JP7435775B2 - 電子部品及び電子部品の製造方法 - Google Patents

電子部品及び電子部品の製造方法 Download PDF

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Publication number
JP7435775B2
JP7435775B2 JP2022531784A JP2022531784A JP7435775B2 JP 7435775 B2 JP7435775 B2 JP 7435775B2 JP 2022531784 A JP2022531784 A JP 2022531784A JP 2022531784 A JP2022531784 A JP 2022531784A JP 7435775 B2 JP7435775 B2 JP 7435775B2
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Japan
Prior art keywords
resin
electrode layer
layer
external electrode
end surface
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JP2022531784A
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English (en)
Japanese (ja)
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JPWO2021256410A5 (https=
JPWO2021256410A1 (https=
Inventor
康浩 玉谷
和哉 楠田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication of JPWO2021256410A5 publication Critical patent/JPWO2021256410A5/ja
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/008Terminals
    • H01G9/012Terminals specially adapted for solid capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0029Processes of manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2022531784A 2020-06-16 2021-06-14 電子部品及び電子部品の製造方法 Active JP7435775B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020103933 2020-06-16
JP2020103933 2020-06-16
PCT/JP2021/022437 WO2021256410A1 (ja) 2020-06-16 2021-06-14 電子部品及び電子部品の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021256410A1 JPWO2021256410A1 (https=) 2021-12-23
JPWO2021256410A5 JPWO2021256410A5 (https=) 2023-02-16
JP7435775B2 true JP7435775B2 (ja) 2024-02-21

Family

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Family Applications (1)

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JP2022531784A Active JP7435775B2 (ja) 2020-06-16 2021-06-14 電子部品及び電子部品の製造方法

Country Status (3)

Country Link
US (1) US12217916B2 (https=)
JP (1) JP7435775B2 (https=)
WO (1) WO2021256410A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023190050A1 (ja) * 2022-03-29 2023-10-05 株式会社村田製作所 固体電解コンデンサ
KR20250049742A (ko) * 2023-10-05 2025-04-14 삼성전기주식회사 적층형 전자 부품
WO2025164005A1 (ja) * 2024-02-01 2025-08-07 株式会社村田製作所 積層セラミックコンデンサ
WO2025203502A1 (ja) * 2024-03-28 2025-10-02 株式会社村田製作所 積層セラミックコンデンサ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006147901A (ja) 2004-11-22 2006-06-08 Murata Mfg Co Ltd 積層電子部品、その製造方法およびその特性測定方法
WO2015037394A1 (ja) 2013-09-11 2015-03-19 株式会社村田製作所 電子部品の外部電極形成方法
JP2015097248A (ja) 2013-11-15 2015-05-21 サムソン エレクトロ−メカニックス カンパニーリミテッド. 積層セラミック電子部品及びその実装基板
WO2018074408A1 (ja) 2016-10-17 2018-04-26 株式会社村田製作所 固体電解コンデンサ
JP2018182039A (ja) 2017-04-12 2018-11-15 太陽誘電株式会社 積層セラミックコンデンサ及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770425B2 (ja) * 1987-09-18 1995-07-31 松下電器産業株式会社 コンデンサの製造方法
JP2873345B2 (ja) * 1990-02-26 1999-03-24 株式会社トーキン セラミック部品の外部電極の製造方法
JPH07201686A (ja) * 1993-12-28 1995-08-04 Matsushita Electric Ind Co Ltd 面実装型電子部品の端面電極形成方法
US6563693B2 (en) * 2001-07-02 2003-05-13 Matsushita Electric Industrial Co., Ltd. Solid electrolytic capacitor
JP5206440B2 (ja) * 2009-01-16 2013-06-12 Tdk株式会社 セラミック電子部品
JP2012004480A (ja) 2010-06-21 2012-01-05 Tdk Corp 電子部品の製造方法及び電子部品
US10347425B2 (en) * 2017-05-04 2019-07-09 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and board having the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006147901A (ja) 2004-11-22 2006-06-08 Murata Mfg Co Ltd 積層電子部品、その製造方法およびその特性測定方法
WO2015037394A1 (ja) 2013-09-11 2015-03-19 株式会社村田製作所 電子部品の外部電極形成方法
JP2015097248A (ja) 2013-11-15 2015-05-21 サムソン エレクトロ−メカニックス カンパニーリミテッド. 積層セラミック電子部品及びその実装基板
WO2018074408A1 (ja) 2016-10-17 2018-04-26 株式会社村田製作所 固体電解コンデンサ
JP2018182039A (ja) 2017-04-12 2018-11-15 太陽誘電株式会社 積層セラミックコンデンサ及びその製造方法

Also Published As

Publication number Publication date
US12217916B2 (en) 2025-02-04
JPWO2021256410A1 (https=) 2021-12-23
US20230119320A1 (en) 2023-04-20
WO2021256410A1 (ja) 2021-12-23

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