JP2017032555A - エンコーダ - Google Patents
エンコーダ Download PDFInfo
- Publication number
- JP2017032555A JP2017032555A JP2016149367A JP2016149367A JP2017032555A JP 2017032555 A JP2017032555 A JP 2017032555A JP 2016149367 A JP2016149367 A JP 2016149367A JP 2016149367 A JP2016149367 A JP 2016149367A JP 2017032555 A JP2017032555 A JP 2017032555A
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- sensor device
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- 238000005259 measurement Methods 0.000 claims abstract description 50
- 238000001514 detection method Methods 0.000 claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 238000005286 illumination Methods 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 230000001681 protective effect Effects 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- 239000011796 hollow space material Substances 0.000 claims description 2
- 239000004922 lacquer Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims 1
- 238000011109 contamination Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 239000000565 sealant Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- -1 condensate Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/347—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells using displacement encoding scales
- G01D5/34707—Scales; Discs, e.g. fixation, fabrication, compensation
- G01D5/34715—Scale reading or illumination devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/40—Thermal components
- H02S40/44—Means to utilise heat energy, e.g. hybrid systems producing warm water and electricity at the same time
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/60—Thermal-PV hybrids
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Transform (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
20 照明装置
21 光源
22 コリメータ
30 検出装置
31 回路基板
32 センサ装置
33 接触面
34 対応接触面
35 フォト検出器
35.1 中央のフォト検出器
35.2 隣接したフォト検出器
35.3 隣接したフォト検出器
36 ビアホール
37 金属小球
38 導電路
40 スケール本体
41 測定目盛
50 アンダーフィル材
51 側面保護部材
52 保護窓
60 液滴
530 検出装置
531 回路基板
532 センサ装置
533 走査板
535 フォト検出器
537 ボンディングワイヤ
538 シール剤
Claims (10)
- 測定方向(X)に互いに相対可動に配置されている、1つのスケール本体(40)と1つの走査装置(10)とを有するエンコーダであって、位置信号を生成するために走査装置(10)によって走査可能である1つの測定目盛(41)が、前記スケール本体(40)上に配置されていて、このため、前記走査装置(10)が、1つの照明装置(20)と1つの検出装置(30)とを有し、光が、前記照明装置(20)から前記測定目盛(41)の方向に放射可能であり、前記測定目盛(41)によって変調された光が、前記検出装置(30)によって検出可能であり、前記検出装置(30)が、1つの回路基板(31)と半導体チップとして構成されている1つのセンサ装置(32)とを有する当該エンコーダにおいて、
少なくとも2つのフォト検出器(35)が、前記測定目盛(41)に面した前記センサ装置(32)の前面に配置されていて、前記センサ装置(32)の複数の電気端子が、金属の複数のビアホール(36)によって前記センサ装置(32)の後面上の複数の接触面(33)まで敷設されていて、前記センサ装置(32)が、これらの接触面(33)を介して前記回路基板(31)上の複数の対応接触面(34)に接続されていることを特徴とするエンコーダ。 - 回路基板(31)とセンサ装置(32)との間の残っている中空空間が、アンダーフィル材(50)で充填されていることを特徴とする請求項1に記載のエンコーダ。
- 1つの側面保護部材(51)が、前記センサ装置(32)の周りに設けられている請求項1又は2に記載のエンコーダ。
- 前記センサ装置(32)の前面は、平坦に接着された又は加圧接合された保護窓(52)によって、機械的な損傷から保護されている請求項1〜3のいずれか1項に記載のエンコーダ。
- 前記保護窓(52)は、前記センサ装置(32)と同じ面積を有するか又は前記センサ装置(32)よりも大きい面積を有する請求項4に記載のエンコーダ。
- 1つの目盛パターンが、前記測定目盛(41)に面した前記保護窓(52)の面上に配置されている請求項4又は5に記載のエンコーダ。
- 前記センサ装置(32)の前面は、クリアラッカー又はクリアモールドによって、機械的な損傷から保護されている請求項1〜3のいずれか1項に記載のエンコーダ。
- 前記センサ装置(32)の前面と前記測定目盛(41)の表面との間の走査間隔(d)が、0.55mm未満である請求項1〜7のいずれか1項に記載のエンコーダ。
- 前記センサ装置(32)の前面と前記測定目盛(41)の表面との間の走査間隔(d)が、0.3mm未満である請求項1〜8のいずれか1項に記載のエンコーダ。
- 前記センサ装置(32)は、オプトASICである請求項1〜9のいずれか1項に記載のエンコーダ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15179014.4A EP3124921B1 (de) | 2015-07-30 | 2015-07-30 | Positionsmesseinrichtung |
EP15179014.4 | 2015-07-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017032555A true JP2017032555A (ja) | 2017-02-09 |
JP6889530B2 JP6889530B2 (ja) | 2021-06-18 |
Family
ID=53761277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016149367A Active JP6889530B2 (ja) | 2015-07-30 | 2016-07-29 | エンコーダ |
Country Status (6)
Country | Link |
---|---|
US (1) | US10260909B2 (ja) |
EP (1) | EP3124921B1 (ja) |
JP (1) | JP6889530B2 (ja) |
CN (1) | CN106404013B (ja) |
DE (1) | DE102016208623A1 (ja) |
ES (1) | ES2742705T3 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019002810A (ja) * | 2017-06-15 | 2019-01-10 | 株式会社ミツトヨ | 受光装置およびこれを備えた光電式エンコーダ |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016214456A1 (de) * | 2016-08-04 | 2018-02-08 | Dr. Johannes Heidenhain Gesellschaft Mit Beschränkter Haftung | Positionsmesseinrichtung und Verfahren zum Betreiben einer Positionsmesseinrichtung |
EP3657133B1 (de) * | 2018-11-20 | 2021-01-06 | Dr. Johannes Heidenhain GmbH | Sensoreinheit und positionsmesseinrichtung mit dieser sensoreinheit |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001168259A (ja) * | 1999-12-14 | 2001-06-22 | Sony Corp | リードフレームと、そのリードフレームの製造方法と、半導体装置と、その半導体装置の製造方法 |
US6519044B1 (en) * | 1998-02-20 | 2003-02-11 | Dr. Johannes Heidenhain Gmbh | Scanner unit for an optical position measuring device |
JP2010508501A (ja) * | 2006-10-28 | 2010-03-18 | レニショウ パブリック リミテッド カンパニー | 光電子読取りヘッド |
US20100171028A1 (en) * | 2009-01-08 | 2010-07-08 | Avago Technologies Ecbu (Singapore) Pte. Ltd. | Reflective Optical Encoder Package and Method |
US20120281989A1 (en) * | 2011-05-03 | 2012-11-08 | Yunzhi Dong | Optical receiver |
US20140034819A1 (en) * | 2012-07-31 | 2014-02-06 | Sick Stegmann Gmbh | Transmission and reception unit and rotary actuator having the same |
US20140070421A1 (en) * | 2011-05-19 | 2014-03-13 | Microsemi Semiconductor Limited | Integrated circuit package |
WO2014128796A1 (ja) * | 2013-02-25 | 2014-08-28 | パナソニック株式会社 | 半導体装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8513119B2 (en) * | 2008-12-10 | 2013-08-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming bump structure having tapered sidewalls for stacked dies |
US9331096B2 (en) * | 2009-09-04 | 2016-05-03 | Luxtera, Inc. | Method and system for hybrid integration of optical communication systems |
US9057850B2 (en) * | 2011-03-24 | 2015-06-16 | Centera Photonics Inc. | Optoelectronic module |
TWI571979B (zh) * | 2014-11-25 | 2017-02-21 | 彭賢斌 | 整合式被動模組、半導體裝置及其製作方法 |
-
2015
- 2015-07-30 ES ES15179014T patent/ES2742705T3/es active Active
- 2015-07-30 EP EP15179014.4A patent/EP3124921B1/de active Active
-
2016
- 2016-05-19 DE DE102016208623.5A patent/DE102016208623A1/de not_active Withdrawn
- 2016-07-18 US US15/212,943 patent/US10260909B2/en active Active
- 2016-07-26 CN CN201610591470.9A patent/CN106404013B/zh active Active
- 2016-07-29 JP JP2016149367A patent/JP6889530B2/ja active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6519044B1 (en) * | 1998-02-20 | 2003-02-11 | Dr. Johannes Heidenhain Gmbh | Scanner unit for an optical position measuring device |
JP2001168259A (ja) * | 1999-12-14 | 2001-06-22 | Sony Corp | リードフレームと、そのリードフレームの製造方法と、半導体装置と、その半導体装置の製造方法 |
JP2010508501A (ja) * | 2006-10-28 | 2010-03-18 | レニショウ パブリック リミテッド カンパニー | 光電子読取りヘッド |
US20100171028A1 (en) * | 2009-01-08 | 2010-07-08 | Avago Technologies Ecbu (Singapore) Pte. Ltd. | Reflective Optical Encoder Package and Method |
US20120281989A1 (en) * | 2011-05-03 | 2012-11-08 | Yunzhi Dong | Optical receiver |
US20140070421A1 (en) * | 2011-05-19 | 2014-03-13 | Microsemi Semiconductor Limited | Integrated circuit package |
US20140034819A1 (en) * | 2012-07-31 | 2014-02-06 | Sick Stegmann Gmbh | Transmission and reception unit and rotary actuator having the same |
WO2014128796A1 (ja) * | 2013-02-25 | 2014-08-28 | パナソニック株式会社 | 半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019002810A (ja) * | 2017-06-15 | 2019-01-10 | 株式会社ミツトヨ | 受光装置およびこれを備えた光電式エンコーダ |
Also Published As
Publication number | Publication date |
---|---|
EP3124921B1 (de) | 2019-05-22 |
EP3124921A1 (de) | 2017-02-01 |
CN106404013B (zh) | 2020-08-28 |
US20170030743A1 (en) | 2017-02-02 |
CN106404013A (zh) | 2017-02-15 |
ES2742705T3 (es) | 2020-02-17 |
US10260909B2 (en) | 2019-04-16 |
DE102016208623A1 (de) | 2017-02-02 |
JP6889530B2 (ja) | 2021-06-18 |
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