JPWO2022244682A5 - - Google Patents
Info
- Publication number
- JPWO2022244682A5 JPWO2022244682A5 JP2023522626A JP2023522626A JPWO2022244682A5 JP WO2022244682 A5 JPWO2022244682 A5 JP WO2022244682A5 JP 2023522626 A JP2023522626 A JP 2023522626A JP 2023522626 A JP2023522626 A JP 2023522626A JP WO2022244682 A5 JPWO2022244682 A5 JP WO2022244682A5
- Authority
- JP
- Japan
- Prior art keywords
- forming
- composition
- monovalent
- different
- resist underlayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021084489 | 2021-05-19 | ||
| JP2021130468 | 2021-08-10 | ||
| PCT/JP2022/020145 WO2022244682A1 (ja) | 2021-05-19 | 2022-05-13 | 半導体基板の製造方法及びレジスト下層膜形成用組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022244682A1 JPWO2022244682A1 (https=) | 2022-11-24 |
| JPWO2022244682A5 true JPWO2022244682A5 (https=) | 2025-10-20 |
Family
ID=84140424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023522626A Pending JPWO2022244682A1 (https=) | 2021-05-19 | 2022-05-13 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240105451A1 (https=) |
| JP (1) | JPWO2022244682A1 (https=) |
| KR (1) | KR20240009413A (https=) |
| TW (1) | TW202248355A (https=) |
| WO (1) | WO2022244682A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12393118B2 (en) | 2021-05-28 | 2025-08-19 | Dupont Electronic Materials International, Llc | Composition for photoresist underlayer |
| JP7730680B2 (ja) * | 2021-07-07 | 2025-08-28 | 東レ・ファインケミカル株式会社 | ポリマ、その水溶液およびその製造方法 |
| JP7418488B2 (ja) * | 2022-04-12 | 2024-01-19 | 東京応化工業株式会社 | レジスト組成物、及びレジストパターン形成方法 |
| WO2023199881A1 (ja) * | 2022-04-13 | 2023-10-19 | Jsr株式会社 | 半導体基板の製造方法及びレジスト下層膜形成用組成物 |
| CN119301526A (zh) * | 2022-06-15 | 2025-01-10 | 日产化学株式会社 | 抗蚀剂下层膜形成用组合物 |
| WO2024053689A1 (ja) * | 2022-09-09 | 2024-03-14 | 東京応化工業株式会社 | レジスト組成物、およびレジストパターン形成方法 |
| JP7840895B2 (ja) | 2023-03-10 | 2026-04-06 | 信越化学工業株式会社 | 密着膜形成材料、パターン形成方法、及び密着膜の形成方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5618557B2 (ja) * | 2010-01-29 | 2014-11-05 | 富士フイルム株式会社 | 感活性光線性または感放射線性樹脂組成物、及び該組成物を用いたパターン形成方法 |
| WO2013141015A1 (ja) | 2012-03-23 | 2013-09-26 | 日産化学工業株式会社 | Ｅｕｖリソグラフィー用レジスト下層膜形成組成物 |
| JP6511931B2 (ja) * | 2014-07-02 | 2019-05-15 | Jsr株式会社 | レジスト下層膜形成用ポリシロキサン組成物及びパターン形成方法 |
| JP6550760B2 (ja) * | 2015-01-26 | 2019-07-31 | Jsr株式会社 | 多層レジストプロセス用レジスト下層膜形成組成物及びレジスト下層膜の形成方法 |
| WO2020067183A1 (ja) * | 2018-09-28 | 2020-04-02 | Jsr株式会社 | 多層レジストプロセス用下層膜形成組成物及びパターン形成方法 |
| US12510823B2 (en) * | 2019-05-08 | 2025-12-30 | Nissan Chemical Corporation | Resist underlayer film-forming composition containing alicyclic compound-terminated polymer |
| JP7373470B2 (ja) * | 2019-09-19 | 2023-11-02 | 信越化学工業株式会社 | ケイ素含有レジスト下層膜形成用組成物及びパターン形成方法 |
-
2022
- 2022-05-13 WO PCT/JP2022/020145 patent/WO2022244682A1/ja not_active Ceased
- 2022-05-13 TW TW111118114A patent/TW202248355A/zh unknown
- 2022-05-13 JP JP2023522626A patent/JPWO2022244682A1/ja active Pending
- 2022-05-13 KR KR1020237039409A patent/KR20240009413A/ko active Pending
-
2023
- 2023-11-15 US US18/509,611 patent/US20240105451A1/en active Pending
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