JPWO2020069159A5 - - Google Patents

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Publication number
JPWO2020069159A5
JPWO2020069159A5 JP2021517283A JP2021517283A JPWO2020069159A5 JP WO2020069159 A5 JPWO2020069159 A5 JP WO2020069159A5 JP 2021517283 A JP2021517283 A JP 2021517283A JP 2021517283 A JP2021517283 A JP 2021517283A JP WO2020069159 A5 JPWO2020069159 A5 JP WO2020069159A5
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JP
Japan
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configuration
impact wires
impact
direct transfer
wires
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JP2021517283A
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English (en)
Japanese (ja)
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JP2022500881A (ja
JP2022500881A5 (https=
JP7254170B2 (ja
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Priority claimed from US16/147,055 external-priority patent/US11232968B2/en
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Publication of JP2022500881A5 publication Critical patent/JP2022500881A5/ja
Publication of JPWO2020069159A5 publication Critical patent/JPWO2020069159A5/ja
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JP2021517283A 2018-09-28 2019-09-26 半導体デバイスを転写するための可変ピッチマルチニードルヘッド Active JP7254170B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/147,055 US11232968B2 (en) 2018-09-28 2018-09-28 Variable pitch multi-needle head for transfer of semiconductor devices
US16/147,055 2018-09-28
PCT/US2019/053199 WO2020069159A1 (en) 2018-09-28 2019-09-26 Variable pitch multi-needle head for transfer of semiconductor devices

Publications (4)

Publication Number Publication Date
JP2022500881A JP2022500881A (ja) 2022-01-04
JP2022500881A5 JP2022500881A5 (https=) 2022-09-20
JPWO2020069159A5 true JPWO2020069159A5 (https=) 2022-09-20
JP7254170B2 JP7254170B2 (ja) 2023-04-07

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ID=69946573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021517283A Active JP7254170B2 (ja) 2018-09-28 2019-09-26 半導体デバイスを転写するための可変ピッチマルチニードルヘッド

Country Status (7)

Country Link
US (1) US11232968B2 (https=)
EP (1) EP3857594A4 (https=)
JP (1) JP7254170B2 (https=)
KR (1) KR102551661B1 (https=)
CN (1) CN112020767B (https=)
TW (1) TWI731423B (https=)
WO (1) WO2020069159A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11001078B2 (en) 2018-09-28 2021-05-11 Rohinni, LLC Interchangeable guide head for transfer mechanism
US11217471B2 (en) 2019-03-06 2022-01-04 Rohinni, LLC Multi-axis movement for transfer of semiconductor devices
US10923378B2 (en) * 2019-05-13 2021-02-16 Seagate Technology Llc Micro-component batch transfer systems, methods, and devices
DE102020001439B3 (de) * 2020-02-21 2021-06-10 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger

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JPH08266980A (ja) 1995-04-03 1996-10-15 Shibuya Kogyo Co Ltd フラックス転写装置
US6283693B1 (en) * 1999-11-12 2001-09-04 General Semiconductor, Inc. Method and apparatus for semiconductor chip handling
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JP2003289084A (ja) * 2002-03-28 2003-10-10 Sanken Electric Co Ltd 半導体素子ピックアップ装置
KR20050009034A (ko) * 2003-07-15 2005-01-24 삼성전자주식회사 칩 분리 장치
JP4624813B2 (ja) * 2005-01-21 2011-02-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置
US7560303B2 (en) 2006-11-07 2009-07-14 Avery Dennison Corporation Method and apparatus for linear die transfer
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
JP5174432B2 (ja) * 2007-11-12 2013-04-03 Ｊｕｋｉ株式会社 部品供給装置
WO2012142177A2 (en) 2011-04-11 2012-10-18 Ndsu Research Foundation Selective laser-assisted transfer of discrete components
DE102011104225B4 (de) 2011-06-15 2017-08-24 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Positionieren eines elektronischen Bauteils und / oder eines Trägers relativ zu einer Ausstoßeinrichtung
KR20130077311A (ko) * 2011-12-29 2013-07-09 한미반도체 주식회사 픽업유닛 및 픽업장치
RU2498449C1 (ru) 2012-05-12 2013-11-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) Контактирующее устройство
DE102012013370B4 (de) * 2012-07-04 2017-11-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Montagevorrichtung und Verfahren zum Fixieren einer Nadel in einem Nadelhalter einer Ausstoßvorrichtung zum Abheben eines Chips von einem Trägermaterial
US9659837B2 (en) 2015-01-30 2017-05-23 Semiconductor Components Industries, Llc Direct bonded copper semiconductor packages and related methods
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
JP6632856B2 (ja) * 2015-10-16 2020-01-22 東レエンジニアリング株式会社 ボンディングヘッドおよび実装装置
SG11201900112TA (en) 2016-07-05 2019-02-27 Canon Machinery Inc Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device, die bonder, bonding method, semiconductor manufacturing method, and semiconductor device manufacturing method
JP6637397B2 (ja) * 2016-09-12 2020-01-29 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
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JP6885456B2 (ja) 2017-02-22 2021-06-16 新東工業株式会社 テストシステム
TWM557658U (zh) 2017-12-01 2018-04-01 浮雕精密有限公司 戳針機
US10573543B2 (en) 2018-04-30 2020-02-25 Cree, Inc. Apparatus and methods for mass transfer of electronic die
US11001078B2 (en) 2018-09-28 2021-05-11 Rohinni, LLC Interchangeable guide head for transfer mechanism
US11217471B2 (en) 2019-03-06 2022-01-04 Rohinni, LLC Multi-axis movement for transfer of semiconductor devices

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