TWI731423B - 用於轉移半導體器件的可變節距多針頭 - Google Patents

用於轉移半導體器件的可變節距多針頭 Download PDF

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TWI731423B
TWI731423B TW108135266A TW108135266A TWI731423B TW I731423 B TWI731423 B TW I731423B TW 108135266 A TW108135266 A TW 108135266A TW 108135266 A TW108135266 A TW 108135266A TW I731423 B TWI731423 B TW I731423B
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collision
transfer
substrate
semiconductor device
configuration
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TW108135266A
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English (en)
Chinese (zh)
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TW202030818A (zh
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可迪 皮特森
安德魯 賀斯卡
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美商羅茵尼公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7408—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including alignment aids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7432—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/161—Aligning
    • H10W80/163—Aligning using active alignment, e.g. detecting marks and correcting position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H10W80/211—Direct bonding of chips, wafers or substrates using auxiliary members, e.g. aids for protecting the bonding area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/794—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Die Bonding (AREA)
TW108135266A 2018-09-28 2019-09-27 用於轉移半導體器件的可變節距多針頭 TWI731423B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/147,055 US11232968B2 (en) 2018-09-28 2018-09-28 Variable pitch multi-needle head for transfer of semiconductor devices
US16/147,055 2018-09-28

Publications (2)

Publication Number Publication Date
TW202030818A TW202030818A (zh) 2020-08-16
TWI731423B true TWI731423B (zh) 2021-06-21

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Family Applications (1)

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TW108135266A TWI731423B (zh) 2018-09-28 2019-09-27 用於轉移半導體器件的可變節距多針頭

Country Status (7)

Country Link
US (1) US11232968B2 (https=)
EP (1) EP3857594A4 (https=)
JP (1) JP7254170B2 (https=)
KR (1) KR102551661B1 (https=)
CN (1) CN112020767B (https=)
TW (1) TWI731423B (https=)
WO (1) WO2020069159A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11001078B2 (en) 2018-09-28 2021-05-11 Rohinni, LLC Interchangeable guide head for transfer mechanism
US11217471B2 (en) 2019-03-06 2022-01-04 Rohinni, LLC Multi-axis movement for transfer of semiconductor devices
US10923378B2 (en) * 2019-05-13 2021-02-16 Seagate Technology Llc Micro-component batch transfer systems, methods, and devices
DE102020001439B3 (de) * 2020-02-21 2021-06-10 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Übertragen elektronischer Bauteile von einem ersten zu einem zweiten Träger

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9633883B2 (en) * 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
TW201812286A (zh) * 2016-07-05 2018-04-01 佳能機械股份有限公司 缺陷檢測裝置、缺陷檢測方法、晶圓、半導體晶片、半導體裝置、黏晶機、接合方法、半導體製造方法及半導體裝置製造方法
TWM557658U (zh) * 2017-12-01 2018-04-01 浮雕精密有限公司 戳針機
TW201831915A (zh) * 2017-02-22 2018-09-01 日商新東工業股份有限公司 測試系統
US20180261525A1 (en) * 2015-01-30 2018-09-13 Semiconductor Components Industries, Llc Direct bonded copper semiconductor packages and related methods

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2071144C1 (ru) 1991-12-03 1996-12-27 Анатолий Александрович Варламов Способ съема полупроводниковых кристаллов с эластичной пленки-носителя и устройство для съема полупроводниковых кристаллов с эластичной пленки-носителя
JPH08266980A (ja) 1995-04-03 1996-10-15 Shibuya Kogyo Co Ltd フラックス転写装置
US6283693B1 (en) * 1999-11-12 2001-09-04 General Semiconductor, Inc. Method and apparatus for semiconductor chip handling
US6551048B1 (en) 2000-07-12 2003-04-22 National Semiconductor Corporation Off-load system for semiconductor devices
US6975016B2 (en) 2002-02-06 2005-12-13 Intel Corporation Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof
JP2003289084A (ja) * 2002-03-28 2003-10-10 Sanken Electric Co Ltd 半導体素子ピックアップ装置
KR20050009034A (ko) * 2003-07-15 2005-01-24 삼성전자주식회사 칩 분리 장치
JP4624813B2 (ja) * 2005-01-21 2011-02-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置
US7560303B2 (en) 2006-11-07 2009-07-14 Avery Dennison Corporation Method and apparatus for linear die transfer
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
JP5174432B2 (ja) * 2007-11-12 2013-04-03 Ｊｕｋｉ株式会社 部品供給装置
WO2012142177A2 (en) 2011-04-11 2012-10-18 Ndsu Research Foundation Selective laser-assisted transfer of discrete components
DE102011104225B4 (de) 2011-06-15 2017-08-24 Mühlbauer Gmbh & Co. Kg Vorrichtung und Verfahren zum Positionieren eines elektronischen Bauteils und / oder eines Trägers relativ zu einer Ausstoßeinrichtung
KR20130077311A (ko) * 2011-12-29 2013-07-09 한미반도체 주식회사 픽업유닛 및 픽업장치
RU2498449C1 (ru) 2012-05-12 2013-11-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) Контактирующее устройство
DE102012013370B4 (de) * 2012-07-04 2017-11-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Montagevorrichtung und Verfahren zum Fixieren einer Nadel in einem Nadelhalter einer Ausstoßvorrichtung zum Abheben eines Chips von einem Trägermaterial
JP6632856B2 (ja) * 2015-10-16 2020-01-22 東レエンジニアリング株式会社 ボンディングヘッドおよび実装装置
JP6637397B2 (ja) * 2016-09-12 2020-01-29 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
US10297478B2 (en) * 2016-11-23 2019-05-21 Rohinni, LLC Method and apparatus for embedding semiconductor devices
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US10573543B2 (en) 2018-04-30 2020-02-25 Cree, Inc. Apparatus and methods for mass transfer of electronic die
US11001078B2 (en) 2018-09-28 2021-05-11 Rohinni, LLC Interchangeable guide head for transfer mechanism
US11217471B2 (en) 2019-03-06 2022-01-04 Rohinni, LLC Multi-axis movement for transfer of semiconductor devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180261525A1 (en) * 2015-01-30 2018-09-13 Semiconductor Components Industries, Llc Direct bonded copper semiconductor packages and related methods
US9633883B2 (en) * 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
TW201812286A (zh) * 2016-07-05 2018-04-01 佳能機械股份有限公司 缺陷檢測裝置、缺陷檢測方法、晶圓、半導體晶片、半導體裝置、黏晶機、接合方法、半導體製造方法及半導體裝置製造方法
TW201831915A (zh) * 2017-02-22 2018-09-01 日商新東工業股份有限公司 測試系統
TWM557658U (zh) * 2017-12-01 2018-04-01 浮雕精密有限公司 戳針機

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Publication number Publication date
US20200105570A1 (en) 2020-04-02
JP2022500881A (ja) 2022-01-04
EP3857594A1 (en) 2021-08-04
CN112020767B (zh) 2022-05-06
TW202030818A (zh) 2020-08-16
CN112020767A (zh) 2020-12-01
KR102551661B1 (ko) 2023-07-05
EP3857594A4 (en) 2022-06-22
JP7254170B2 (ja) 2023-04-07
WO2020069159A1 (en) 2020-04-02
KR20210058941A (ko) 2021-05-24
US11232968B2 (en) 2022-01-25

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