JP2008251668A5 - - Google Patents
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- JP2008251668A5 JP2008251668A5 JP2007088457A JP2007088457A JP2008251668A5 JP 2008251668 A5 JP2008251668 A5 JP 2008251668A5 JP 2007088457 A JP2007088457 A JP 2007088457A JP 2007088457 A JP2007088457 A JP 2007088457A JP 2008251668 A5 JP2008251668 A5 JP 2008251668A5
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- JP
- Japan
- Prior art keywords
- wire
- capillary
- substrate
- pad
- dummy pad
- Prior art date
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Claims (4)
該基板に実装された電子部品の表面に形成された複数の素子パッドとをキャピラリの先端から突出したワイヤーにより結線するワイヤーボンディング方法において、
前記キャピラリの先端から突出したワイヤーを前記キャピラリによって前記基板パッドに押し付けて前記基板パッドに該ワイヤーを接続し、
該ワイヤーを引き出しながら前記キャピラリを移動し、
該ワイヤーを前記キャピラリによって前記素子パッドに押し付けて前記素子パッドに前記ワイヤーを接続すると同時に前記ワイヤーを切断する一連の動作を複数回行った後、
前記キャピラリの先端から突出したワイヤーを前記キャピラリによって前記基板に形成されたダミーパッドに押し付けて該ダミーパッドに該ワイヤーを接続し、
該ワイヤーを引き出しながら前記キャピラリを移動し、
該ワイヤーを前記キャピラリによって前記ダミーパッドに押し付けて該ダミーパッドに前記ワイヤーを接続すると同時に前記ワイヤーを切断することを特徴とするワイヤーボンディング方法 A plurality of substrate pads formed on the substrate;
In wire bonding how for connecting the protruding wire and a plurality of elements pads formed on the mounting surface of the electronic component on the substrate from the distal end of the capillary,
The wire connected to the substrate pads wire protruding from the tip of the capillary against the board pads by said capillary,
While pulling the wire by moving the capillary,
After several times a series of operations for cutting the same time the wire Tying wires to the device pad pressed against the element pad by the wire the capillary,
The wire connected to the dummy pad is pressed against a wire protruding from the tip of the capillary to the dummy pad formed on the substrate by the capillary,
While pulling the wire by moving the capillary,
Wire bonding method characterized by the wire against the dummy pad by the capillary cutting at the same time the wire Tying the wire to the dummy pad
該基板が固定されたベースと、
該ベースに固定され、レンズアレイを有するカバーとを備えたＬＥＤプリントヘッドの製造方法において、
前記基板は、
該基板に形成された複数の基板パッドと、
該基板に実装されたＬＥＤアレイの表面に形成された複数の素子パッドとをキャピラリによりワイヤーボンディングするに際し、
前記キャピラリの先端から突出したワイヤーを前記キャピラリによって前記基板パッドに押し付けて前記基板パッドに該ワイヤーを接続し、
該ワイヤーを引き出しながら前記キャピラリを移動し、
該ワイヤーを前記キャピラリによって前記素子パッドに押し付けて前記素子パッドに前記ワイヤーを接続させると同時に前記ワイヤーを切断する一連の動作を複数回行った後、
前記キャピラリの先端から突出したワイヤーを前記キャピラリによって前記基板に形成された前記ダミーパッドに押し付けて前記ダミーパッドに該ワイヤーを接続し、
該ワイヤーを引き出しながら前記キャピラリを移動し、
該ワイヤーを前記キャピラリによって前記ダミーパッドに押し付けて前記ダミーパッドに前記ワイヤーを接続すると同時に前記ワイヤーを切断することを特徴とするＬＥＤプリントヘッドの製造方法 A substrate on which a plurality of LED arrays are mounted;
A base to which the substrate is fixed;
In the manufacturing method of the LED print head comprising the cover having the lens array fixed to the base
The substrate is
A plurality of substrate pads formed on said substrate,
Upon wire-bonded by capillary and a plurality of elements pad formed on the surface of the LED array mounted on said substrate,
The wire connected to the substrate pads wire protruding from the tip of the capillary against the board pads by said capillary,
While pulling the wire by moving the capillary,
After performing a series of operations for cutting the wire at the same time as connecting the wire to the element pad by pressing the wire against the element pad by the capillary,
The wire connected to the dummy pad is pressed against a wire protruding from the tip of the capillary to the dummy pad formed on the substrate by the capillary,
While pulling the wire by moving the capillary,
Method for manufacturing an LED print head, characterized by cutting at the same time the wire Tying the wire to the dummy pad pressed against the dummy pad the wire by the capillary
4. The method of manufacturing an LED print head according to claim 3 , wherein the dummy pad is a part of a substrate pad or a wiring pattern connected to the substrate pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007088457A JP4530230B2 (en) | 2007-03-29 | 2007-03-29 | Wire bonding method and LED print head manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007088457A JP4530230B2 (en) | 2007-03-29 | 2007-03-29 | Wire bonding method and LED print head manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008251668A JP2008251668A (en) | 2008-10-16 |
| JP2008251668A5 true JP2008251668A5 (en) | 2010-02-04 |
| JP4530230B2 JP4530230B2 (en) | 2010-08-25 |
Family
ID=39976306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007088457A Expired - Fee Related JP4530230B2 (en) | 2007-03-29 | 2007-03-29 | Wire bonding method and LED print head manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4530230B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5126087B2 (en) * | 2009-01-28 | 2013-01-23 | 富士ゼロックス株式会社 | LED substrate device and LED print head |
| SG189657A1 (en) * | 2011-10-25 | 2013-05-31 | Asm Tech Singapore Pte Ltd | Automatic wire tail adjustment system for wire bonders |
| JP6477053B2 (en) * | 2015-03-10 | 2019-03-06 | 富士ゼロックス株式会社 | Wire bonding method and substrate device manufacturing method |
| JP2022075327A (en) | 2020-11-06 | 2022-05-18 | キヤノン株式会社 | Optical print head and method for manufacturing optical print head |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01241138A (en) * | 1988-03-23 | 1989-09-26 | Toshiba Corp | Wire bonding of semiconductor device |
| JPH05183191A (en) * | 1991-12-30 | 1993-07-23 | Kyocera Corp | Led print head |
| JPH07321143A (en) * | 1994-05-25 | 1995-12-08 | Sumitomo Electric Ind Ltd | Wire bonding method and device |
| JPH1187395A (en) * | 1997-09-05 | 1999-03-30 | Hitachi Ltd | Method and apparatus for wire-bonding |
| JP4840118B2 (en) * | 2006-12-13 | 2011-12-21 | 株式会社デンソー | Wire bonding method and wire bonding apparatus |
-
2007
- 2007-03-29 JP JP2007088457A patent/JP4530230B2/en not_active Expired - Fee Related
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