JPWO2020170671A1 - 蓋開閉装置 - Google Patents
蓋開閉装置 Download PDFInfo
- Publication number
- JPWO2020170671A1 JPWO2020170671A1 JP2021501710A JP2021501710A JPWO2020170671A1 JP WO2020170671 A1 JPWO2020170671 A1 JP WO2020170671A1 JP 2021501710 A JP2021501710 A JP 2021501710A JP 2021501710 A JP2021501710 A JP 2021501710A JP WO2020170671 A1 JPWO2020170671 A1 JP WO2020170671A1
- Authority
- JP
- Japan
- Prior art keywords
- container
- drive unit
- elevating drive
- housing
- lid opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 230000003028 elevating effect Effects 0.000 claims abstract description 159
- 239000012530 fluid Substances 0.000 claims description 8
- 210000000078 claw Anatomy 0.000 description 11
- 230000032258 transport Effects 0.000 description 11
- 238000009434 installation Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000002066 L-histidyl group Chemical group [H]N1C([H])=NC(C([H])([H])[C@](C(=O)[*])([H])N([H])[H])=C1[H] 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Packaging Frangible Articles (AREA)
- Glass Compositions (AREA)
- Centrifugal Separators (AREA)
Abstract
Description
また、筐体は、エアの流れのある環境に配置され、一方の側は、筐体に対してエアの流れの下流側であってもよい。また、第1昇降駆動部及び第2昇降駆動部は、それぞれシリンダ本体とシリンダロッドとを有する流体圧シリンダであり、第1昇降駆動部は、シリンダロッドを上方に向けて突出させるように配置され、第2昇降駆動部は、シリンダロッドを下方に向けて突出させるように配置され、第1昇降駆動部のシリンダ本体と、第2昇降駆動部のシリンダ本体とは、水平方向に視て少なくとも一部が重なるように配置されていてもよい。
AR・・・エア
1・・・容器本体
2・・・上蓋
3A・・・第1容器
3B・・・第2容器
4・・・係止機構
10・・・載置台
14・・・被取付部
14A・・・第1面
14B・・・第2面
20・・・保持部
20A・・・第1保持部
20B・・・第2保持部
21・・・下側案内部
24・・・上側案内部
30・・・突出部
30A・・・第1突出部
30B・・・第2突出部
40・・・昇降駆動部
40A・・・第1昇降駆動部
40B・・・第2昇降駆動部
41A、41B・・・シリンダ本体
42A、42B・・・シリンダロッド
43A、43B・・・移動部材
50・・・シャッタ
60・・・シャッタ駆動機構
100・・・蓋開閉装置
101・・・筐体
102・・・第1蓋開閉機構
103・・・第2蓋開閉機構
200・・・レチクル入出庫装置
202・・・ファンフィルタユニット(FFU)
204・・・レチクル搬送部
Claims (5)
- 筐体と、
筐体内に配置される第1容器の上蓋を開閉する第1蓋開閉機構と、
前記筐体内において前記第1容器の下方に並んで配置される第2容器の上蓋を開閉する第2蓋開閉機構と、を備え、
前記第1蓋開閉機構は、前記第1容器の上蓋を保持する第1保持部と、前記第1保持部から、前記第1保持部の一方の側方へ突出して設けられ、前記筐体の外側まで延在する第1突出部と、前記第1突出部を介して前記第1保持部を片持ちして昇降させる第1昇降駆動部と、を有し、
前記第2蓋開閉機構は、前記第2容器の上蓋を保持する第2保持部と、前記第2保持部から前記一方の側へ突出して設けられ、前記筐体の外側まで延在する第2突出部と、前記第2突出部を介して前記第2保持部を片持ちして昇降させる第2昇降駆動部と、を有し、
前記第1昇降駆動部及び前記第2昇降駆動部は、前記筐体の外側であって前記筐体に対して前記一方の側に配置されている、蓋開閉装置。 - 前記第1昇降駆動部と前記第2昇降駆動部とは、隣り合って配置されている、請求項1に記載の蓋開閉装置。
- 前記筐体は、エアの流れのある環境に配置され、
前記一方の側は、前記筐体に対して前記エアの流れの下流側である、請求項1又は請求項2に記載の蓋開閉装置。 - 前記第1昇降駆動部及び前記第2昇降駆動部は、それぞれシリンダ本体とシリンダロッドとを有する流体圧シリンダであり、
前記第1昇降駆動部は、前記シリンダロッドを上方に向けて突出させるように配置され、
前記第2昇降駆動部は、前記シリンダロッドを下方に向けて突出させるように配置され、
前記第1昇降駆動部の前記シリンダ本体と、前記第2昇降駆動部の前記シリンダ本体とは、水平方向に視て少なくとも一部が重なるように配置されている、請求項1から請求項3のいずれか一項に記載の蓋開閉装置。 - 前記筐体から前記一方の側に突出して被取付部が設けられ、
前記第1昇降駆動部は、前記被取付部の一方の面側に取り付けられ、
前記第2昇降駆動部は、前記被取付部の前記一方の面側と反対側である他方の面側に取り付けられる、請求項1から請求項4のいずれか一項に記載の蓋開閉装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019030399 | 2019-02-22 | ||
JP2019030399 | 2019-02-22 | ||
PCT/JP2020/001661 WO2020170671A1 (ja) | 2019-02-22 | 2020-01-20 | 蓋開閉装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020170671A1 true JPWO2020170671A1 (ja) | 2021-12-23 |
JP7127731B2 JP7127731B2 (ja) | 2022-08-30 |
Family
ID=72144203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021501710A Active JP7127731B2 (ja) | 2019-02-22 | 2020-01-20 | 蓋開閉装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11961752B2 (ja) |
EP (1) | EP3929118A4 (ja) |
JP (1) | JP7127731B2 (ja) |
CN (1) | CN113474267B (ja) |
TW (1) | TWI814990B (ja) |
WO (1) | WO2020170671A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7139726B2 (ja) | 2018-06-28 | 2022-09-21 | いすゞ自動車株式会社 | 制御装置及び、制御方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05175321A (ja) * | 1991-07-12 | 1993-07-13 | Canon Inc | 板状物収納容器およびその蓋開口装置 |
JP2002009133A (ja) * | 2000-06-26 | 2002-01-11 | Canon Inc | 基板搬送装置 |
JP2007141924A (ja) * | 2005-11-15 | 2007-06-07 | Nikon Corp | マスク収納容器開装置、露光装置 |
JP2015093696A (ja) * | 2013-11-12 | 2015-05-18 | ヒューグルエレクトロニクス株式会社 | 基板ケース分離合体装置及び基板ケース洗浄装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5895812A (ja) * | 1981-12-01 | 1983-06-07 | Nippon Kogaku Kk <Nikon> | 基板の収納容器及び収納容器の装着装置 |
JPH0758192A (ja) * | 1993-08-12 | 1995-03-03 | Nikon Corp | 基板収納ケース |
JP3815750B2 (ja) * | 1995-10-09 | 2006-08-30 | キヤノン株式会社 | ステージ装置、ならびに前記ステージ装置を用いた露光装置およびデバイス製造方法 |
JP3787755B2 (ja) * | 2000-04-10 | 2006-06-21 | 東京エレクトロン株式会社 | 処理システム |
JP3699348B2 (ja) * | 2000-11-30 | 2005-09-28 | 平田機工株式会社 | 駆動部隔離foupオープナ |
US7258520B2 (en) * | 2002-08-31 | 2007-08-21 | Applied Materials, Inc. | Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing |
JP4373316B2 (ja) * | 2004-10-14 | 2009-11-25 | ミライアル株式会社 | 薄板支持容器用クランプ装置 |
US7648354B2 (en) * | 2005-04-28 | 2010-01-19 | Toshiba Kikai Kabushiki Kaisha | Transfer apparatus having gimbal mechanism and transfer method using the transfer apparatus |
JP2008251921A (ja) * | 2007-03-30 | 2008-10-16 | Fujifilm Corp | 基板アライメント装置及び方法並びに描画装置 |
JP4343241B2 (ja) * | 2007-07-30 | 2009-10-14 | Tdk株式会社 | 収容容器の蓋開閉システム及び当該システムを用いた基板処理方法 |
KR101564583B1 (ko) * | 2008-08-14 | 2015-10-30 | 주성엔지니어링(주) | 로드락 챔버 및 그를 포함하는 기판처리장비 |
KR101611487B1 (ko) * | 2011-07-06 | 2016-04-11 | 히라따기꼬오 가부시키가이샤 | 용기 개폐 장치 |
TWM453953U (zh) * | 2013-02-01 | 2013-05-21 | Prov Technology Corp | 晶圓承載盒之啓閉設備 |
WO2016163166A1 (ja) * | 2015-04-10 | 2016-10-13 | 信越ポリマー株式会社 | 基板収納容器 |
CN107352111B (zh) * | 2017-05-22 | 2020-10-30 | 正业包装(中山)有限公司 | 一种旋转开箱折纸包装结构 |
JP6917240B2 (ja) | 2017-08-07 | 2021-08-11 | 花王株式会社 | 吸収性物品 |
-
2020
- 2020-01-20 US US17/432,134 patent/US11961752B2/en active Active
- 2020-01-20 CN CN202080015694.XA patent/CN113474267B/zh active Active
- 2020-01-20 WO PCT/JP2020/001661 patent/WO2020170671A1/ja unknown
- 2020-01-20 JP JP2021501710A patent/JP7127731B2/ja active Active
- 2020-01-20 EP EP20759759.2A patent/EP3929118A4/en active Pending
- 2020-02-21 TW TW109105646A patent/TWI814990B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05175321A (ja) * | 1991-07-12 | 1993-07-13 | Canon Inc | 板状物収納容器およびその蓋開口装置 |
JP2002009133A (ja) * | 2000-06-26 | 2002-01-11 | Canon Inc | 基板搬送装置 |
JP2007141924A (ja) * | 2005-11-15 | 2007-06-07 | Nikon Corp | マスク収納容器開装置、露光装置 |
JP2015093696A (ja) * | 2013-11-12 | 2015-05-18 | ヒューグルエレクトロニクス株式会社 | 基板ケース分離合体装置及び基板ケース洗浄装置 |
Also Published As
Publication number | Publication date |
---|---|
US20220172974A1 (en) | 2022-06-02 |
EP3929118A1 (en) | 2021-12-29 |
EP3929118A4 (en) | 2022-10-26 |
CN113474267B (zh) | 2022-09-20 |
JP7127731B2 (ja) | 2022-08-30 |
TWI814990B (zh) | 2023-09-11 |
WO2020170671A1 (ja) | 2020-08-27 |
US11961752B2 (en) | 2024-04-16 |
CN113474267A (zh) | 2021-10-01 |
TW202039334A (zh) | 2020-11-01 |
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