JPWO2023017728A5 - - Google Patents
Info
- Publication number
- JPWO2023017728A5 JPWO2023017728A5 JP2023541392A JP2023541392A JPWO2023017728A5 JP WO2023017728 A5 JPWO2023017728 A5 JP WO2023017728A5 JP 2023541392 A JP2023541392 A JP 2023541392A JP 2023541392 A JP2023541392 A JP 2023541392A JP WO2023017728 A5 JPWO2023017728 A5 JP WO2023017728A5
- Authority
- JP
- Japan
- Prior art keywords
- forming
- composition
- underlayer film
- resist underlayer
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021130632 | 2021-08-10 | ||
| PCT/JP2022/028778 WO2023017728A1 (ja) | 2021-08-10 | 2022-07-26 | 半導体基板の製造方法及びレジスト下層膜形成用組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023017728A1 JPWO2023017728A1 (https=) | 2023-02-16 |
| JPWO2023017728A5 true JPWO2023017728A5 (https=) | 2025-10-20 |
Family
ID=85200510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023541392A Pending JPWO2023017728A1 (https=) | 2021-08-10 | 2022-07-26 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240255852A1 (https=) |
| JP (1) | JPWO2023017728A1 (https=) |
| KR (1) | KR20240041932A (https=) |
| TW (1) | TWI911471B (https=) |
| WO (1) | WO2023017728A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102819800B1 (ko) * | 2022-09-28 | 2025-06-11 | 동우 화인켐 주식회사 | 하드마스크용 조성물 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100400243B1 (ko) * | 1999-06-26 | 2003-10-01 | 주식회사 하이닉스반도체 | 유기 반사방지 중합체 및 그의 제조방법 |
| KR20030068729A (ko) * | 2002-02-16 | 2003-08-25 | 삼성전자주식회사 | 반사 방지용 광흡수막 형성 조성물 및 이를 이용한 반도체소자의 패턴 형성 방법 |
| US7238462B2 (en) * | 2002-11-27 | 2007-07-03 | Tokyo Ohka Kogyo Co., Ltd. | Undercoating material for wiring, embedded material, and wiring formation method |
| JP3914491B2 (ja) * | 2002-11-27 | 2007-05-16 | 東京応化工業株式会社 | デュアルダマシン構造形成用埋め込み材料およびこれを用いたデュアルダマシン構造形成方法 |
| JP2007284535A (ja) * | 2006-04-14 | 2007-11-01 | Daicel Chem Ind Ltd | 重合体及びそれを用いた反射防止膜形成組成物 |
| WO2013141015A1 (ja) | 2012-03-23 | 2013-09-26 | 日産化学工業株式会社 | Ｅｕｖリソグラフィー用レジスト下層膜形成組成物 |
| JP6134603B2 (ja) * | 2013-08-02 | 2017-05-24 | 富士フイルム株式会社 | パターン形成方法、及び電子デバイスの製造方法 |
-
2022
- 2022-07-26 JP JP2023541392A patent/JPWO2023017728A1/ja active Pending
- 2022-07-26 WO PCT/JP2022/028778 patent/WO2023017728A1/ja not_active Ceased
- 2022-07-26 KR KR1020247003870A patent/KR20240041932A/ko active Pending
- 2022-08-01 TW TW111128765A patent/TWI911471B/zh active
-
2024
- 2024-02-07 US US18/435,001 patent/US20240255852A1/en active Pending
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