JPWO2020184353A1 - 基板収容容器 - Google Patents
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract
Description
本発明の実施の形態に係る基板収容容器について図1乃至図4を参照して説明する。図1は、本実施の形態に係る基板収容容器1を示し、この基板収容容器1に収容される基板は、例えば、半導体製造プロセスに用いられるシリコンウエハやガラス基板である。
300mmウエハ用などの搬送・保管を目的としたキャリアであり、正面開口式で、ウエハを把持するカセット一体型のものである。基板収容容器1には、読み取りと書き込みが可能なRFタグと呼ばれる無線タグが使われ、この無線タグはFOUPのポケットに格納され、各基板収容容器1の状態がコンピュータにより一括管理されている。
本発明の実施の形態1の変形例に係る基板収容容器について図5を参照して説明する。なお、上記実施の形態1と同様の構成に関しては同様の符号を付し、その詳細な説明を省略する。
次に、本実施の形態に係る基板収容容器1に用いる配合樹脂を有する実施例1,2と、従来の基板収容容器に用いる配合樹脂の比較例1〜4とを用いて試験を行った。なお、この試験は、各配合樹脂の表面抵抗値及び透過率(視認性があるか否)を判断するための試験である。
実施例1では、基板収容容器1を構成する樹脂として、ポリカーボネート樹脂99.99wt%、単層カーボンナノチューブ0.01wt%の配合物を用いて1mm厚で形成した。実施例2では、基板収容容器1を構成する樹脂として、ポリカーボネート樹脂99.98wt%、単層カーボンナノチューブ0.02wt%の配合物を用いて1mm厚で形成した。
また、上記実施例1,2との比較のため、比較例1として、ポリカーボネート樹脂99wt%、単層カーボンナノチューブ1wt%の配合物を用いて1mm厚で形成した。比較例2として、ポリカーボネート樹脂100wt%を用いて1mm厚で形成した。比較例3として、ポリカーボネート樹脂97.5wt%、多層カーボンナノチューブ2.5wt%の配合物を用いて1mm厚で形成した。比較例4として、ポリカーボネート樹脂90wt%、カーボンブラック10wt%の配合物を用いて1mm厚で形成した。
実施例1,2、及び比較例1〜4の配合樹脂の表面抵抗値を抵抗値測定器(三和MIテクノス社製:モデル5501DM)によりそれぞれ測定し、表1にまとめた。
実施例1,2、及び比較例1〜4の配合樹脂の表面抵抗値をTINT METERと呼ばれる可視光線測定器(P&S社製:ジェネリック ウィンドウ ティントメーター ビジュアルライトトランスミッション 18mmテスター)によりそれぞれ測定して表1にまとめた。そして、各サンプルの試験結果を下記の[表1]に示した。
2 RSP
3 ブランクスケース
11 容器本体
11a 側壁
11b 天壁
11c ロボティクフランジ
11d,21a 覗き窓
11e マニュアルハンドル
12 ボトムプレート
13 蓋体
31 上蓋
51 熱可塑性樹脂層
52 フィルム層
Claims (13)
- 半導体製造工程に用いる基板を搬送又は保管する基板収容容器であって、
(a)熱可塑性樹脂99.99〜99.95wt%、及び(b)単層カーボンナノチューブ0.01〜0.05wt%を配合して成る材質を用いた構成部品を少なくとも1以上備える、ことを特徴とする基板収容容器。 - 前記基板は、シリコンウエハ又はガラス基板であり、
前記熱可塑性樹脂は、ポリカーボネート、シクロオレフィン、ポリエーテルイミド、ポリエーテルエーテルケトン、及びポリエーテルサルフォンの少なくとも1以上の樹脂から構成される、ことを特徴とする請求項1記載の基板収容容器。 - 前記材質の表面抵抗値は1.0×1010Ω以下となる、ことを特徴とする請求項1又は2記載の基板収容容器。
- 前記基板収容容器は、ポリカーボネート99.985 wt%、単層カーボンナノチューブ0.015wt%を配合して成る材質を用いた構成部品を少なくとも1以上備え、当該材質の表面抵抗値は1.0×104〜109Ωの範囲となる、ことを特徴とする請求項3記載の基板収容容器。
- 前記材質は、厚さ1mmで形成された場合において透過率20%以上となる、ことを特徴とする請求項1乃至4の何れか一項に記載の基板収容容器。
- 前記材質は、熱可塑性樹脂層の表面に設けられてた厚さ0.01〜0.05mmの範囲で形成されたフィルム層である、ことを特徴とする請求項1乃至5の何れか一項に記載の基板収容容器。
- 前記フィルム層は熱可塑性樹脂層の表面にフィルムインサート成形法により形成され、
前記フォルム層の表面抵抗値は1.0×104〜109Ωの範囲となり、且つ透過率は40%以上となる、ことを特徴とする請求項6記載の基板収容容器。 - 前記基板収容容器は、シリコンウエハの搬送・保管に用いられるFOUP(Front Opening Unified Pod)であり、
前記FOUPは、容器本体、蓋体、及びボトムプレートを備え、
前記構成部品には、前記容器本体に形成され、作業員が内部に収容されたウエハの状態を外側から目視で確認するための覗き窓が含まれる、ことを特徴とする請求項1乃至7の何れか一項に記載の基板収容容器。 - 前記基板収容容器は、シリコンウエハの搬送・保管に用いられるFOSB(Front Opening Shipping Box)である、ことを特徴とする請求項1乃至7の何れか一項に記載の基板収容容器。
- 前記基板収容容器は、フォトマスクを収容するためのRSP(Reticle Smif Pod)であり、
前記構成部品には、前記RSPの上蓋に形成され、作業員が内部に収容されたウエハの状態を外側から目視で確認するための覗き窓が含まれる、ことを特徴とする請求項1乃至7の何れか一項に記載の基板収容容器。 - 前記基板収容容器は、フォトマスクケースガラスを運搬するブランクスケースであり、
前記構成部品には、前記ブランクスケースの上蓋が含まれる、ことを特徴とする請求項1乃至7の何れか一項に記載の基板収容容器。 - 前記基板収容容器の全ての構成部品が前記材質から構成される、ことを特徴とする請求項1乃至7の何れか一項に記載の基板収容容器。
- 前記請求項1に記載の材質を用いた構成部品の成形方法であって、
(1)金型キャビティ内に前記材質を充填する前に、金型温度を160℃以上に設定する加熱工程と、
(2)金型キャビティ内に当該材質を射出する射出工程と、
(3)金型温度を90℃以下の温度に急速冷却する冷却工程と、を含むことを特徴とする構成部品の成形方法。
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PCT/JP2019/009223 WO2020183511A1 (ja) | 2019-03-08 | 2019-03-08 | 基板収容容器 |
JPPCT/JP2019/009223 | 2019-03-08 | ||
PCT/JP2020/009290 WO2020184353A1 (ja) | 2019-03-08 | 2020-03-05 | 基板収容容器 |
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JP4442816B2 (ja) * | 2004-09-30 | 2010-03-31 | 信越ポリマー株式会社 | 基板収納容器 |
US8652391B2 (en) * | 2005-02-03 | 2014-02-18 | Entegris, Inc. | Method of forming substrate carriers and articles from compositions comprising carbon nanotubes |
US7528936B2 (en) * | 2005-02-27 | 2009-05-05 | Entegris, Inc. | Substrate container with pressure equalization |
JP2007332271A (ja) * | 2006-06-15 | 2007-12-27 | Miraial Kk | 高分子成形製品 |
JP4889460B2 (ja) | 2006-12-05 | 2012-03-07 | 信越ポリマー株式会社 | 半導体搬送容器用部品用導電性樹脂組成物及びこれを用いた半導体搬送容器用部品並びに半導体搬送容器 |
WO2008139880A1 (ja) * | 2007-04-27 | 2008-11-20 | Kuraray Co., Ltd. | 透明導電膜および透明導電膜の製造方法 |
EP2178095B1 (en) * | 2007-07-10 | 2015-03-04 | Japan Science and Technology Agency | Transparent electroconductive thin film and process for producing the transparent electroconductive thin film |
JP2010199354A (ja) * | 2009-02-26 | 2010-09-09 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP2011100983A (ja) * | 2009-10-07 | 2011-05-19 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
JP5786556B2 (ja) * | 2010-08-26 | 2015-09-30 | 三菱化学株式会社 | 樹脂成形品の製造方法 |
JP6433206B2 (ja) * | 2014-09-03 | 2018-12-05 | アキレス株式会社 | テープフレーム付きウエハ用トレイ |
KR20170100353A (ko) * | 2016-02-25 | 2017-09-04 | (주)코스탯아이앤씨 | 반도체 수납 트레이 및 반도체 수납 트레이용 커버 |
KR20190121985A (ko) * | 2018-04-19 | 2019-10-29 | 주식회사 씨엔피솔루션즈 | 자외선 저항성이 강화된 대전방지 트레이 및 코팅액 조성물 |
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