KR102438642B1 - 기판 수용 용기 - Google Patents

기판 수용 용기 Download PDF

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Publication number
KR102438642B1
KR102438642B1 KR1020207030561A KR20207030561A KR102438642B1 KR 102438642 B1 KR102438642 B1 KR 102438642B1 KR 1020207030561 A KR1020207030561 A KR 1020207030561A KR 20207030561 A KR20207030561 A KR 20207030561A KR 102438642 B1 KR102438642 B1 KR 102438642B1
Authority
KR
South Korea
Prior art keywords
substrate
container
receiving container
thermoplastic resin
walled carbon
Prior art date
Application number
KR1020207030561A
Other languages
English (en)
Korean (ko)
Other versions
KR20200133794A (ko
Inventor
히데히로 마스코
Original Assignee
히데히로 마스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히데히로 마스코 filed Critical 히데히로 마스코
Publication of KR20200133794A publication Critical patent/KR20200133794A/ko
Application granted granted Critical
Publication of KR102438642B1 publication Critical patent/KR102438642B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
KR1020207030561A 2019-03-08 2020-03-05 기판 수용 용기 KR102438642B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2019/009223 WO2020183511A1 (ja) 2019-03-08 2019-03-08 基板収容容器
JPPCT/JP2019/009223 2019-03-08
PCT/JP2020/009290 WO2020184353A1 (ja) 2019-03-08 2020-03-05 基板収容容器

Publications (2)

Publication Number Publication Date
KR20200133794A KR20200133794A (ko) 2020-11-30
KR102438642B1 true KR102438642B1 (ko) 2022-08-31

Family

ID=72426236

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207030561A KR102438642B1 (ko) 2019-03-08 2020-03-05 기판 수용 용기

Country Status (4)

Country Link
JP (1) JP6781998B1 (ja)
KR (1) KR102438642B1 (ja)
CN (1) CN113544836B (ja)
WO (2) WO2020183511A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012067293A (ja) * 2010-08-26 2012-04-05 Mitsubishi Chemicals Corp 樹脂成形品の製造方法
US20140264999A1 (en) * 2006-02-22 2014-09-18 Entegris, Inc. Substrate carriers and articles formed from compositions comprising carbon nanotubes

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003341783A (ja) * 2002-05-28 2003-12-03 Fujitsu Ltd 基板収納装置
JP4442816B2 (ja) * 2004-09-30 2010-03-31 信越ポリマー株式会社 基板収納容器
US7528936B2 (en) * 2005-02-27 2009-05-05 Entegris, Inc. Substrate container with pressure equalization
JP2007332271A (ja) * 2006-06-15 2007-12-27 Miraial Kk 高分子成形製品
JP4889460B2 (ja) 2006-12-05 2012-03-07 信越ポリマー株式会社 半導体搬送容器用部品用導電性樹脂組成物及びこれを用いた半導体搬送容器用部品並びに半導体搬送容器
WO2008139880A1 (ja) * 2007-04-27 2008-11-20 Kuraray Co., Ltd. 透明導電膜および透明導電膜の製造方法
EP2178095B1 (en) * 2007-07-10 2015-03-04 Japan Science and Technology Agency Transparent electroconductive thin film and process for producing the transparent electroconductive thin film
JP2010199354A (ja) * 2009-02-26 2010-09-09 Shin Etsu Polymer Co Ltd 基板収納容器
JP2011100983A (ja) * 2009-10-07 2011-05-19 Shin Etsu Polymer Co Ltd 基板収納容器
JP6433206B2 (ja) * 2014-09-03 2018-12-05 アキレス株式会社 テープフレーム付きウエハ用トレイ
KR20170100353A (ko) * 2016-02-25 2017-09-04 (주)코스탯아이앤씨 반도체 수납 트레이 및 반도체 수납 트레이용 커버
KR20190121985A (ko) * 2018-04-19 2019-10-29 주식회사 씨엔피솔루션즈 자외선 저항성이 강화된 대전방지 트레이 및 코팅액 조성물

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140264999A1 (en) * 2006-02-22 2014-09-18 Entegris, Inc. Substrate carriers and articles formed from compositions comprising carbon nanotubes
JP2012067293A (ja) * 2010-08-26 2012-04-05 Mitsubishi Chemicals Corp 樹脂成形品の製造方法

Also Published As

Publication number Publication date
CN113544836A (zh) 2021-10-22
CN113544836B (zh) 2023-02-28
JPWO2020184353A1 (ja) 2021-03-18
WO2020184353A1 (ja) 2020-09-17
KR20200133794A (ko) 2020-11-30
WO2020183511A1 (ja) 2020-09-17
JP6781998B1 (ja) 2020-11-11

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