JPWO2022196132A5 - - Google Patents
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- JPWO2022196132A5 JPWO2022196132A5 JP2023506831A JP2023506831A JPWO2022196132A5 JP WO2022196132 A5 JPWO2022196132 A5 JP WO2022196132A5 JP 2023506831 A JP2023506831 A JP 2023506831A JP 2023506831 A JP2023506831 A JP 2023506831A JP WO2022196132 A5 JPWO2022196132 A5 JP WO2022196132A5
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- JP
- Japan
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021044168 | 2021-03-17 | ||
| JP2021044168 | 2021-03-17 | ||
| PCT/JP2022/003409 WO2022196132A1 (ja) | 2021-03-17 | 2022-01-28 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022196132A1 JPWO2022196132A1 (https=) | 2022-09-22 |
| JPWO2022196132A5 true JPWO2022196132A5 (https=) | 2023-05-16 |
| JP7364114B2 JP7364114B2 (ja) | 2023-10-18 |
Family
ID=83320325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023506831A Active JP7364114B2 (ja) | 2021-03-17 | 2022-01-28 | 半導体装置の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230207325A1 (https=) |
| JP (1) | JP7364114B2 (https=) |
| CN (1) | CN115996816A (https=) |
| WO (1) | WO2022196132A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115714082A (zh) * | 2022-10-31 | 2023-02-24 | 浙江丽水中欣晶圆半导体科技有限公司 | 提高硅片平坦度降低硅材料消耗的工艺 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4489016B2 (ja) * | 2002-12-10 | 2010-06-23 | 富士通株式会社 | 配線基板の形成方法、配線薄膜の形成方法及び基板処理装置 |
| JP4261260B2 (ja) * | 2003-06-26 | 2009-04-30 | 日東電工株式会社 | 半導体ウエハの研削方法および半導体ウエハ研削用粘着シート |
| JP2009021462A (ja) * | 2007-07-13 | 2009-01-29 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
| JP5912311B2 (ja) * | 2011-06-30 | 2016-04-27 | 株式会社ディスコ | 被加工物の研削方法 |
| JP5877663B2 (ja) * | 2011-07-07 | 2016-03-08 | 株式会社ディスコ | ウエーハの研削方法 |
| JP6129551B2 (ja) * | 2012-12-27 | 2017-05-17 | 株式会社ディスコ | 板状物の加工方法 |
| JP2014192204A (ja) | 2013-03-26 | 2014-10-06 | Furukawa Electric Co Ltd:The | 半導体ウエハ表面保護用粘着テープ及び半導体ウエハの加工方法 |
| CN106563980B (zh) * | 2015-10-12 | 2020-04-10 | 株式会社迪思科 | 磨削方法 |
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2022
- 2022-01-28 WO PCT/JP2022/003409 patent/WO2022196132A1/ja not_active Ceased
- 2022-01-28 CN CN202280005770.8A patent/CN115996816A/zh active Pending
- 2022-01-28 JP JP2023506831A patent/JP7364114B2/ja active Active
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2023
- 2023-02-27 US US18/175,535 patent/US20230207325A1/en active Pending