JPWO2021200757A1 - - Google Patents

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Publication number
JPWO2021200757A1
JPWO2021200757A1 JP2022512166A JP2022512166A JPWO2021200757A1 JP WO2021200757 A1 JPWO2021200757 A1 JP WO2021200757A1 JP 2022512166 A JP2022512166 A JP 2022512166A JP 2022512166 A JP2022512166 A JP 2022512166A JP WO2021200757 A1 JPWO2021200757 A1 JP WO2021200757A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022512166A
Other languages
Japanese (ja)
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JP7631316B2 (ja
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Publication of JPWO2021200757A1 publication Critical patent/JPWO2021200757A1/ja
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Publication of JP7631316B2 publication Critical patent/JP7631316B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
JP2022512166A 2020-03-30 2021-03-26 光学用シート状接着剤 Active JP7631316B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020059987 2020-03-30
JP2020059987 2020-03-30
PCT/JP2021/013141 WO2021200757A1 (ja) 2020-03-30 2021-03-26 光学用シート状接着剤

Publications (2)

Publication Number Publication Date
JPWO2021200757A1 true JPWO2021200757A1 (enrdf_load_stackoverflow) 2021-10-07
JP7631316B2 JP7631316B2 (ja) 2025-02-18

Family

ID=77927393

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022512166A Active JP7631316B2 (ja) 2020-03-30 2021-03-26 光学用シート状接着剤
JP2022512167A Active JP7709956B2 (ja) 2020-03-30 2021-03-26 光硬化性シート状接着剤

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022512167A Active JP7709956B2 (ja) 2020-03-30 2021-03-26 光硬化性シート状接着剤

Country Status (5)

Country Link
JP (2) JP7631316B2 (enrdf_load_stackoverflow)
KR (2) KR20220161545A (enrdf_load_stackoverflow)
CN (2) CN115427526B (enrdf_load_stackoverflow)
TW (2) TW202142661A (enrdf_load_stackoverflow)
WO (2) WO2021200758A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7450116B2 (ja) * 2022-01-13 2024-03-14 古河電気工業株式会社 フレキシブルデバイス用樹脂組成物、フレキシブルデバイス用フィルム状接着剤、フレキシブルデバイス用接着シート、及びフレキシブルデバイスの製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010230944A (ja) * 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd 光導波路形成用エポキシ樹脂組成物、光導波路形成用硬化性フィルム、光伝送用フレキシブルプリント配線板、及び電子情報機器
JP2010275373A (ja) * 2009-05-26 2010-12-09 Toagosei Co Ltd 光学フィルム又はシート用活性エネルギー線硬化型組成物及び活性エネルギー線硬化型粘接着フィルム又はシート
JP2014043543A (ja) * 2012-07-31 2014-03-13 Nitto Denko Corp 放射線硬化型粘着剤、放射線硬化型粘着剤層、放射線硬化型粘着シートおよび積層体
JP2017082228A (ja) * 2012-07-31 2017-05-18 日東電工株式会社 放射線硬化型粘着剤、放射線硬化型粘着剤層、放射線硬化型粘着シートおよび積層体
JP2017179055A (ja) * 2016-03-29 2017-10-05 味の素株式会社 熱硬化性樹脂組成物
JP2018168305A (ja) * 2017-03-30 2018-11-01 リンテック株式会社 粘着シート、積層体、及びデバイス

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59159820A (ja) * 1983-03-02 1984-09-10 Mitsui Toatsu Chem Inc 紫外線硬化性組成物
JP2002146319A (ja) * 2000-11-13 2002-05-22 Three M Innovative Properties Co 熱硬化性接着剤及びそれを用いた接着剤フィルム
KR100827756B1 (ko) * 2002-03-13 2008-05-07 쓰리엠 이노베이티브 프로퍼티즈 캄파니 열경화성 접착제 및 이것을 사용한 접착체 필름
JP5448024B2 (ja) * 2007-03-15 2014-03-19 住友化学株式会社 光硬化性接着剤、該光硬化性接着剤を用いた偏光板およびその製造方法、光学部材および液晶表示装置
CN102449093B (zh) 2009-06-01 2014-08-20 日东电工株式会社 光固化型粘合粘接剂组合物、光固化型粘合粘接剂层、和光固化型粘合粘接片
JP5555532B2 (ja) 2010-04-22 2014-07-23 積水化学工業株式会社 有機ｅｌ素子用封止剤及び有機ｅｌ素子
JP5651421B2 (ja) 2010-10-07 2015-01-14 三井化学株式会社 封止用組成物及びそれを用いた封止用シート
JP5948784B2 (ja) 2011-10-13 2016-07-06 三菱レイヨン株式会社 エポキシ樹脂組成物
TWI582202B (zh) * 2011-11-18 2017-05-11 Ｌｇ化學股份有限公司 用於封裝有機電子裝置之光可硬化壓感性黏著膜、有機電子裝置及用於封裝有機電子裝置之方法
US20130224425A1 (en) * 2012-02-23 2013-08-29 Hitachi Chemical Company, Ltd. Pressure-sensitive adhesive sheet for image display device, method for producing image display device and image display device
JP2014043546A (ja) * 2012-07-31 2014-03-13 Nitto Denko Corp 放射線硬化型粘着剤層及び放射線硬化型粘着シート
KR101832522B1 (ko) 2013-11-29 2018-04-04 주식회사 엘지화학 접착 필름 형성용 조성물, 광경화전 가공용 점착 필름, 접착 필름 및 전자종이 표시장치
JP2017110128A (ja) 2015-12-17 2017-06-22 Dic株式会社 熱硬化性接着シート、物品及び物品の製造方法
JP6353990B1 (ja) 2016-09-07 2018-07-04 リンテック株式会社 接着剤組成物、封止シート、及び封止体
WO2018092463A1 (ja) * 2016-11-18 2018-05-24 株式会社スリーボンド カメラモジュール用カチオン硬化性接着剤組成物、硬化物および接合体
US20200040131A1 (en) 2017-03-22 2020-02-06 Panasonic Intellectual Property Management Co., Ltd. Photocurable resin composition, adhesive, stacked structure, method for fabricating the stacked structure, and display device
US12146084B2 (en) * 2018-03-29 2024-11-19 Mitsubishi Chemical Corporation Adhesive sheet, laminated sheet, and image display device using same
CN113646399B (zh) * 2019-03-28 2024-01-16 琳得科株式会社 片状粘接剂、密封片、电子器件的密封体和电子器件的密封体的制造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010230944A (ja) * 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd 光導波路形成用エポキシ樹脂組成物、光導波路形成用硬化性フィルム、光伝送用フレキシブルプリント配線板、及び電子情報機器
JP2010275373A (ja) * 2009-05-26 2010-12-09 Toagosei Co Ltd 光学フィルム又はシート用活性エネルギー線硬化型組成物及び活性エネルギー線硬化型粘接着フィルム又はシート
JP2014043543A (ja) * 2012-07-31 2014-03-13 Nitto Denko Corp 放射線硬化型粘着剤、放射線硬化型粘着剤層、放射線硬化型粘着シートおよび積層体
JP2017082228A (ja) * 2012-07-31 2017-05-18 日東電工株式会社 放射線硬化型粘着剤、放射線硬化型粘着剤層、放射線硬化型粘着シートおよび積層体
JP2017179055A (ja) * 2016-03-29 2017-10-05 味の素株式会社 熱硬化性樹脂組成物
JP2018168305A (ja) * 2017-03-30 2018-11-01 リンテック株式会社 粘着シート、積層体、及びデバイス

Also Published As

Publication number Publication date
CN115427526B (zh) 2025-02-25
KR20220161545A (ko) 2022-12-06
TW202142661A (zh) 2021-11-16
TWI868337B (zh) 2025-01-01
JPWO2021200758A1 (enrdf_load_stackoverflow) 2021-10-07
TW202140734A (zh) 2021-11-01
JP7631316B2 (ja) 2025-02-18
JP7709956B2 (ja) 2025-07-17
KR20220161547A (ko) 2022-12-06
CN115279854B (zh) 2024-12-13
CN115427526A (zh) 2022-12-02
WO2021200758A1 (ja) 2021-10-07
WO2021200757A1 (ja) 2021-10-07
CN115279854A (zh) 2022-11-01

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