JPWO2022107719A5 - - Google Patents
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- Publication number
- JPWO2022107719A5 JPWO2022107719A5 JP2022563740A JP2022563740A JPWO2022107719A5 JP WO2022107719 A5 JPWO2022107719 A5 JP WO2022107719A5 JP 2022563740 A JP2022563740 A JP 2022563740A JP 2022563740 A JP2022563740 A JP 2022563740A JP WO2022107719 A5 JPWO2022107719 A5 JP WO2022107719A5
- Authority
- JP
- Japan
- Prior art keywords
- wall
- electronic component
- mounting board
- disposed
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020192498 | 2020-11-19 | ||
| JP2020192498 | 2020-11-19 | ||
| PCT/JP2021/041912 WO2022107719A1 (ja) | 2020-11-19 | 2021-11-15 | 実装基板、及び回路基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022107719A1 JPWO2022107719A1 (https=) | 2022-05-27 |
| JPWO2022107719A5 true JPWO2022107719A5 (https=) | 2024-09-27 |
| JP7779853B2 JP7779853B2 (ja) | 2025-12-03 |
Family
ID=81708012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022563740A Active JP7779853B2 (ja) | 2020-11-19 | 2021-11-15 | 実装基板、及び回路基板 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12439519B2 (https=) |
| JP (1) | JP7779853B2 (https=) |
| KR (2) | KR102908056B1 (https=) |
| CN (1) | CN116569325A (https=) |
| DE (1) | DE112021005387T5 (https=) |
| TW (1) | TWI826866B (https=) |
| WO (1) | WO2022107719A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025083786A (ja) * | 2023-11-21 | 2025-06-02 | Tdk株式会社 | 回路基板、及び実装基板の製造方法 |
| JP2025083787A (ja) * | 2023-11-21 | 2025-06-02 | Tdk株式会社 | 回路基板、及び実装基板の製造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55132951U (https=) * | 1979-03-14 | 1980-09-20 | ||
| JP2725637B2 (ja) * | 1995-05-31 | 1998-03-11 | 日本電気株式会社 | 電子回路装置およびその製造方法 |
| US6570259B2 (en) * | 2001-03-22 | 2003-05-27 | International Business Machines Corporation | Apparatus to reduce thermal fatigue stress on flip chip solder connections |
| JP2003197822A (ja) | 2001-12-25 | 2003-07-11 | Sony Corp | 配線基板、多層配線基板およびそれらの製造方法 |
| JP4876523B2 (ja) * | 2005-10-14 | 2012-02-15 | 日本電気株式会社 | 半導体チップの実装構造 |
| JP4364865B2 (ja) * | 2005-11-24 | 2009-11-18 | Ｔｄｋ株式会社 | 電子部品 |
| JP6623056B2 (ja) * | 2015-12-16 | 2019-12-18 | 新光電気工業株式会社 | 配線基板、半導体装置 |
| TWI698968B (zh) | 2016-07-04 | 2020-07-11 | 大陸商蘇州晶方半導體科技股份有限公司 | 封裝結構以及封裝方法 |
| KR20180032985A (ko) * | 2016-09-23 | 2018-04-02 | 삼성전자주식회사 | 집적회로 패키지 및 그 제조 방법과 집적회로 패키지를 포함하는 웨어러블 디바이스 |
| CN109216527B (zh) * | 2017-07-06 | 2023-08-15 | 日亚化学工业株式会社 | 发光装置 |
| KR102589683B1 (ko) * | 2018-11-16 | 2023-10-16 | 삼성전자주식회사 | 팬-아웃 반도체 패키지 |
| KR102662556B1 (ko) * | 2018-11-29 | 2024-05-03 | 삼성전자주식회사 | 패키지 모듈 |
-
2021
- 2021-11-15 CN CN202180077763.4A patent/CN116569325A/zh active Pending
- 2021-11-15 US US18/037,130 patent/US12439519B2/en active Active
- 2021-11-15 KR KR1020237018238A patent/KR102908056B1/ko active Active
- 2021-11-15 WO PCT/JP2021/041912 patent/WO2022107719A1/ja not_active Ceased
- 2021-11-15 DE DE112021005387.6T patent/DE112021005387T5/de active Pending
- 2021-11-15 JP JP2022563740A patent/JP7779853B2/ja active Active
- 2021-11-15 KR KR1020257030090A patent/KR20250139410A/ko active Pending
- 2021-11-18 TW TW110142930A patent/TWI826866B/zh active
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