JP2008251668A5 - - Google Patents

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Publication number
JP2008251668A5
JP2008251668A5 JP2007088457A JP2007088457A JP2008251668A5 JP 2008251668 A5 JP2008251668 A5 JP 2008251668A5 JP 2007088457 A JP2007088457 A JP 2007088457A JP 2007088457 A JP2007088457 A JP 2007088457A JP 2008251668 A5 JP2008251668 A5 JP 2008251668A5
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JP
Japan
Prior art keywords
wire
capillary
substrate
pad
dummy pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007088457A
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Japanese (ja)
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JP4530230B2 (en
JP2008251668A (en
Filing date
Publication date
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Priority to JP2007088457A priority Critical patent/JP4530230B2/en
Priority claimed from JP2007088457A external-priority patent/JP4530230B2/en
Publication of JP2008251668A publication Critical patent/JP2008251668A/en
Publication of JP2008251668A5 publication Critical patent/JP2008251668A5/ja
Application granted granted Critical
Publication of JP4530230B2 publication Critical patent/JP4530230B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (4)

基板に形成された複数の基板パッドと、
基板に実装された電子部品の表面に形成された複数の素子パッドとをキャピラリの先端から突出したワイヤーにより結線するワイヤーボンディング法において、
前記キャピラリの先端から突出したワイヤーを前記キャピラリによって前記基板パッドに押し付けて前記基板パッドに該ワイヤーを接続
該ワイヤーを引き出しながら前記キャピラリを移動
該ワイヤーを前記キャピラリによって前記素子パッドに押し付けて前記素子パッドに前記ワイヤーを接続ると同時に前記ワイヤーを切断する一連の動作を複数回行った後、
前記キャピラリの先端から突出したワイヤーを前記キャピラリによって前記基板に形成されたダミーパッドに押し付けて該ダミーパッドに該ワイヤーを接続
該ワイヤーを引き出しながら前記キャピラリを移動
該ワイヤーを前記キャピラリによって前記ダミーパッドに押し付けて該ダミーパッドに前記ワイヤーを接続ると同時に前記ワイヤーを切断することを特徴とするワイヤーボンディング方法
A plurality of substrate pads formed on the substrate;
In wire bonding how for connecting the protruding wire and a plurality of elements pads formed on the mounting surface of the electronic component on the substrate from the distal end of the capillary,
The wire connected to the substrate pads wire protruding from the tip of the capillary against the board pads by said capillary,
While pulling the wire by moving the capillary,
After several times a series of operations for cutting the same time the wire Tying wires to the device pad pressed against the element pad by the wire the capillary,
The wire connected to the dummy pad is pressed against a wire protruding from the tip of the capillary to the dummy pad formed on the substrate by the capillary,
While pulling the wire by moving the capillary,
Wire bonding method characterized by the wire against the dummy pad by the capillary cutting at the same time the wire Tying the wire to the dummy pad
前記ダミーパッドは、基板パッドの一部または基板パッドに接続された配線パターンである請求項1に記載のワイヤーボンディング方法   The wire bonding method according to claim 1, wherein the dummy pad is a part of a substrate pad or a wiring pattern connected to the substrate pad. 複数のLEDアレイが実装された基板と、
該基板が固定されたベースと、
該ベースに固定され、レンズアレイを有するカバーとを備えたLEDプリントヘッドの製造方法において、
前記基板は、
基板に形成された複数の基板パッドと、
基板に実装されたLEDアレイの表面に形成された複数の素子パッドとをキャピラリによりワイヤーボンディングするに際し
前記キャピラリの先端から突出したワイヤーを前記キャピラリによって前記基板パッドに押し付けて前記基板パッドに該ワイヤーを接続
該ワイヤーを引き出しながら前記キャピラリを移動
該ワイヤーを前記キャピラリによって前記素子パッドに押し付けて前記素子パッドに前記ワイヤーを接続させると同時に前記ワイヤーを切断する一連の動作を複数回行った後、
前記キャピラリの先端から突出したワイヤーを前記キャピラリによって前記基板に形成された前記ダミーパッドに押し付けて前記ダミーパッドに該ワイヤーを接続
該ワイヤーを引き出しながら前記キャピラリを移動
該ワイヤーを前記キャピラリによって前記ダミーパッドに押し付けて前記ダミーパッドに前記ワイヤーを接続ると同時に前記ワイヤーを切断することを特徴とするLEDプリントヘッド製造方法
A substrate on which a plurality of LED arrays are mounted;
A base to which the substrate is fixed;
In the manufacturing method of the LED print head comprising the cover having the lens array fixed to the base
The substrate is
A plurality of substrate pads formed on said substrate,
Upon wire-bonded by capillary and a plurality of elements pad formed on the surface of the LED array mounted on said substrate,
The wire connected to the substrate pads wire protruding from the tip of the capillary against the board pads by said capillary,
While pulling the wire by moving the capillary,
After performing a series of operations for cutting the wire at the same time as connecting the wire to the element pad by pressing the wire against the element pad by the capillary,
The wire connected to the dummy pad is pressed against a wire protruding from the tip of the capillary to the dummy pad formed on the substrate by the capillary,
While pulling the wire by moving the capillary,
Method for manufacturing an LED print head, characterized by cutting at the same time the wire Tying the wire to the dummy pad pressed against the dummy pad the wire by the capillary
前記ダミーパッドは、基板パッドの一部または基板パッドに接続された配線パターンである請求項に記載のLEDプリントヘッド製造方法
4. The method of manufacturing an LED print head according to claim 3 , wherein the dummy pad is a part of a substrate pad or a wiring pattern connected to the substrate pad.
JP2007088457A 2007-03-29 2007-03-29 Wire bonding method and LED print head manufacturing method Expired - Fee Related JP4530230B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007088457A JP4530230B2 (en) 2007-03-29 2007-03-29 Wire bonding method and LED print head manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007088457A JP4530230B2 (en) 2007-03-29 2007-03-29 Wire bonding method and LED print head manufacturing method

Publications (3)

Publication Number Publication Date
JP2008251668A JP2008251668A (en) 2008-10-16
JP2008251668A5 true JP2008251668A5 (en) 2010-02-04
JP4530230B2 JP4530230B2 (en) 2010-08-25

Family

ID=39976306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007088457A Expired - Fee Related JP4530230B2 (en) 2007-03-29 2007-03-29 Wire bonding method and LED print head manufacturing method

Country Status (1)

Country Link
JP (1) JP4530230B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5126087B2 (en) * 2009-01-28 2013-01-23 富士ゼロックス株式会社 LED substrate device and LED print head
SG189657A1 (en) * 2011-10-25 2013-05-31 Asm Tech Singapore Pte Ltd Automatic wire tail adjustment system for wire bonders
JP6477053B2 (en) * 2015-03-10 2019-03-06 富士ゼロックス株式会社 Wire bonding method and substrate device manufacturing method
JP2022075327A (en) 2020-11-06 2022-05-18 キヤノン株式会社 Optical print head and method for manufacturing optical print head

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01241138A (en) * 1988-03-23 1989-09-26 Toshiba Corp Wire bonding of semiconductor device
JPH05183191A (en) * 1991-12-30 1993-07-23 Kyocera Corp Led print head
JPH07321143A (en) * 1994-05-25 1995-12-08 Sumitomo Electric Ind Ltd Wire bonding method and device
JPH1187395A (en) * 1997-09-05 1999-03-30 Hitachi Ltd Method and apparatus for wire-bonding
JP4840118B2 (en) * 2006-12-13 2011-12-21 株式会社デンソー Wire bonding method and wire bonding apparatus

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