JP7435775B2 - 電子部品及び電子部品の製造方法 - Google Patents
電子部品及び電子部品の製造方法 Download PDFInfo
- Publication number
- JP7435775B2 JP7435775B2 JP2022531784A JP2022531784A JP7435775B2 JP 7435775 B2 JP7435775 B2 JP 7435775B2 JP 2022531784 A JP2022531784 A JP 2022531784A JP 2022531784 A JP2022531784 A JP 2022531784A JP 7435775 B2 JP7435775 B2 JP 7435775B2
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- resin
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- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 239000011347 resin Substances 0.000 claims description 467
- 229920005989 resin Polymers 0.000 claims description 467
- 238000007747 plating Methods 0.000 claims description 226
- 239000003990 capacitor Substances 0.000 claims description 88
- 238000000034 method Methods 0.000 claims description 79
- 238000007650 screen-printing Methods 0.000 claims description 43
- 239000000919 ceramic Substances 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 16
- 230000009974 thixotropic effect Effects 0.000 claims description 10
- 239000003792 electrolyte Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 590
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 96
- 239000000463 material Substances 0.000 description 60
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 52
- 229910052709 silver Inorganic materials 0.000 description 52
- 239000004332 silver Substances 0.000 description 52
- 229910052759 nickel Inorganic materials 0.000 description 50
- 229910052751 metal Inorganic materials 0.000 description 43
- 239000002184 metal Substances 0.000 description 43
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 22
- 229910052718 tin Inorganic materials 0.000 description 22
- 238000000605 extraction Methods 0.000 description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 18
- 239000010949 copper Substances 0.000 description 18
- 239000007784 solid electrolyte Substances 0.000 description 18
- 238000000576 coating method Methods 0.000 description 14
- 239000011888 foil Substances 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000003985 ceramic capacitor Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 11
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- 238000007639 printing Methods 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 239000002356 single layer Substances 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- -1 poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000011135 tin Substances 0.000 description 6
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- 238000001035 drying Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- 229910021389 graphene Inorganic materials 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 150000002815 nickel Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
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- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- ZUAURMBNZUCEAF-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethanol Chemical compound OCCOCCOC1=CC=CC=C1 ZUAURMBNZUCEAF-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 2
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 2
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229920000144 PEDOT:PSS Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000000550 scanning electron microscopy energy dispersive X-ray spectroscopy Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 150000003577 thiophenes Chemical class 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020103933 | 2020-06-16 | ||
| JP2020103933 | 2020-06-16 | ||
| PCT/JP2021/022437 WO2021256410A1 (ja) | 2020-06-16 | 2021-06-14 | 電子部品及び電子部品の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021256410A1 JPWO2021256410A1 (https=) | 2021-12-23 |
| JPWO2021256410A5 JPWO2021256410A5 (https=) | 2023-02-16 |
| JP7435775B2 true JP7435775B2 (ja) | 2024-02-21 |
Family
ID=79268004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022531784A Active JP7435775B2 (ja) | 2020-06-16 | 2021-06-14 | 電子部品及び電子部品の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12217916B2 (https=) |
| JP (1) | JP7435775B2 (https=) |
| WO (1) | WO2021256410A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023190050A1 (ja) * | 2022-03-29 | 2023-10-05 | 株式会社村田製作所 | 固体電解コンデンサ |
| KR20250049742A (ko) * | 2023-10-05 | 2025-04-14 | 삼성전기주식회사 | 적층형 전자 부품 |
| WO2025164005A1 (ja) * | 2024-02-01 | 2025-08-07 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| WO2025203502A1 (ja) * | 2024-03-28 | 2025-10-02 | 株式会社村田製作所 | 積層セラミックコンデンサ |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006147901A (ja) | 2004-11-22 | 2006-06-08 | Murata Mfg Co Ltd | 積層電子部品、その製造方法およびその特性測定方法 |
| WO2015037394A1 (ja) | 2013-09-11 | 2015-03-19 | 株式会社村田製作所 | 電子部品の外部電極形成方法 |
| JP2015097248A (ja) | 2013-11-15 | 2015-05-21 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層セラミック電子部品及びその実装基板 |
| WO2018074408A1 (ja) | 2016-10-17 | 2018-04-26 | 株式会社村田製作所 | 固体電解コンデンサ |
| JP2018182039A (ja) | 2017-04-12 | 2018-11-15 | 太陽誘電株式会社 | 積層セラミックコンデンサ及びその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0770425B2 (ja) * | 1987-09-18 | 1995-07-31 | 松下電器産業株式会社 | コンデンサの製造方法 |
| JP2873345B2 (ja) * | 1990-02-26 | 1999-03-24 | 株式会社トーキン | セラミック部品の外部電極の製造方法 |
| JPH07201686A (ja) * | 1993-12-28 | 1995-08-04 | Matsushita Electric Ind Co Ltd | 面実装型電子部品の端面電極形成方法 |
| US6563693B2 (en) * | 2001-07-02 | 2003-05-13 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitor |
| JP5206440B2 (ja) * | 2009-01-16 | 2013-06-12 | Tdk株式会社 | セラミック電子部品 |
| JP2012004480A (ja) | 2010-06-21 | 2012-01-05 | Tdk Corp | 電子部品の製造方法及び電子部品 |
| US10347425B2 (en) * | 2017-05-04 | 2019-07-09 | Samsung Electro-Mechanics Co., Ltd. | Multilayer electronic component and board having the same |
-
2021
- 2021-06-14 JP JP2022531784A patent/JP7435775B2/ja active Active
- 2021-06-14 WO PCT/JP2021/022437 patent/WO2021256410A1/ja not_active Ceased
-
2022
- 2022-12-14 US US18/065,917 patent/US12217916B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006147901A (ja) | 2004-11-22 | 2006-06-08 | Murata Mfg Co Ltd | 積層電子部品、その製造方法およびその特性測定方法 |
| WO2015037394A1 (ja) | 2013-09-11 | 2015-03-19 | 株式会社村田製作所 | 電子部品の外部電極形成方法 |
| JP2015097248A (ja) | 2013-11-15 | 2015-05-21 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層セラミック電子部品及びその実装基板 |
| WO2018074408A1 (ja) | 2016-10-17 | 2018-04-26 | 株式会社村田製作所 | 固体電解コンデンサ |
| JP2018182039A (ja) | 2017-04-12 | 2018-11-15 | 太陽誘電株式会社 | 積層セラミックコンデンサ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US12217916B2 (en) | 2025-02-04 |
| JPWO2021256410A1 (https=) | 2021-12-23 |
| US20230119320A1 (en) | 2023-04-20 |
| WO2021256410A1 (ja) | 2021-12-23 |
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