JPWO2023068075A5 - - Google Patents

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Publication number
JPWO2023068075A5
JPWO2023068075A5 JP2023554490A JP2023554490A JPWO2023068075A5 JP WO2023068075 A5 JPWO2023068075 A5 JP WO2023068075A5 JP 2023554490 A JP2023554490 A JP 2023554490A JP 2023554490 A JP2023554490 A JP 2023554490A JP WO2023068075 A5 JPWO2023068075 A5 JP WO2023068075A5
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JP
Japan
Prior art keywords
group
forming
composition
resist underlayer
underlayer film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023554490A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023068075A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/037579 external-priority patent/WO2023068075A1/ja
Publication of JPWO2023068075A1 publication Critical patent/JPWO2023068075A1/ja
Publication of JPWO2023068075A5 publication Critical patent/JPWO2023068075A5/ja
Pending legal-status Critical Current

Links

JP2023554490A 2021-10-19 2022-10-07 Pending JPWO2023068075A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021171110 2021-10-19
PCT/JP2022/037579 WO2023068075A1 (ja) 2021-10-19 2022-10-07 半導体基板の製造方法及びレジスト下層膜形成用組成物

Publications (2)

Publication Number Publication Date
JPWO2023068075A1 JPWO2023068075A1 (https=) 2023-04-27
JPWO2023068075A5 true JPWO2023068075A5 (https=) 2025-10-20

Family

ID=86058097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023554490A Pending JPWO2023068075A1 (https=) 2021-10-19 2022-10-07

Country Status (4)

Country Link
US (1) US20240288773A1 (https=)
JP (1) JPWO2023068075A1 (https=)
KR (1) KR20240088880A (https=)
WO (1) WO2023068075A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102819800B1 (ko) * 2022-09-28 2025-06-11 동우 화인켐 주식회사 하드마스크용 조성물
WO2026018754A1 (ja) * 2024-07-18 2026-01-22 Jsr株式会社 レジスト下層膜形成用組成物、半導体基板の製造方法及び重合体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5582316B2 (ja) * 2009-08-10 2014-09-03 日産化学工業株式会社 ポリマー型の光酸発生剤を含有するレジスト下層膜形成組成物及びそれを用いたレジストパターンの形成方法
JP5415982B2 (ja) * 2010-02-09 2014-02-12 信越化学工業株式会社 レジスト下層膜材料、パターン形成方法
JP2013007892A (ja) * 2011-06-24 2013-01-10 Fujifilm Corp 感活性光線性又は感放射線性樹脂組成物、並びに、それを用いた感活性光線性又は感放射線性樹脂膜及びパターン形成方法
JP5923312B2 (ja) * 2012-01-20 2016-05-24 東京応化工業株式会社 レジスト組成物及びレジストパターン形成方法
WO2013141015A1 (ja) 2012-03-23 2013-09-26 日産化学工業株式会社 Ｅｕｖリソグラフィー用レジスト下層膜形成組成物
JP6541508B2 (ja) * 2014-08-25 2019-07-10 住友化学株式会社 塩、樹脂、レジスト組成物及びレジストパターンの製造方法

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