JP2018073995A5 - - Google Patents
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- Publication number
- JP2018073995A5 JP2018073995A5 JP2016212174A JP2016212174A JP2018073995A5 JP 2018073995 A5 JP2018073995 A5 JP 2018073995A5 JP 2016212174 A JP2016212174 A JP 2016212174A JP 2016212174 A JP2016212174 A JP 2016212174A JP 2018073995 A5 JP2018073995 A5 JP 2018073995A5
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- oxide
- conductor
- semiconductor device
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000012212 insulator Substances 0.000 claims 54
- 239000004020 conductor Substances 0.000 claims 27
- 239000004065 semiconductor Substances 0.000 claims 19
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 10
- 238000000034 method Methods 0.000 claims 8
- 229910052757 nitrogen Inorganic materials 0.000 claims 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 4
- 239000001257 hydrogen Substances 0.000 claims 4
- 229910052739 hydrogen Inorganic materials 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000001312 dry etching Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 229910000449 hafnium oxide Inorganic materials 0.000 claims 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016212174A JP2018073995A (ja) | 2016-10-28 | 2016-10-28 | 半導体装置、および半導体装置の作製方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016212174A JP2018073995A (ja) | 2016-10-28 | 2016-10-28 | 半導体装置、および半導体装置の作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018073995A JP2018073995A (ja) | 2018-05-10 |
| JP2018073995A5 true JP2018073995A5 (https=) | 2019-12-05 |
Family
ID=62114444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016212174A Withdrawn JP2018073995A (ja) | 2016-10-28 | 2016-10-28 | 半導体装置、および半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2018073995A (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180066848A (ko) | 2016-12-09 | 2018-06-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 및 반도체 장치의 제작 방법 |
| WO2019077451A1 (ja) * | 2017-10-20 | 2019-04-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2020021383A1 (ja) * | 2018-07-27 | 2020-01-30 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US12105163B2 (en) | 2021-09-21 | 2024-10-01 | Tdk Corporation | Magnetic sensor |
-
2016
- 2016-10-28 JP JP2016212174A patent/JP2018073995A/ja not_active Withdrawn
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