JPWO2022230790A5 - - Google Patents
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- Publication number
- JPWO2022230790A5 JPWO2022230790A5 JP2023517495A JP2023517495A JPWO2022230790A5 JP WO2022230790 A5 JPWO2022230790 A5 JP WO2022230790A5 JP 2023517495 A JP2023517495 A JP 2023517495A JP 2023517495 A JP2023517495 A JP 2023517495A JP WO2022230790 A5 JPWO2022230790 A5 JP WO2022230790A5
- Authority
- JP
- Japan
- Prior art keywords
- resist
- film
- substrate
- metal oxide
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 27
- 229910044991 metal oxide Inorganic materials 0.000 claims 12
- 150000004706 metal oxides Chemical class 0.000 claims 12
- 239000004065 semiconductor Substances 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 9
- 239000002184 metal Substances 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 7
- 238000000034 method Methods 0.000 claims 6
- 238000000059 patterning Methods 0.000 claims 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 5
- 229910052760 oxygen Inorganic materials 0.000 claims 5
- 239000001301 oxygen Substances 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 4
- 230000003647 oxidation Effects 0.000 claims 4
- 238000007254 oxidation reaction Methods 0.000 claims 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- 239000005001 laminate film Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 125000000732 arylene group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 125000004093 cyano group Chemical group *C#N 0.000 claims 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 150000002391 heterocyclic compounds Chemical class 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims 1
- 239000007800 oxidant agent Substances 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021074152 | 2021-04-26 | ||
| PCT/JP2022/018653 WO2022230790A1 (ja) | 2021-04-26 | 2022-04-25 | レジストパターン形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022230790A1 JPWO2022230790A1 (https=) | 2022-11-03 |
| JPWO2022230790A5 true JPWO2022230790A5 (https=) | 2025-02-19 |
Family
ID=83847242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023517495A Pending JPWO2022230790A1 (https=) | 2021-04-26 | 2022-04-25 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240219834A1 (https=) |
| JP (1) | JPWO2022230790A1 (https=) |
| KR (1) | KR20240001312A (https=) |
| CN (1) | CN117178231A (https=) |
| TW (1) | TWI910343B (https=) |
| WO (1) | WO2022230790A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120826648A (zh) | 2023-03-17 | 2025-10-21 | 日产化学株式会社 | 用于形成i射线光刻用含硅抗蚀剂下层膜的组合物 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61243447A (ja) * | 1985-04-22 | 1986-10-29 | Asahi Chem Ind Co Ltd | パタ−ン形成方法 |
| JPH06120645A (ja) * | 1992-03-31 | 1994-04-28 | Toray Ind Inc | ポリイミド・パターンの形成方法 |
| JP2006154570A (ja) | 2004-11-30 | 2006-06-15 | Tokyo Ohka Kogyo Co Ltd | レジストパターンおよび導体パターンの製造方法 |
| JP6139225B2 (ja) * | 2013-04-04 | 2017-05-31 | 旭化成株式会社 | パターン付き基材及びその製造方法 |
| JP2014241183A (ja) * | 2013-05-13 | 2014-12-25 | 旭化成イーマテリアルズ株式会社 | ドライエッチング用積層体、モールドの製造方法及びモールド |
| TWI843863B (zh) * | 2019-06-17 | 2024-06-01 | 日商日產化學股份有限公司 | 含有具二氰基苯乙烯基之雜環化合物之可濕蝕刻之阻劑下層膜形成組成物、經圖案化的基板之製造方法、半導體裝置之製造方法 |
-
2022
- 2022-04-25 CN CN202280027313.9A patent/CN117178231A/zh active Pending
- 2022-04-25 TW TW111115589A patent/TWI910343B/zh active
- 2022-04-25 US US18/286,612 patent/US20240219834A1/en active Pending
- 2022-04-25 KR KR1020237028753A patent/KR20240001312A/ko active Pending
- 2022-04-25 WO PCT/JP2022/018653 patent/WO2022230790A1/ja not_active Ceased
- 2022-04-25 JP JP2023517495A patent/JPWO2022230790A1/ja active Pending
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