびその製造方法
CN101887878A (zh) * 2009-05-14 2010-11-17 艾普特佩克股份有限公司 光电传感器封装
US20110193231A1 (en) * 2010-02-08 2011-08-11 Optopac Co., Ltd. Electronic device package and method for fabricating the same
US20110260275A1 (en) * 2010-04-23 2011-10-27 Optopac Co., Ltd Electronic device package and method of manufacturing the same
JP2012118060A (ja) * 2010-11-30 2012-06-21 General Electric Co <Ge> タイリング可能なセンサアレイ
US20130249109A1 (en) * 2011-10-25 2013-09-26 Qing Ma Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
JP2014057019A (ja) * 2012-09-14 2014-03-27 Tohoku Univ 素子の実装方法および光モジュール
JP2017022056A (ja) * 2015-07-14 2017-01-26 日本放送協会 基板処理方法及びパッケージの気密封止方法
JP6246879B1 (ja) * 2016-09-20 2017-12-13 株式会社東芝 光半導体モジュール及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6140144A (en) * 1996-08-08 2000-10-31 Integrated Sensing Systems, Inc. Method for packaging microsensors
CA2468924A1 (en) * 2004-01-14 2005-07-14 Laser Diagnostic Instruments International Inc. A device and method for non-contact sensing of low-concentration and trace substances
US7442570B2 (en) * 2005-03-18 2008-10-28 Invensence Inc. Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
US8809923B2 (en) * 2008-02-06 2014-08-19 Omnivision Technologies, Inc. Backside illuminated imaging sensor having a carrier substrate and a redistribution layer
JP2010021219A (ja) * 2008-07-09 2010-01-28 Nec Schott Components Corp パッケージングデバイス装置およびパッケージ用ベース部材
US8476087B2 (en) * 2011-04-21 2013-07-02 Freescale Semiconductor, Inc. Methods for fabricating sensor device package using a sealing structure
US20130050227A1 (en) * 2011-08-30 2013-02-28 Qualcomm Mems Technologies, Inc. Glass as a substrate material and a final package for mems and ic devices
US8824706B2 (en) * 2011-08-30 2014-09-02 Qualcomm Mems Technologies, Inc. Piezoelectric microphone fabricated on glass
WO2013062533A1 (en) * 2011-10-25 2013-05-02 Intel Corporation Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323614A (ja) * 1999-03-29 2000-11-24 Interuniv Micro Electronica Centrum Vzw イメージセンサ・ボールグリッドアレイ・パッケージ及びその製造方法
JP2004055848A (ja) * 2002-07-19 2004-02-19 Matsushita Electric Works Ltd チップ間端子接続方法及びそれを用いて作製した回路基板とそれを具備する火災感知器
JP2005045034A (ja) * 2003-07-22 2005-02-17 Nippon Aleph Corp フォトインタラプタ用光学装置
JP2009042469A (ja) * 2007-08-08 2009-02-26 Sharp Corp 光モジュール、光モジュールの製造方法、光モジュールを用いて構成された光・電子複合回路、およびその製造方法
CN101887878A (zh) * 2009-05-14 2010-11-17 艾普特佩克股份有限公司 光电传感器封装
US20110193231A1 (en) * 2010-02-08 2011-08-11 Optopac Co., Ltd. Electronic device package and method for fabricating the same
US20110260275A1 (en) * 2010-04-23 2011-10-27 Optopac Co., Ltd Electronic device package and method of manufacturing the same
JP2012118060A (ja) * 2010-11-30 2012-06-21 General Electric Co <Ge> タイリング可能なセンサアレイ
US20130249109A1 (en) * 2011-10-25 2013-09-26 Qing Ma Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
JP2014057019A (ja) * 2012-09-14 2014-03-27 Tohoku Univ 素子の実装方法および光モジュール
JP2017022056A (ja) * 2015-07-14 2017-01-26 日本放送協会 基板処理方法及びパッケージの気密封止方法
JP6246879B1 (ja) * 2016-09-20 2017-12-13 株式会社東芝 光半導体モジュール及びその製造方法

Also Published As

Publication number Publication date
US10693020B2 (en) 2020-06-23
TW202013754A (zh) 2020-04-01
WO2019231919A8 (en) 2021-02-11
EP3804478A1 (en) 2021-04-14
WO2019231919A1 (en) 2019-12-05
EP3804478A4 (en) 2022-03-09
US20190371944A1 (en) 2019-12-05

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