CN115968502A - 半导体装置的制造方法 - Google Patents
半导体装置的制造方法 Download PDFInfo
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- CN115968502A CN115968502A CN202180050368.7A CN202180050368A CN115968502A CN 115968502 A CN115968502 A CN 115968502A CN 202180050368 A CN202180050368 A CN 202180050368A CN 115968502 A CN115968502 A CN 115968502A
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- insulator
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- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
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- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6329—Deposition from the gas or vapour phase using physical ablation of a target, e.g. physical vapour deposition or pulsed laser deposition
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- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6339—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD
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- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
- H10P14/6536—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light
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- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
- H10P14/6548—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by forming intermediate materials, e.g. capping layers or diffusion barriers
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- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69391—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing aluminium, e.g. Al2O3
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- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
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- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
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- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69396—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing at least one rare earth metal element, e.g. oxides of lanthanides, scandium or yttrium
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
- H10P14/3238—Materials thereof being insulating materials
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- Thin Film Transistor (AREA)
- Semiconductor Memories (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020143897 | 2020-08-27 | ||
| JP2020-143897 | 2020-08-27 | ||
| PCT/IB2021/057429 WO2022043811A1 (ja) | 2020-08-27 | 2021-08-12 | 半導体装置の作製方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115968502A true CN115968502A (zh) | 2023-04-14 |
Family
ID=80354725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180050368.7A Pending CN115968502A (zh) | 2020-08-27 | 2021-08-12 | 半导体装置的制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240063028A1 (https=) |
| JP (2) | JP7778703B2 (https=) |
| KR (1) | KR20230056695A (https=) |
| CN (1) | CN115968502A (https=) |
| WO (1) | WO2022043811A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101470811B1 (ko) * | 2009-09-16 | 2014-12-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101870119B1 (ko) | 2009-12-25 | 2018-06-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN107947763B (zh) | 2010-08-06 | 2021-12-28 | 株式会社半导体能源研究所 | 半导体集成电路 |
| US9461126B2 (en) * | 2013-09-13 | 2016-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Transistor, clocked inverter circuit, sequential circuit, and semiconductor device including sequential circuit |
| JP6985812B2 (ja) * | 2016-05-04 | 2021-12-22 | 株式会社半導体エネルギー研究所 | トランジスタの作製方法 |
| US11610997B2 (en) * | 2017-11-24 | 2023-03-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor material and semiconductor device having a metal element and nitrogen |
| JP7344869B2 (ja) * | 2018-06-29 | 2023-09-14 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
-
2021
- 2021-08-12 CN CN202180050368.7A patent/CN115968502A/zh active Pending
- 2021-08-12 KR KR1020237007853A patent/KR20230056695A/ko active Pending
- 2021-08-12 WO PCT/IB2021/057429 patent/WO2022043811A1/ja not_active Ceased
- 2021-08-12 JP JP2022544876A patent/JP7778703B2/ja active Active
- 2021-08-12 US US18/022,625 patent/US20240063028A1/en active Pending
-
2025
- 2025-11-19 JP JP2025197886A patent/JP2026020276A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7778703B2 (ja) | 2025-12-02 |
| JP2026020276A (ja) | 2026-02-06 |
| KR20230056695A (ko) | 2023-04-27 |
| JPWO2022043811A1 (https=) | 2022-03-03 |
| WO2022043811A1 (ja) | 2022-03-03 |
| US20240063028A1 (en) | 2024-02-22 |
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