JPWO2021256410A5 - - Google Patents

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Publication number
JPWO2021256410A5
JPWO2021256410A5 JP2022531784A JP2022531784A JPWO2021256410A5 JP WO2021256410 A5 JPWO2021256410 A5 JP WO2021256410A5 JP 2022531784 A JP2022531784 A JP 2022531784A JP 2022531784 A JP2022531784 A JP 2022531784A JP WO2021256410 A5 JPWO2021256410 A5 JP WO2021256410A5
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JP
Japan
Prior art keywords
external electrode
resin
electrode layer
end surface
protrusions
Prior art date
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Application number
JP2022531784A
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English (en)
Japanese (ja)
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JPWO2021256410A1 (https=
JP7435775B2 (ja
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Priority claimed from PCT/JP2021/022437 external-priority patent/WO2021256410A1/ja
Publication of JPWO2021256410A1 publication Critical patent/JPWO2021256410A1/ja
Publication of JPWO2021256410A5 publication Critical patent/JPWO2021256410A5/ja
Application granted granted Critical
Publication of JP7435775B2 publication Critical patent/JP7435775B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022531784A 2020-06-16 2021-06-14 電子部品及び電子部品の製造方法 Active JP7435775B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020103933 2020-06-16
JP2020103933 2020-06-16
PCT/JP2021/022437 WO2021256410A1 (ja) 2020-06-16 2021-06-14 電子部品及び電子部品の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021256410A1 JPWO2021256410A1 (https=) 2021-12-23
JPWO2021256410A5 true JPWO2021256410A5 (https=) 2023-02-16
JP7435775B2 JP7435775B2 (ja) 2024-02-21

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ID=79268004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022531784A Active JP7435775B2 (ja) 2020-06-16 2021-06-14 電子部品及び電子部品の製造方法

Country Status (3)

Country Link
US (1) US12217916B2 (https=)
JP (1) JP7435775B2 (https=)
WO (1) WO2021256410A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023190050A1 (ja) * 2022-03-29 2023-10-05 株式会社村田製作所 固体電解コンデンサ
KR20250049742A (ko) * 2023-10-05 2025-04-14 삼성전기주식회사 적층형 전자 부품
WO2025164005A1 (ja) * 2024-02-01 2025-08-07 株式会社村田製作所 積層セラミックコンデンサ
WO2025203502A1 (ja) * 2024-03-28 2025-10-02 株式会社村田製作所 積層セラミックコンデンサ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770425B2 (ja) * 1987-09-18 1995-07-31 松下電器産業株式会社 コンデンサの製造方法
JP2873345B2 (ja) * 1990-02-26 1999-03-24 株式会社トーキン セラミック部品の外部電極の製造方法
JPH07201686A (ja) * 1993-12-28 1995-08-04 Matsushita Electric Ind Co Ltd 面実装型電子部品の端面電極形成方法
US6563693B2 (en) * 2001-07-02 2003-05-13 Matsushita Electric Industrial Co., Ltd. Solid electrolytic capacitor
JP2006147901A (ja) * 2004-11-22 2006-06-08 Murata Mfg Co Ltd 積層電子部品、その製造方法およびその特性測定方法
JP5206440B2 (ja) * 2009-01-16 2013-06-12 Ｔｄｋ株式会社 セラミック電子部品
JP2012004480A (ja) 2010-06-21 2012-01-05 Tdk Corp 電子部品の製造方法及び電子部品
CN105531776A (zh) 2013-09-11 2016-04-27 株式会社村田制作所 电子元器件的外部电极形成方法
KR101474168B1 (ko) * 2013-11-15 2014-12-17 삼성전기주식회사 적층 세라믹 전자부품 및 그 실장기판
JP6798560B2 (ja) 2016-10-17 2020-12-09 株式会社村田製作所 固体電解コンデンサ
JP2018182039A (ja) * 2017-04-12 2018-11-15 太陽誘電株式会社 積層セラミックコンデンサ及びその製造方法
US10347425B2 (en) * 2017-05-04 2019-07-09 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and board having the same

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