JPWO2022149565A5 - - Google Patents
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- Publication number
- JPWO2022149565A5 JPWO2022149565A5 JP2022574047A JP2022574047A JPWO2022149565A5 JP WO2022149565 A5 JPWO2022149565 A5 JP WO2022149565A5 JP 2022574047 A JP2022574047 A JP 2022574047A JP 2022574047 A JP2022574047 A JP 2022574047A JP WO2022149565 A5 JPWO2022149565 A5 JP WO2022149565A5
- Authority
- JP
- Japan
- Prior art keywords
- wet etching
- etching solution
- metal layer
- solution
- based material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims 15
- 238000001039 wet etching Methods 0.000 claims 14
- 229910052751 metal Inorganic materials 0.000 claims 13
- 239000002184 metal Substances 0.000 claims 13
- 238000005530 etching Methods 0.000 claims 10
- 239000000463 material Substances 0.000 claims 8
- 238000000034 method Methods 0.000 claims 8
- 239000004065 semiconductor Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000007800 oxidant agent Substances 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 4
- 229910017052 cobalt Inorganic materials 0.000 claims 4
- 239000010941 cobalt Substances 0.000 claims 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- 239000007789 gas Substances 0.000 claims 4
- 239000001301 oxygen Substances 0.000 claims 4
- 229910052760 oxygen Inorganic materials 0.000 claims 4
- 239000002253 acid Substances 0.000 claims 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims 2
- 239000003960 organic solvent Substances 0.000 claims 2
- 239000002344 surface layer Substances 0.000 claims 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- 238000007872 degassing Methods 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 150000002978 peroxides Chemical class 0.000 claims 1
- 239000005368 silicate glass Substances 0.000 claims 1
- 239000002210 silicon-based material Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021001370 | 2021-01-07 | ||
| PCT/JP2022/000013 WO2022149565A1 (ja) | 2021-01-07 | 2022-01-04 | ウェットエッチング溶液及びウェットエッチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022149565A1 JPWO2022149565A1 (https=) | 2022-07-14 |
| JPWO2022149565A5 true JPWO2022149565A5 (https=) | 2024-09-27 |
Family
ID=82357772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022574047A Pending JPWO2022149565A1 (https=) | 2021-01-07 | 2022-01-04 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240055273A1 (https=) |
| JP (1) | JPWO2022149565A1 (https=) |
| KR (1) | KR20230125832A (https=) |
| CN (1) | CN116710597A (https=) |
| TW (1) | TW202235683A (https=) |
| WO (1) | WO2022149565A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024048382A1 (https=) * | 2022-08-31 | 2024-03-07 | ||
| TWI895691B (zh) * | 2023-02-14 | 2025-09-01 | 關東鑫林科技股份有限公司 | 蝕刻液組成物及使用其之蝕刻方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5523325U (https=) | 1978-07-28 | 1980-02-15 | ||
| JPH0793289B2 (ja) * | 1991-04-01 | 1995-10-09 | エアー．プロダクツ．アンド．ケミカルス．インコーポレーテッド | 金属表面の蒸気相エッチング法 |
| US5782986A (en) * | 1996-01-11 | 1998-07-21 | Fsi International | Process for metals removal using beta-diketone or beta-ketoimine ligand forming compounds |
| US5939334A (en) * | 1997-05-22 | 1999-08-17 | Sharp Laboratories Of America, Inc. | System and method of selectively cleaning copper substrate surfaces, in-situ, to remove copper oxides |
| EP1673802A1 (en) * | 2003-10-14 | 2006-06-28 | EKC Technology, INC. | REMOVAL OF POST ETCH RESIDUES AND COPPER CONTAMINATION FROM LOW-K DIELECTRICS USING SUPERCRITICAL CO sb 2 /sb WITH DIKETONE ADDITIVES |
| WO2006103751A1 (ja) | 2005-03-29 | 2006-10-05 | Mitsubishi Chemical Corporation | 銅エッチング液及びエッチング方法 |
| US8025811B2 (en) | 2006-03-29 | 2011-09-27 | Intel Corporation | Composition for etching a metal hard mask material in semiconductor processing |
| JP2014093407A (ja) | 2012-11-02 | 2014-05-19 | Fujifilm Corp | エッチング液、これを用いたエッチング方法及び半導体素子の製造方法 |
| JP6761166B2 (ja) * | 2015-07-23 | 2020-09-23 | セントラル硝子株式会社 | ウェットエッチング方法及びエッチング液 |
| JP7034645B2 (ja) | 2017-09-22 | 2022-03-14 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
-
2022
- 2022-01-04 JP JP2022574047A patent/JPWO2022149565A1/ja active Pending
- 2022-01-04 WO PCT/JP2022/000013 patent/WO2022149565A1/ja not_active Ceased
- 2022-01-04 US US18/271,185 patent/US20240055273A1/en not_active Abandoned
- 2022-01-04 KR KR1020237026229A patent/KR20230125832A/ko not_active Withdrawn
- 2022-01-04 CN CN202280009029.9A patent/CN116710597A/zh active Pending
- 2022-01-07 TW TW111100786A patent/TW202235683A/zh unknown
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