JP7364114B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP7364114B2
JP7364114B2 JP2023506831A JP2023506831A JP7364114B2 JP 7364114 B2 JP7364114 B2 JP 7364114B2 JP 2023506831 A JP2023506831 A JP 2023506831A JP 2023506831 A JP2023506831 A JP 2023506831A JP 7364114 B2 JP7364114 B2 JP 7364114B2
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JP
Japan
Prior art keywords
semiconductor substrate
grinding
protective tape
semiconductor device
grinding step
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2023506831A
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English (en)
Japanese (ja)
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JPWO2022196132A5 (https=
JPWO2022196132A1 (https=
Inventor
三千矢 北野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of JPWO2022196132A1 publication Critical patent/JPWO2022196132A1/ja
Publication of JPWO2022196132A5 publication Critical patent/JPWO2022196132A5/ja
Application granted granted Critical
Publication of JP7364114B2 publication Critical patent/JP7364114B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Milling, Broaching, Filing, Reaming, And Others (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2023506831A 2021-03-17 2022-01-28 半導体装置の製造方法 Active JP7364114B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021044168 2021-03-17
JP2021044168 2021-03-17
PCT/JP2022/003409 WO2022196132A1 (ja) 2021-03-17 2022-01-28 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022196132A1 JPWO2022196132A1 (https=) 2022-09-22
JPWO2022196132A5 JPWO2022196132A5 (https=) 2023-05-16
JP7364114B2 true JP7364114B2 (ja) 2023-10-18

Family

ID=83320325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023506831A Active JP7364114B2 (ja) 2021-03-17 2022-01-28 半導体装置の製造方法

Country Status (4)

Country Link
US (1) US20230207325A1 (https=)
JP (1) JP7364114B2 (https=)
CN (1) CN115996816A (https=)
WO (1) WO2022196132A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115714082A (zh) * 2022-10-31 2023-02-24 浙江丽水中欣晶圆半导体科技有限公司 提高硅片平坦度降低硅材料消耗的工艺

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192204A (ja) 2013-03-26 2014-10-06 Furukawa Electric Co Ltd:The 半導体ウエハ表面保護用粘着テープ及び半導体ウエハの加工方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4489016B2 (ja) * 2002-12-10 2010-06-23 富士通株式会社 配線基板の形成方法、配線薄膜の形成方法及び基板処理装置
JP4261260B2 (ja) * 2003-06-26 2009-04-30 日東電工株式会社 半導体ウエハの研削方法および半導体ウエハ研削用粘着シート
JP2009021462A (ja) * 2007-07-13 2009-01-29 Disco Abrasive Syst Ltd ウェーハの加工方法
JP5912311B2 (ja) * 2011-06-30 2016-04-27 株式会社ディスコ 被加工物の研削方法
JP5877663B2 (ja) * 2011-07-07 2016-03-08 株式会社ディスコ ウエーハの研削方法
JP6129551B2 (ja) * 2012-12-27 2017-05-17 株式会社ディスコ 板状物の加工方法
CN106563980B (zh) * 2015-10-12 2020-04-10 株式会社迪思科 磨削方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192204A (ja) 2013-03-26 2014-10-06 Furukawa Electric Co Ltd:The 半導体ウエハ表面保護用粘着テープ及び半導体ウエハの加工方法

Also Published As

Publication number Publication date
US20230207325A1 (en) 2023-06-29
JPWO2022196132A1 (https=) 2022-09-22
WO2022196132A1 (ja) 2022-09-22
CN115996816A (zh) 2023-04-21

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