JPWO2021153502A1 - - Google Patents
Info
- Publication number
- JPWO2021153502A1 JPWO2021153502A1 JP2021574020A JP2021574020A JPWO2021153502A1 JP WO2021153502 A1 JPWO2021153502 A1 JP WO2021153502A1 JP 2021574020 A JP2021574020 A JP 2021574020A JP 2021574020 A JP2021574020 A JP 2021574020A JP WO2021153502 A1 JPWO2021153502 A1 JP WO2021153502A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/129—Preparing bulk and homogeneous wafers by polishing
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/145—Preparation of hydroorganosols, organosols or dispersions in an organic medium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Silicon Compounds (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024230287A JP2025036640A (ja) | 2020-01-28 | 2024-12-26 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020011471 | 2020-01-28 | ||
| PCT/JP2021/002435 WO2021153502A1 (ja) | 2020-01-28 | 2021-01-25 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024230287A Division JP2025036640A (ja) | 2020-01-28 | 2024-12-26 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021153502A1 true JPWO2021153502A1 (https=) | 2021-08-05 |
Family
ID=77079007
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021574020A Pending JPWO2021153502A1 (https=) | 2020-01-28 | 2021-01-25 | |
| JP2024230287A Pending JP2025036640A (ja) | 2020-01-28 | 2024-12-26 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024230287A Pending JP2025036640A (ja) | 2020-01-28 | 2024-12-26 | シリカ粒子、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20220363554A1 (https=) |
| EP (1) | EP4098615A4 (https=) |
| JP (2) | JPWO2021153502A1 (https=) |
| KR (1) | KR20220131926A (https=) |
| CN (2) | CN118833827A (https=) |
| TW (1) | TWI895337B (https=) |
| WO (1) | WO2021153502A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118974198A (zh) * | 2022-03-23 | 2024-11-15 | 福吉米株式会社 | 研磨用组合物及使用其的研磨方法 |
| CN119403760A (zh) * | 2022-06-20 | 2025-02-07 | 三菱化学株式会社 | 二氧化硅粒子及其制造方法、硅溶胶、研磨组合物、研磨方法、半导体晶片的制造方法以及半导体器件的制造方法 |
| JP7582551B2 (ja) * | 2022-06-20 | 2024-11-13 | 三菱ケミカル株式会社 | シリカ粒子とその製造方法、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 |
| JPWO2024122583A1 (https=) * | 2022-12-08 | 2024-06-13 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6374911A (ja) * | 1986-09-19 | 1988-04-05 | Shin Etsu Chem Co Ltd | 微細球状シリカの製造法 |
| JPH06316407A (ja) * | 1993-03-03 | 1994-11-15 | Nissan Chem Ind Ltd | シリカゾルの製造方法 |
| JP2007153732A (ja) * | 2005-11-10 | 2007-06-21 | Tama Kagaku Kogyo Kk | 中性コロイダルシリカの製造方法 |
| JP2008273780A (ja) * | 2007-04-27 | 2008-11-13 | Jgc Catalysts & Chemicals Ltd | 改質シリカ系ゾルおよびその製造方法 |
| JP2010058985A (ja) * | 2008-09-01 | 2010-03-18 | Jgc Catalysts & Chemicals Ltd | シリカゾルおよびその製造方法 |
| JP2012006796A (ja) * | 2010-06-25 | 2012-01-12 | Fuji Xerox Co Ltd | シリカ粒子及びその製造方法 |
| JP2014198649A (ja) * | 2013-03-29 | 2014-10-23 | 日産化学工業株式会社 | シリカゾルの製造方法 |
| CN105731468A (zh) * | 2016-03-17 | 2016-07-06 | 江苏天恒纳米科技股份有限公司 | 一种粒径可控硅溶胶的制备方法 |
| JP2018090798A (ja) * | 2016-12-02 | 2018-06-14 | 日揮触媒化成株式会社 | 研磨用シリカ系粒子および研磨材 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61209910A (ja) | 1985-03-15 | 1986-09-18 | Tama Kagaku Kogyo Kk | ポリツシング用コロイダルシリカの製造方法 |
| JPS62260712A (ja) * | 1986-05-02 | 1987-11-13 | Toray Ind Inc | シリカ粒子の製造法 |
| JP2555475B2 (ja) * | 1990-10-16 | 1996-11-20 | 工業技術院長 | 無機質微小球体の製造方法 |
| JPH085657B2 (ja) | 1990-11-21 | 1996-01-24 | 触媒化成工業株式会社 | シリカゾルとその製法 |
| US5425930A (en) * | 1993-09-17 | 1995-06-20 | Alliedsignal Inc. | Process for forming large silica spheres by low temperature nucleation |
| JPH08183610A (ja) * | 1994-12-27 | 1996-07-16 | Mitsubishi Chem Corp | 着色球状シリカの製造法 |
| JP3195569B2 (ja) | 1997-08-11 | 2001-08-06 | 守 磯 | 繭型コロイダルシリカの製造方法 |
| JP2003165718A (ja) * | 2001-11-27 | 2003-06-10 | Fuso Chemical Co Ltd | 無孔質球状シリカ及びその製造方法 |
| JP4968431B2 (ja) * | 2006-01-30 | 2012-07-04 | 株式会社豊田中央研究所 | 球状シリカ系メソ多孔体及びその製造方法、並びにそれを用いた塩基触媒 |
| JP4617267B2 (ja) * | 2006-03-13 | 2011-01-19 | 株式会社トクヤマ | 球状シリカ粉末の製造方法 |
| WO2007122930A1 (ja) * | 2006-04-20 | 2007-11-01 | Asahi Glass Company, Limited | コアシェル型シリカおよびその製造方法 |
| JP2008037700A (ja) * | 2006-08-04 | 2008-02-21 | Tokuyama Corp | シリカ系複合酸化物粒子集合体およびその製造方法 |
| AU2008260452A1 (en) * | 2007-06-04 | 2008-12-11 | Alltech Associates, Inc. | Silica particles and methods of making and using the same |
| JP5348400B2 (ja) * | 2008-09-05 | 2013-11-20 | Ｊｓｒ株式会社 | シリカ粒子分散液およびその製造方法 |
| JP2012214340A (ja) * | 2011-03-31 | 2012-11-08 | Dainippon Printing Co Ltd | シリカ粒子の製造方法 |
| JP5857525B2 (ja) * | 2011-08-18 | 2016-02-10 | 富士ゼロックス株式会社 | シリカ粒子及びその製造方法 |
| US20140319411A1 (en) | 2011-11-16 | 2014-10-30 | Nissan Chemical Industries, Ltd. | Semiconductor wafer polishing liquid composition |
| JP6934344B2 (ja) * | 2017-07-18 | 2021-09-15 | デンカ株式会社 | 球状シリカフィラー用粉末及びその製造方法 |
| JP7422481B2 (ja) * | 2017-10-23 | 2024-01-26 | 株式会社トクヤマ | 複合粉体 |
| JP7206695B2 (ja) * | 2017-11-10 | 2023-01-18 | 三菱ケミカル株式会社 | シリカゾル、研磨組成物、シリコンウェーハの研磨方法、シリコンウェーハの製造方法、化学的機械的研磨組成物及び半導体デバイスの製造方法 |
| JP7234536B2 (ja) * | 2018-03-26 | 2023-03-08 | 三菱ケミカル株式会社 | シリカゾルの製造方法 |
| KR102672869B1 (ko) * | 2018-03-30 | 2024-06-05 | 닛키 쇼쿠바이카세이 가부시키가이샤 | 실리카 입자 분산액, 연마 조성물 및 실리카 입자 분산액의 제조 방법 |
| JP2020011471A (ja) | 2018-07-19 | 2020-01-23 | 株式会社Ｍｓソリューションズ | ガラスフィルム |
-
2021
- 2021-01-25 JP JP2021574020A patent/JPWO2021153502A1/ja active Pending
- 2021-01-25 KR KR1020227026002A patent/KR20220131926A/ko active Pending
- 2021-01-25 EP EP21747821.3A patent/EP4098615A4/en active Pending
- 2021-01-25 CN CN202411065909.5A patent/CN118833827A/zh active Pending
- 2021-01-25 WO PCT/JP2021/002435 patent/WO2021153502A1/ja not_active Ceased
- 2021-01-25 CN CN202180011041.9A patent/CN115023408B/zh active Active
- 2021-01-28 TW TW110103270A patent/TWI895337B/zh active
-
2022
- 2022-07-26 US US17/815,006 patent/US20220363554A1/en active Pending
-
2024
- 2024-12-26 JP JP2024230287A patent/JP2025036640A/ja active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6374911A (ja) * | 1986-09-19 | 1988-04-05 | Shin Etsu Chem Co Ltd | 微細球状シリカの製造法 |
| JPH06316407A (ja) * | 1993-03-03 | 1994-11-15 | Nissan Chem Ind Ltd | シリカゾルの製造方法 |
| JP2007153732A (ja) * | 2005-11-10 | 2007-06-21 | Tama Kagaku Kogyo Kk | 中性コロイダルシリカの製造方法 |
| JP2008273780A (ja) * | 2007-04-27 | 2008-11-13 | Jgc Catalysts & Chemicals Ltd | 改質シリカ系ゾルおよびその製造方法 |
| JP2010058985A (ja) * | 2008-09-01 | 2010-03-18 | Jgc Catalysts & Chemicals Ltd | シリカゾルおよびその製造方法 |
| JP2012006796A (ja) * | 2010-06-25 | 2012-01-12 | Fuji Xerox Co Ltd | シリカ粒子及びその製造方法 |
| JP2014198649A (ja) * | 2013-03-29 | 2014-10-23 | 日産化学工業株式会社 | シリカゾルの製造方法 |
| CN105731468A (zh) * | 2016-03-17 | 2016-07-06 | 江苏天恒纳米科技股份有限公司 | 一种粒径可控硅溶胶的制备方法 |
| JP2018090798A (ja) * | 2016-12-02 | 2018-06-14 | 日揮触媒化成株式会社 | 研磨用シリカ系粒子および研磨材 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20220363554A1 (en) | 2022-11-17 |
| TWI895337B (zh) | 2025-09-01 |
| CN115023408B (zh) | 2024-08-20 |
| CN115023408A (zh) | 2022-09-06 |
| EP4098615A1 (en) | 2022-12-07 |
| TW202134179A (zh) | 2021-09-16 |
| JP2025036640A (ja) | 2025-03-14 |
| EP4098615A4 (en) | 2023-08-02 |
| KR20220131926A (ko) | 2022-09-29 |
| WO2021153502A1 (ja) | 2021-08-05 |
| CN118833827A (zh) | 2024-10-25 |
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