JPWO2022196132A1 - - Google Patents
Info
- Publication number
- JPWO2022196132A1 JPWO2022196132A1 JP2023506831A JP2023506831A JPWO2022196132A1 JP WO2022196132 A1 JPWO2022196132 A1 JP WO2022196132A1 JP 2023506831 A JP2023506831 A JP 2023506831A JP 2023506831 A JP2023506831 A JP 2023506831A JP WO2022196132 A1 JPWO2022196132 A1 JP WO2022196132A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Milling, Broaching, Filing, Reaming, And Others (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021044168 | 2021-03-17 | ||
| JP2021044168 | 2021-03-17 | ||
| PCT/JP2022/003409 WO2022196132A1 (ja) | 2021-03-17 | 2022-01-28 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022196132A1 true JPWO2022196132A1 (https=) | 2022-09-22 |
| JPWO2022196132A5 JPWO2022196132A5 (https=) | 2023-05-16 |
| JP7364114B2 JP7364114B2 (ja) | 2023-10-18 |
Family
ID=83320325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023506831A Active JP7364114B2 (ja) | 2021-03-17 | 2022-01-28 | 半導体装置の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230207325A1 (https=) |
| JP (1) | JP7364114B2 (https=) |
| CN (1) | CN115996816A (https=) |
| WO (1) | WO2022196132A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115714082A (zh) * | 2022-10-31 | 2023-02-24 | 浙江丽水中欣晶圆半导体科技有限公司 | 提高硅片平坦度降低硅材料消耗的工艺 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004053967A1 (ja) * | 2002-12-10 | 2004-06-24 | Fujitsu Limited | 半導体装置、配線基板の形成方法及び基板処理装置 |
| JP2005019666A (ja) * | 2003-06-26 | 2005-01-20 | Nitto Denko Corp | 半導体ウエハの研削方法および半導体ウエハ研削用粘着シート |
| JP2013012654A (ja) * | 2011-06-30 | 2013-01-17 | Disco Abrasive Syst Ltd | 被加工物の研削方法 |
| JP2014192204A (ja) * | 2013-03-26 | 2014-10-06 | Furukawa Electric Co Ltd:The | 半導体ウエハ表面保護用粘着テープ及び半導体ウエハの加工方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009021462A (ja) * | 2007-07-13 | 2009-01-29 | Disco Abrasive Syst Ltd | ウェーハの加工方法 |
| JP5877663B2 (ja) * | 2011-07-07 | 2016-03-08 | 株式会社ディスコ | ウエーハの研削方法 |
| JP6129551B2 (ja) * | 2012-12-27 | 2017-05-17 | 株式会社ディスコ | 板状物の加工方法 |
| CN106563980B (zh) * | 2015-10-12 | 2020-04-10 | 株式会社迪思科 | 磨削方法 |
-
2022
- 2022-01-28 WO PCT/JP2022/003409 patent/WO2022196132A1/ja not_active Ceased
- 2022-01-28 CN CN202280005770.8A patent/CN115996816A/zh active Pending
- 2022-01-28 JP JP2023506831A patent/JP7364114B2/ja active Active
-
2023
- 2023-02-27 US US18/175,535 patent/US20230207325A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004053967A1 (ja) * | 2002-12-10 | 2004-06-24 | Fujitsu Limited | 半導体装置、配線基板の形成方法及び基板処理装置 |
| JP2005019666A (ja) * | 2003-06-26 | 2005-01-20 | Nitto Denko Corp | 半導体ウエハの研削方法および半導体ウエハ研削用粘着シート |
| JP2013012654A (ja) * | 2011-06-30 | 2013-01-17 | Disco Abrasive Syst Ltd | 被加工物の研削方法 |
| JP2014192204A (ja) * | 2013-03-26 | 2014-10-06 | Furukawa Electric Co Ltd:The | 半導体ウエハ表面保護用粘着テープ及び半導体ウエハの加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7364114B2 (ja) | 2023-10-18 |
| US20230207325A1 (en) | 2023-06-29 |
| WO2022196132A1 (ja) | 2022-09-22 |
| CN115996816A (zh) | 2023-04-21 |
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