JPWO2021100144A5 - - Google Patents
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- Publication number
- JPWO2021100144A5 JPWO2021100144A5 JP2021558094A JP2021558094A JPWO2021100144A5 JP WO2021100144 A5 JPWO2021100144 A5 JP WO2021100144A5 JP 2021558094 A JP2021558094 A JP 2021558094A JP 2021558094 A JP2021558094 A JP 2021558094A JP WO2021100144 A5 JPWO2021100144 A5 JP WO2021100144A5
- Authority
- JP
- Japan
- Prior art keywords
- lamella
- analysis
- width
- cutting portion
- sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/045433 WO2021100144A1 (ja) | 2019-11-20 | 2019-11-20 | ラメラの作製方法、解析システムおよび試料の解析方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021100144A1 JPWO2021100144A1 (https=) | 2021-05-27 |
| JPWO2021100144A5 true JPWO2021100144A5 (https=) | 2022-08-09 |
| JP7389817B2 JP7389817B2 (ja) | 2023-11-30 |
Family
ID=75980416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021558094A Active JP7389817B2 (ja) | 2019-11-20 | 2019-11-20 | ラメラの作製方法、解析システムおよび試料の解析方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12176180B2 (https=) |
| JP (1) | JP7389817B2 (https=) |
| KR (1) | KR102942497B1 (https=) |
| TW (1) | TWI761997B (https=) |
| WO (1) | WO2021100144A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230096171A (ko) | 2021-12-22 | 2023-06-30 | 삼성전자주식회사 | 반도체 소자 검사 장치 및 이를 이용한 반도체 소자 검사 방법 |
| JPWO2024134744A1 (https=) * | 2022-12-20 | 2024-06-27 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06129962A (ja) * | 1992-10-16 | 1994-05-13 | Mitsubishi Electric Corp | 透過形電子顕微鏡用試料 |
| JP2001015058A (ja) * | 1999-04-28 | 2001-01-19 | Jeol Ltd | 走査型荷電粒子ビーム装置における試料像観察方法及び装置 |
| US6727911B1 (en) | 1999-04-28 | 2004-04-27 | Jeol Ltd. | Method and apparatus for observing specimen image on scanning charged-particle beam instrument |
| JP2001124676A (ja) * | 1999-10-25 | 2001-05-11 | Hitachi Ltd | 電子顕微鏡観察用試料支持部材 |
| KR20030016910A (ko) | 2001-08-23 | 2003-03-03 | 삼성전자주식회사 | 투과전자현미경 분석시료 및 그 제조 방법 |
| KR20040031279A (ko) | 2002-10-04 | 2004-04-13 | 삼성전자주식회사 | 투과 전자현미경 분석용 시편 제조방법 |
| JP3768197B2 (ja) | 2003-02-28 | 2006-04-19 | 株式会社東芝 | 透過型電子顕微鏡観察試料の作製方法 |
| JP4517867B2 (ja) | 2005-01-31 | 2010-08-04 | 株式会社Sumco | シリコンウェーハ表面形状制御用エッチング液及び該エッチング液を用いたシリコンウェーハの製造方法 |
| JP5039962B2 (ja) | 2007-11-06 | 2012-10-03 | エスアイアイ・ナノテクノロジー株式会社 | 透過電子顕微鏡用試料作製方法及び荷電粒子ビーム装置 |
| EP2151848A1 (en) * | 2008-08-07 | 2010-02-10 | FEI Company | Method of machining a work piece with a focused particle beam |
| KR101109848B1 (ko) * | 2010-03-30 | 2012-02-14 | 현대제철 주식회사 | 전자 탐침 미소 분석기용 시편 홀더 장치 |
| US9281163B2 (en) | 2014-04-14 | 2016-03-08 | Fei Company | High capacity TEM grid |
| US20150369710A1 (en) * | 2014-06-24 | 2015-12-24 | Fei Company | Method and System of Creating a Symmetrical FIB Deposition |
| EP3153838B1 (de) * | 2015-10-06 | 2022-07-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur präparation einer probe für die mikrostrukturdiagnostik sowie probe für die mikrostrukturdiagnostik |
| TW201903870A (zh) | 2017-06-01 | 2019-01-16 | 鈦昇科技股份有限公司 | 晶圓切割方法 |
| US10930514B2 (en) * | 2018-06-11 | 2021-02-23 | Fei Company | Method and apparatus for the planarization of surfaces |
| US11088036B2 (en) * | 2018-07-31 | 2021-08-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Atom probe tomography specimen preparation |
-
2019
- 2019-11-20 JP JP2021558094A patent/JP7389817B2/ja active Active
- 2019-11-20 US US17/773,433 patent/US12176180B2/en active Active
- 2019-11-20 KR KR1020227014384A patent/KR102942497B1/ko active Active
- 2019-11-20 WO PCT/JP2019/045433 patent/WO2021100144A1/ja not_active Ceased
-
2020
- 2020-10-20 TW TW109136231A patent/TWI761997B/zh active
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