JPWO2022043811A5 - - Google Patents

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Publication number
JPWO2022043811A5
JPWO2022043811A5 JP2022544876A JP2022544876A JPWO2022043811A5 JP WO2022043811 A5 JPWO2022043811 A5 JP WO2022043811A5 JP 2022544876 A JP2022544876 A JP 2022544876A JP 2022544876 A JP2022544876 A JP 2022544876A JP WO2022043811 A5 JPWO2022043811 A5 JP WO2022043811A5
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JP
Japan
Prior art keywords
insulator
heat treatment
depositing
oxide
temperature
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Application number
JP2022544876A
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English (en)
Japanese (ja)
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JP7778703B2 (ja
JPWO2022043811A1 (https=
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Priority claimed from PCT/IB2021/057429 external-priority patent/WO2022043811A1/ja
Publication of JPWO2022043811A1 publication Critical patent/JPWO2022043811A1/ja
Publication of JPWO2022043811A5 publication Critical patent/JPWO2022043811A5/ja
Priority to JP2025197886A priority Critical patent/JP2026020276A/ja
Application granted granted Critical
Publication of JP7778703B2 publication Critical patent/JP7778703B2/ja
Active legal-status Critical Current
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JP2022544876A 2020-08-27 2021-08-12 半導体装置の作製方法 Active JP7778703B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025197886A JP2026020276A (ja) 2020-08-27 2025-11-19 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020143897 2020-08-27
JP2020143897 2020-08-27
PCT/IB2021/057429 WO2022043811A1 (ja) 2020-08-27 2021-08-12 半導体装置の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025197886A Division JP2026020276A (ja) 2020-08-27 2025-11-19 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JPWO2022043811A1 JPWO2022043811A1 (https=) 2022-03-03
JPWO2022043811A5 true JPWO2022043811A5 (https=) 2024-08-14
JP7778703B2 JP7778703B2 (ja) 2025-12-02

Family

ID=80354725

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022544876A Active JP7778703B2 (ja) 2020-08-27 2021-08-12 半導体装置の作製方法
JP2025197886A Pending JP2026020276A (ja) 2020-08-27 2025-11-19 半導体装置の作製方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025197886A Pending JP2026020276A (ja) 2020-08-27 2025-11-19 半導体装置の作製方法

Country Status (5)

Country Link
US (1) US20240063028A1 (https=)
JP (2) JP7778703B2 (https=)
KR (1) KR20230056695A (https=)
CN (1) CN115968502A (https=)
WO (1) WO2022043811A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101470811B1 (ko) * 2009-09-16 2014-12-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101870119B1 (ko) 2009-12-25 2018-06-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
CN107947763B (zh) 2010-08-06 2021-12-28 株式会社半导体能源研究所 半导体集成电路
US9461126B2 (en) * 2013-09-13 2016-10-04 Semiconductor Energy Laboratory Co., Ltd. Transistor, clocked inverter circuit, sequential circuit, and semiconductor device including sequential circuit
JP6985812B2 (ja) * 2016-05-04 2021-12-22 株式会社半導体エネルギー研究所 トランジスタの作製方法
US11610997B2 (en) * 2017-11-24 2023-03-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor material and semiconductor device having a metal element and nitrogen
JP7344869B2 (ja) * 2018-06-29 2023-09-14 株式会社半導体エネルギー研究所 半導体装置の作製方法

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