JPS55132951U - - Google Patents
Info
- Publication number
- JPS55132951U JPS55132951U JP1979031792U JP3179279U JPS55132951U JP S55132951 U JPS55132951 U JP S55132951U JP 1979031792 U JP1979031792 U JP 1979031792U JP 3179279 U JP3179279 U JP 3179279U JP S55132951 U JPS55132951 U JP S55132951U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979031792U JPS55132951U (https=) | 1979-03-14 | 1979-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979031792U JPS55132951U (https=) | 1979-03-14 | 1979-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55132951U true JPS55132951U (https=) | 1980-09-20 |
Family
ID=28884045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979031792U Pending JPS55132951U (https=) | 1979-03-14 | 1979-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55132951U (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022107719A1 (ja) * | 2020-11-19 | 2022-05-27 | Tdk株式会社 | 実装基板、及び回路基板 |
-
1979
- 1979-03-14 JP JP1979031792U patent/JPS55132951U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022107719A1 (ja) * | 2020-11-19 | 2022-05-27 | Tdk株式会社 | 実装基板、及び回路基板 |
| JPWO2022107719A1 (https=) * | 2020-11-19 | 2022-05-27 | ||
| US12439519B2 (en) | 2020-11-19 | 2025-10-07 | Tdk Corporation | Mounting board and circuit board |