JP2008251668A5 - - Google Patents

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Publication number
JP2008251668A5
JP2008251668A5 JP2007088457A JP2007088457A JP2008251668A5 JP 2008251668 A5 JP2008251668 A5 JP 2008251668A5 JP 2007088457 A JP2007088457 A JP 2007088457A JP 2007088457 A JP2007088457 A JP 2007088457A JP 2008251668 A5 JP2008251668 A5 JP 2008251668A5
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JP
Japan
Prior art keywords
wire
capillary
substrate
pad
dummy pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007088457A
Other languages
English (en)
Japanese (ja)
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JP4530230B2 (ja
JP2008251668A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007088457A priority Critical patent/JP4530230B2/ja
Priority claimed from JP2007088457A external-priority patent/JP4530230B2/ja
Publication of JP2008251668A publication Critical patent/JP2008251668A/ja
Publication of JP2008251668A5 publication Critical patent/JP2008251668A5/ja
Application granted granted Critical
Publication of JP4530230B2 publication Critical patent/JP4530230B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007088457A 2007-03-29 2007-03-29 ワイヤーボンディング方法およびｌｅｄプリントヘッドの製造方法 Expired - Fee Related JP4530230B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007088457A JP4530230B2 (ja) 2007-03-29 2007-03-29 ワイヤーボンディング方法およびｌｅｄプリントヘッドの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007088457A JP4530230B2 (ja) 2007-03-29 2007-03-29 ワイヤーボンディング方法およびｌｅｄプリントヘッドの製造方法

Publications (3)

Publication Number Publication Date
JP2008251668A JP2008251668A (ja) 2008-10-16
JP2008251668A5 true JP2008251668A5 (https=) 2010-02-04
JP4530230B2 JP4530230B2 (ja) 2010-08-25

Family

ID=39976306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007088457A Expired - Fee Related JP4530230B2 (ja) 2007-03-29 2007-03-29 ワイヤーボンディング方法およびｌｅｄプリントヘッドの製造方法

Country Status (1)

Country Link
JP (1) JP4530230B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5126087B2 (ja) * 2009-01-28 2013-01-23 富士ゼロックス株式会社 Ｌｅｄ基板装置およびｌｅｄプリントヘッド
PH12012000317B1 (en) * 2011-10-25 2014-08-04 Asm Tech Singapore Pte Ltd Automatic wire tail adjustment system for wire bonders
JP6477053B2 (ja) * 2015-03-10 2019-03-06 富士ゼロックス株式会社 ワイヤーボンディング方法及び基板装置の製造方法
CN112242316B (zh) * 2019-07-16 2025-06-17 盛合晶微半导体(江阴)有限公司 焊线设备及焊线方法
JP7614792B2 (ja) 2020-11-06 2025-01-16 キヤノン株式会社 光プリントヘッドの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01241138A (ja) * 1988-03-23 1989-09-26 Toshiba Corp 半導体装置のワイヤボンディング方法
JPH05183191A (ja) * 1991-12-30 1993-07-23 Kyocera Corp Ｌｅｄプリントヘッド
JPH07321143A (ja) * 1994-05-25 1995-12-08 Sumitomo Electric Ind Ltd ワイヤボンディング方法およびその装置
JPH1187395A (ja) * 1997-09-05 1999-03-30 Hitachi Ltd ワイヤボンディング方法および装置
JP4840118B2 (ja) * 2006-12-13 2011-12-21 株式会社デンソー ワイヤボンディング方法およびワイヤボンディング装置

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