JPWO2024122583A1 - - Google Patents
Info
- Publication number
- JPWO2024122583A1 JPWO2024122583A1 JP2024562973A JP2024562973A JPWO2024122583A1 JP WO2024122583 A1 JPWO2024122583 A1 JP WO2024122583A1 JP 2024562973 A JP2024562973 A JP 2024562973A JP 2024562973 A JP2024562973 A JP 2024562973A JP WO2024122583 A1 JPWO2024122583 A1 JP WO2024122583A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/129—Preparing bulk and homogeneous wafers by polishing
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/02—Amorphous compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Silicon Compounds (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022196462 | 2022-12-08 | ||
| PCT/JP2023/043677 WO2024122583A1 (ja) | 2022-12-08 | 2023-12-06 | シリカ粒子、シリカ粒子の製造方法、シリカゾル、研磨組成物、研磨方法、半導体ウェハの製造方法及び半導体デバイスの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024122583A1 true JPWO2024122583A1 (https=) | 2024-06-13 |
Family
ID=91379020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024562973A Pending JPWO2024122583A1 (https=) | 2022-12-08 | 2023-12-06 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250297136A1 (https=) |
| EP (1) | EP4631913A4 (https=) |
| JP (1) | JPWO2024122583A1 (https=) |
| KR (1) | KR20250121312A (https=) |
| CN (1) | CN120265574A (https=) |
| TW (1) | TW202436223A (https=) |
| WO (1) | WO2024122583A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3040310B2 (ja) * | 1994-07-04 | 2000-05-15 | 信越化学工業株式会社 | 合成石英ガラスの製造方法 |
| JPH08208214A (ja) * | 1995-02-03 | 1996-08-13 | Mitsubishi Chem Corp | シリカゲル及びその製造法、並びに合成石英ガラス粉の製造法 |
| JPH08325272A (ja) | 1995-05-26 | 1996-12-10 | Mitsubishi Chem Corp | 高純度テトラアルコキシシラン及びその製造方法 |
| JP5270344B2 (ja) | 2006-07-31 | 2013-08-21 | 扶桑化学工業株式会社 | シリカゾルおよびその製造方法 |
| JP5348400B2 (ja) | 2008-09-05 | 2013-11-20 | Ｊｓｒ株式会社 | シリカ粒子分散液およびその製造方法 |
| JP5905767B2 (ja) * | 2012-04-17 | 2016-04-20 | 多摩化学工業株式会社 | 中性コロイダルシリカ分散液の分散安定化方法及び分散安定性に優れた中性コロイダルシリカ分散液 |
| US11499070B2 (en) * | 2015-01-19 | 2022-11-15 | Fujimi Incorporated | Modified colloidal silica and method for producing the same, and polishing agent using the same |
| TWI757349B (zh) | 2016-11-07 | 2022-03-11 | 日商日揮觸媒化成股份有限公司 | 研磨用氧化矽系粒子及研磨材 |
| TWI762528B (zh) * | 2016-12-02 | 2022-05-01 | 日商日揮觸媒化成股份有限公司 | 研磨用氧化矽系粒子及研磨材 |
| JPWO2021153502A1 (https=) * | 2020-01-28 | 2021-08-05 | ||
| JP2022063814A (ja) * | 2020-10-12 | 2022-04-22 | 合資会社 ナベショー | 合成シリカ粉の製造方法 |
| JP2023004284A (ja) * | 2021-06-25 | 2023-01-17 | 三菱ケミカル株式会社 | シリカ粒子の製造方法、シリカゾルの製造方法及び研磨方法 |
-
2023
- 2023-12-06 JP JP2024562973A patent/JPWO2024122583A1/ja active Pending
- 2023-12-06 CN CN202380083781.2A patent/CN120265574A/zh active Pending
- 2023-12-06 EP EP23900695.0A patent/EP4631913A4/en active Pending
- 2023-12-06 KR KR1020257018583A patent/KR20250121312A/ko active Pending
- 2023-12-06 WO PCT/JP2023/043677 patent/WO2024122583A1/ja not_active Ceased
- 2023-12-08 TW TW112147830A patent/TW202436223A/zh unknown
-
2025
- 2025-06-06 US US19/230,306 patent/US20250297136A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN120265574A (zh) | 2025-07-04 |
| EP4631913A4 (en) | 2026-03-04 |
| WO2024122583A1 (ja) | 2024-06-13 |
| KR20250121312A (ko) | 2025-08-12 |
| TW202436223A (zh) | 2024-09-16 |
| EP4631913A1 (en) | 2025-10-15 |
| US20250297136A1 (en) | 2025-09-25 |