JP6477053B2 - Wire bonding method and substrate device manufacturing method - Google Patents

Description

  The present invention relates to a substrate, a substrate device, an optical device, an image forming apparatus, a wire bonding method, and a substrate device manufacturing method.

  Patent Document 1 discloses a technique relating to a wire bonding method in which a plurality of substrate pads formed on a substrate and a plurality of element pads formed on the surface of an electronic component mounted on the substrate are connected by wires coming from capillaries. It is disclosed. In this prior art, in addition to the substrate pad, a dummy pad having a hardness higher than that of the element pad is provided on the substrate, wire bonding is performed a plurality of times in the order of the element pad and the substrate pad, and then wire bonding is performed on the dummy pad. As a result, the aluminum deposited on the tip of the capillary is removed.

JP 2008-251668 A

Compared with the case where the entire surface of the third terminal of the substrate is flat, the present invention removes the adhering matter adhering to the tip of the capillary in a short time, and the connection between the terminal on the component side and the terminal on the substrate is achieved in a short time. Completion is a challenge.

The substrate of the first aspect includes a first terminal on which a component having a component-side terminal is mounted, a second terminal connected to the component-side terminal by a wire, and a recess, and the component-side terminal in the recess And a third terminal to which at least one of the metal constituting the wire and the metal constituting the wire adheres.

The substrate of the second aspect includes a plurality of the second terminals, and the third terminal is integrated with one of the plurality of second terminals.

In the substrate of the third aspect , the third terminal is electrically connected to the ground wiring on a layer different from the layer provided with the third terminal by the recess.

Board device of the fourth embodiment, the components are mounted, the component-side terminal and the second terminal and said wire having the component side terminal board according to any one of the first aspect to third aspect Wired at

In the substrate device of the fifth aspect, the component is a light emitting element or a light receiving element.

The optical device of the sixth aspect, includes a substrate unit of the fifth aspect, a light emitting element or the light receiving element oppositely disposed lenses, and a housing for holding the said substrate and said device lens Yes.

The image forming apparatus of the seventh aspect, the component comprises an optical device according to the sixth aspect which is the light emitting device, the image carrier on which a latent image is exposed by the optical system is formed, the And an image forming unit that transfers and fixes a toner image developed by developing a latent image formed on the image holding member onto a recording medium.

The wire bonding method according to claim 1, wherein a first terminal on which a component having a component-side terminal is mounted, a second terminal connected to the component-side terminal by a wire, and a recess are formed, and the component is formed in the recess. Mounted on the first terminal provided on the board provided with a metal constituting the side terminal, a metal constituting the second terminal, and a third terminal to which at least one of the metals constituting the wire adheres. A wire bonding method for connecting the component-side terminal of the component and the second terminal provided on the substrate with the wire material, wherein the wire material protruding from the tip of the capillary is connected to the component side. Connect the wire by pressing against one of the terminal or the second terminal, move the capillary while pulling out the wire, and press the wire against the other of the component side terminal or the second terminal A connection step for connecting the wire and cutting the wire once or a plurality of times, and the component-side terminal attached to the tip portion in the recess of the third terminal after the connection step And a removal step of attaching and removing the same metal as any one of the metal constituting the second terminal, the metal constituting the second terminal, and the metal constituting the wire.

The method for manufacturing a substrate device according to claim 2 includes: a first terminal on which a component having a component-side terminal is mounted; a second terminal connected to the component-side terminal by a wire; and a recess; A first terminal provided on a board provided with a metal constituting the component-side terminal, a metal constituting the second terminal, and a third terminal to which at least one metal constituting the wire is adhered A mounting step of mounting the component having the component-side terminal, and the component-side terminal of the component mounted on the substrate using the wire bonding method according to claim 1 and the first provided on the substrate. A wire bonding step for connecting the two terminals.

According to the substrate described in the first aspect , the adhering matter adhering to the tip of the capillary can be removed in a shorter time than when the entire third terminal surface of the substrate is flat.

According to the substrate according to the second aspect, it is possible the third terminal and the second terminal is compared with the case where separate, to reduce the size of the substrate.

According to the substrate according to the third aspect, it is possible to third terminal is compared with the case that is not electrically connected to the ground layer, to prevent the accumulation of static electricity to the third terminal by the recess.

According to the substrate according to the fourth embodiment, as compared with the case the third terminal surface of the substrate is flat, it is possible to reduce the cost of manufacturing the substrate unit.

According to the substrate according to the fifth embodiment, as compared with the case the third terminal surface of the substrate is flat, the light emitting element or the light receiving element can reduce the cost of production has been board device mounted.

According to the optical device described in the sixth aspect , the manufacturing cost of the optical device can be reduced as compared with the case where the light emitting element or the light receiving element is mounted on the substrate device other than the substrate device according to claim 5. .

According to the image forming apparatus described in the seventh aspect , the manufacturing cost of the image forming apparatus can be reduced as compared with the case where an optical apparatus other than the optical apparatus described in claim 6 is provided.

According to the wire bonding method of the first aspect , the connection between the component-side terminal and the second terminal of the substrate can be completed in a short time compared to the case where the entire third terminal of the substrate is flat.

According to the manufacturing method of the substrate device of the second aspect , the manufacturing cost of the substrate device can be reduced as compared with the case where the entire third terminal of the substrate is flat.

1 is a schematic view (front view) of an image forming apparatus according to an embodiment. 1 is a perspective view showing a main part of an exposure apparatus constituting an image forming apparatus of an embodiment. 1 is a schematic view (side view) of an exposure apparatus that constitutes an image forming apparatus according to an embodiment. It is the schematic of the board | substrate apparatus which comprises the exposure apparatus of embodiment. It is a top view which shows typically the principal part of the board | substrate apparatus which comprises the exposure apparatus of embodiment. It is sectional drawing along the plate | board thickness direction of the site | part in which the dimple plating via of the 3rd terminal of the board | substrate of a board | substrate apparatus was formed. (A) is a sectional view along the axial direction of the capillary, (B) is a side view of a state in which a wire is projected from the tip of the capillary, and (C) is a ball formed at the tip of the capillary. It is a side view of a state. It is process drawing which shows the process of connecting a component side terminal and a 2nd terminal by wire bonding in order from (A) to (E). It is a top view which shows the state which the metal debris of the front-end | tip part of a capillary adhered to the edge of the dimple plating via by removal operation. It is a top view which shows the state which the metal debris of the front-end | tip part of a capillary adhered to the edge part of the dimple plating via by the removal operation | movement of a 1st modification. It is a top view which shows the state which the metal debris of the front-end | tip part of a capillary adhered to the edge part of the dimple plating via by the removal operation of a 2nd modification. It is a top view which shows typically the principal part of the board | substrate apparatus of a comparative example. It is a top view which shows the state which the metal residue of the front-end | tip part of a capillary adhered to the 3rd terminal by the removal operation in the case of the board | substrate apparatus of a comparative example. It is process drawing which shows the removal operation in the case of the board | substrate apparatus of a comparative example in order from (A) to (E).

<Image forming apparatus>
First, the image forming apparatus 10 including the exposure apparatus 70 as an example of an optical apparatus having the substrate apparatus 60 of the present embodiment will be described.

[Entire configuration of image forming apparatus]
The image forming apparatus 10 shown in FIG. 1 includes an image reading unit 25 that reads an image and an image forming apparatus main body 10A. The image forming apparatus main body 10 </ b> A includes the image forming unit 11 and the control device 24. The control device 24 controls the operation of each unit of the image forming apparatus 10.

[Layer reader]
The image reading unit 25 includes a light receiving device 27 that receives reflected light irradiated and reflected on a document placed on a platen glass (not shown). The light receiving device 27 converts the received reflected light into an electric signal and sends it to the control device 24.

[Image forming unit]
The image forming unit 11 includes a medium storage unit 12, a toner image forming unit 14, a transport unit 16, a fixing device 18, and a discharge unit 20. The image forming unit 11 finally transfers the toner image developed by developing the latent image formed on the photosensitive member 42 of the image forming unit 40 of the toner image forming unit 14 described later to the recording medium P, and transferring it to the recording medium P. To settle.

[Toner image forming section]
The toner image forming unit 14 includes image forming units 40Y, 40M, 40C, and 40K, and a transfer unit 50. Here, yellow (Y), magenta (M), cyan (C), and black (K) are examples of toner colors. The transfer unit 50 is an example of a transfer device.

(Image forming unit)
The image forming units 40Y, 40M, 40C, and 40K have substantially the same configuration except for the toner used.

  The image forming unit 40Y includes a photoreceptor 42Y, a charging device 44Y, an exposure device 70Y, and a developing device 46Y. Similarly, the image forming units 40M, 40C, and 40K correspond to the respective colors, and the photoreceptors 42M, 42C, and 42K, the charging devices 44M, 44C, and 44K, the exposure devices 70M, 70C, and 70K, and the developing device 46M. , 46C, 46K. In the following description, for the image forming units 40Y, 40M, 40C, and 40K and the members constituting them, (Y, M, C, and K) are omitted as appropriate when it is not necessary to distinguish between colors.

(Photoconductor)
The photoconductor 42 has a function of holding a toner image developed by the developing device 46 while rotating around its own axis. The photoreceptor 42 includes a base material and a photosensitive layer formed on the outer peripheral surface of the base material. Here, the photoconductor 42 is an example of an image carrier.

(Charging device)
The charging device 44 has a function of charging the photoreceptor 42.

(Exposure equipment)
The exposure device 70 as an example of an optical device has a function of forming a latent image on the charged photoreceptor 42. The exposure apparatus 70 will be described later because it is a main part of the present embodiment.

(Developer)
The developing device 46 has a function of developing the latent image formed on the photoreceptor 42 and developing it as a toner image.

[Transfer unit]
The transfer unit 50 has a function of first transferring the color toner images developed on the photoconductors 42 and then secondarily transferring the toner images to the recording medium P. The transfer unit 50 includes a transfer belt 52, a plurality of primary transfer rolls 54, a drive roll 56, and a secondary transfer roll 58.

[Fixing device]
The fixing device 18 has a function of fixing the toner image secondarily transferred to the recording medium P to the recording medium P by applying pressure while heating at the nip portion.

[Transport section and discharge section]
The transport unit 16 feeds the recording medium P stored in the medium storage unit 12 through a transport path 16 </ b> C including a secondary transfer unit (a portion where the drive roll 56 and the secondary transfer roll 58 face each other) and the nip portion of the fixing device 18. It has a function of conveying and discharging to the discharge unit 20. The conveyance unit 16 includes a delivery roll 16A and a plurality of conveyance roll pairs 16B.

[Supplement of image forming apparatus]
The primary transfer roll 54 and the secondary transfer roll 58 included in the charging device 44, the developing device 46, and the transfer unit 50 constituting the image forming apparatus 10 are each connected to a high voltage power source (not shown) so that a voltage is applied. It has become. In the image forming apparatus 10 of the present embodiment, the ground terminal of each high-voltage power supply and the base material of the photoreceptor 42 are grounded to the housing of the image forming apparatus main body 10A.

<Image Forming Operation of Image Forming Apparatus>
Next, an image forming operation in the image forming apparatus 10 shown in FIG. 1 will be described.

  An image signal transmitted from the image reading unit 25 or an external device (for example, a personal computer) is converted into image data of each color by the control device 24 and output to each exposure device 70.

  Subsequently, the exposure light emitted from each exposure device 70 is incident on each photoconductor 42 charged by each charging device 44 to form a latent image. Subsequently, each latent image is developed as a toner image of each color by each developing device 46. Subsequently, the toner images of the respective colors are primarily transferred to the transfer belt 52 by the respective primary transfer rolls 54.

  On the other hand, the recording medium P is conveyed and secondarily transferred in accordance with the timing at which the portion of the transfer belt 52 where the toner image is primarily transferred reaches the nip T.

  Subsequently, the recording medium P onto which the toner image has been secondarily transferred is conveyed toward the fixing device 18, and the toner image is fixed to the recording medium P.

  Then, the recording medium P on which the toner image is fixed is discharged to the discharge unit 20, and the image forming operation is completed.

<Configuration of exposure apparatus>
Next, an exposure apparatus 70 (an example of an optical apparatus) that is a main part of the present embodiment will be described with reference to the drawings.

  As shown in FIGS. 2 and 3, the exposure device 70 includes a substrate device 60, a lens array 80 as an example of a lens, and a housing 90.

[Substrate equipment]
As shown in FIGS. 2 and 3, the board device 60 includes a plurality of LED arrays (light emitting diode arrays) 62 mounted on a board 61 described later based on the image data converted by the control device 24 (see FIG. 1). LED (Light Emitting Diode) 74 (see FIG. 4) emits light toward the lens array 80. In the present invention, “mounting” refers to fixing a component to a terminal (pad) provided (formed) on the surface of a substrate using a bonding agent such as solder or adhesive.

  As shown in FIG. 4, the substrate 61 is a long glass epoxy plate, and a light emitting portion 65 is provided on the upper surface (the surface facing the photoreceptor 42). The light emitting unit 65 includes a plurality of LED arrays 62. The plurality of LED arrays 62 are mounted (arranged) in a zigzag pattern along the longitudinal direction of the substrate 61 on a first pad 110 described later formed on the upper surface of the substrate 61. In each LED array 62, a plurality of LEDs 74 are linearly arranged along the longitudinal direction of the LED array 62. Details of the substrate device 60 will be described later.

[Lens Array]
As shown in FIG. 3, the lens array 80 has a function of causing the light emitted from the LEDs 74 (see FIG. 4) of each LED array 62 to form an image on the photoconductor 42.

  As shown in FIGS. 2 and 3, the lens array 80 is long and is a SELFOC (registered trademark) lens array that is an aggregate of a plurality of rod lenses. As shown in FIG. 3, the lens array 80 is disposed between the substrate 61 and the photoreceptor 42 in the image forming apparatus 10.

[Case]
As shown in FIGS. 2 and 3, the housing 90 includes the substrate device 60 (substrate 61) and the lens array 80 so that the plurality of LEDs 74 (see FIG. 4) of the LED array 62 in the substrate device 60 and the lens array 80 face each other. It has a function of fixing the lens array 80.

  The casing 90 is long and is disposed such that its longitudinal direction is along the axial direction of the photoreceptor 42 (see FIG. 3). As shown in FIG. 3, a long through hole 92 is formed in the housing 90 so as to face the photoconductor 42 along the axial direction of the photoconductor 42.

  The lens array 80 is fixed to the housing 90 with an adhesive at the periphery of the opening on the photosensitive member 42 side in the long through hole 92. In addition, the substrate device 60 is fixed to the housing 90 with an adhesive so as to close the opening of the through hole 92 on the side opposite to the photoreceptor 42 side.

<Details about the substrate device>
As shown in FIG. 5, the LED array 62 as an example of the light-emitting element described above is bonded to the first pad 110 as an example of the first terminal of the substrate 61 by the adhesive on the substrate device 60, and is shown in FIG. Is implemented in a staggered pattern. The substrate 61 is a so-called multilayer substrate having a plurality of layers in the thickness direction, and a ROM, a connector, and the like (not shown) are mounted on the lower surface of the substrate 61.

  On the upper surface of the substrate 61 (the surface on the photoreceptor 42 side, see FIG. 3), the plurality of first pads 110, the plurality of second pads 112 as an example of the second terminal, and the first terminal as an example of the third terminal. Three pads 113 are provided. The LED array 62 mounted on the first pad 110 is provided with a plurality of component-side pads 100 as an example of component-side terminals. A plurality of first pads 110 are provided in a staggered manner, and a plurality of LED arrays 62 are mounted in a staggered manner, one on each first pad 110 (see FIG. 4).

  The component side pad 100 of the LED array 62 and the second pad 112 of the substrate 61 are connected (connected) with a wire 120 as an example of a wire. The wire 120 of this embodiment is a gold wire (Au wire). The second pad 112 includes a pad for sending an electrical signal of image data converted by the control device 24 to the LED array 62, a power supply pad of the LED array 62, and a ground pad.

  The third pad 113 functions as a removal pad that removes and removes the metal residue J (see FIG. 9) that adheres and accumulates on the tip portion 210 (see FIG. 7) of the capillary 200 of the wire bonding apparatus described later.

  Furthermore, in the present embodiment, the third pad 113 is one of the plurality of second pads 112 and is integrated with the second pad 112A that is a ground pad. In FIG. 5, the second pad 112 </ b> A is illustrated with an imaginary line (two-dot chain line) for the sake of explanation, but actually the second pad 112 </ b> A and the third pad 113 are integrated. The clear area is not specified.

  The third pad 113 is formed with a dimple plating via 150 as an example of a recess. Here, the dimple-plated via means a via (Via) that is recessed in a dimple shape and metal-plated as shown in FIG. As the metal constituting the metal plating, the same metal as that constituting the pad on which the dimple plating via is formed is employed. In other words, it can be said that the dimple-plated via is a type of dimple via that does not fill the via with plating in contrast to a filled via that fills and flattens the via with plating. Further, as shown in FIG. 6, the third pad 113 integrated with the second pad 112A, which is a ground pad, is provided with the third pad 113 (and the second pad 112) by the dimple plating via 150. It is electrically connected to a ground wiring (ground layer) 116 in another layer.

  Note that the inner diameter of the dimple plating via 150 in this embodiment is slightly larger than the outer diameter of the capillary 200. In other words, the inner diameter of the dimple-plated via 150 is such a size that the two tip portions 210 of the capillary 200 cannot be inserted.

(Wire bonding method)
Next, an example of a wire bonding method in which a plurality of component-side pads 100 of the LED array 62 and a plurality of second pads 112 of the substrate 61 are connected (connected) with wires 120 will be described.

  The wire 120 is a thin gold (Au) wire (gold wire) having a diameter of about 10 to 150 μm. Moreover, since the wire bonding apparatus should just use the well-known apparatus marketed, illustration and description other than the capillary 200 mentioned later are abbreviate | omitted and demonstrated.

  As shown in FIG. 7A, the capillary 200 has a through-hole 202 for supplying the wire 120 (FIG. 7B) to the shaft core portion. As the material of the capillary 200, ceramic, ruby, zirconium oxide, or the like can be used.

  First, as shown in FIG. 7B, a predetermined amount of wire 120 is protruded from the tip portion 210 of the capillary 200.

  Then, as shown in FIG. 7C, the torch 212 constituting a part of the wire bonding apparatus is positioned in the vicinity of the wire 120 protruding from the tip portion 210 of the capillary 200, and between the wire 120 and the torch 212. A voltage is applied to. When a voltage is applied, a spark is generated, and the tip of the wire 120 protruding from the tip 210 of the capillary 200 is melted by the spark to form a ball 122.

  FIG. 8 is a schematic view of the substrate 61 on which the LED array 62 is mounted as viewed from the side.

  As shown in FIG. 8A, the capillary 200 on which the ball 122 is formed is moved directly above the second pad 112.

  Then, as shown in FIG. 8B, the capillary 200 is lowered, the molten ball 122 is pressed against the second pad 112, and the wire 120 and the second pad 112 are connected by an ultrasonic combined thermocompression method. That is, ball bonding is performed.

  Thereafter, as shown in FIG. 8C, the capillary 200 is moved toward the component-side pad 100 of the LED array 62 while the wire 120 is pulled out from the tip end portion 210 of the capillary 200.

  8 (D) and 8 (E), the tip portion 210 of the capillary 200 is pressed against the component-side pad 100 to connect the wire 120 by the connecting ultrasonic wave thermocompression bonding method, and at the same time, the wire 120 is connected. Cut, that is, stitch bonding.

  7 and 8 is performed, the plurality of second pads 112 of the substrate 61 and the plurality of component-side pads 100 of the LED array 62 are electrically connected by the wires 120.

<Action and effect>
Next, functions and effects of the present embodiment will be described.

  When the above-described wire bonding operation is performed, the metal tip J (FIG. 6 and FIG. 9) mainly composed of a metal (for example, aluminum) constituting the metal layer of the component-side pad 100 is formed at the tip portion 210 of the capillary 200. Adhere) and deposit.

  Therefore, in order to remove the metal residue J deposited on the tip portion 210 of the capillary 200 during wire bonding, the metal residue J is removed after performing the above-described series of connection operations (connection process) once or a plurality of times. A removal operation (removal step) is performed. Next, the removal operation (removal process) of the metal residue J attached to the tip portion 210 of the capillary 200 will be described.

[Removal operation]
First, as described with reference to FIG. 7, the ball 122 is formed on the tip of the wire 120 protruding from the tip 210 of the capillary 200. Then, the tip portion 210 of the capillary 200 is moved onto the concave dimple plating via 150 of the third pad 113.

  Next, the tip portion 210 of the capillary 200 is lowered, and as shown in FIG. 9, the melted ball 122 is pressed almost to the center position of the bottom portion 152 (see FIG. 6) of the dimple plating via 150 to heat with ultrasonic waves. Connect by crimping, that is, perform ball bonding.

  Thereafter, the capillary 200 (see FIG. 7) is moved, for example, front and rear, left and right (up and down and left and right in FIG. 9), and the tip of the capillary 200 is placed on the upper edge 154 (see FIG. 6) of the dimple plating via 150. 210 (see FIG. 7) is rubbed to remove the metal residue J at the tip 210 of the capillary 200.

  More specifically, the metal residue J mainly composed of aluminum or the like deposited and deposited on the tip portion 210 of the capillary 200 digs into the dimple plating via 150 when the tip portion 210 of the capillary 200 is rubbed against the edge portion 154. . At that time, the metal debris J and the metal constituting the dimple plating via 150 form an alloy. Therefore, the metal residue J deposited and deposited on the tip portion 210 of the capillary 200 remains in the dimple plating via 150 and is removed.

  Then, at the time of the final rubbing, stitch bonding is performed on the edge portion 154 of the dimple plating via 150 to cut the wire 120.

  Here, the removal operation in the case of the substrate 800 of the comparative example having the flat third pad 813 on the entire surface where the dimple plating via 150 (see FIGS. 5 and 6) shown in FIG. 12 is not formed will be described.

  First, as shown in FIGS. 14A and 14B, ball bonding is performed by pressing the ball 122 against the third pad 813 to connect the wire 120 to the third pad 813, and then FIG. 14C. As shown in FIGS. 14D and 14E, the capillary 200 is moved while the wire 120 is pulled out from the distal end portion 210 of the capillary 200, and stitch bonding is performed at another location. By doing so, the metal residue J (see FIG. 13) attached to the tip portion 210 of the capillary 200 is removed.

  However, even if the series of removal operations shown in FIG. 14 (wire bonding (ball bonding + stitch bonding)) is performed once, only a part of the metal residue J (FIG. 13) at the tip 210 (see FIG. 14) of the capillary 200 is obtained. It may not be possible to remove it.

  Therefore, in order to remove the metal residue J from the tip portion 210 of the capillary 200, it is necessary to repeat the removal operation a plurality of times in different directions as shown in FIG. Note that FIG. 13 shows a state in which the metal residue J has been removed in three directions of the S1, S2, and S3 directions.

  In this way, in order to remove the metal residue J from the tip portion 210 of the capillary 200, the removal operation (wire bonding operation) is performed at least three times. Therefore, the removal time is long and the tip portion 210 of the capillary 200 moves. Since the distance is long, a lot of expensive gold (Au) wire (gold wire) 120 is consumed. Furthermore, a large area is required for the third pad 813 for the removal operation.

  On the other hand, in the substrate 61 of this embodiment shown in FIG. 9, the removal operation (wire bonding operation) is performed once by using the dimple plating via 150, and the movement of the tip portion 210 of the capillary 200 is performed. Since the distance is short, the consumption of the wire 120 is small. Furthermore, the area of the third pad 813 necessary for the removal operation can be smaller than that of the comparative example.

  Therefore, the removal operation of the substrate 61 of this embodiment can be completed in a shorter time than the substrate 800 of the comparative example. Thus, compared with the comparative example, the connection by the wire 120 between the plurality of component side pads 100 of the LED array 62 and the plurality of second pads 112 of the substrate 61 can be completed in a short time. Since the consumption of 120 is small and the area of the third pad can be reduced, the manufacturing cost of the substrate device 60 can be reduced.

  Further, the manufacturing cost of the exposure apparatus 70 and the image forming apparatus 10 can be reduced by reducing the manufacturing cost of the substrate device 60.

  In the substrate 61 of the present embodiment, the third pad 113 is integrated with the second pad 112A. Therefore, the substrate 61 can be downsized as compared with the case where the third pad 813 and the second pad 112 are separate as in the comparative example.

  Further, in the substrate 61 of the present embodiment, the third pad 113 is electrically connected to the ground wiring 116 by the dimple plating via 150. Therefore, even if static electricity is generated when the tip portion 210 of the capillary 200 is rubbed against the edge portion 154 of the dimple plating via 150 in the removing operation, the static electricity flows to the ground wiring 116 and is not easily accumulated on the third pad 113. Therefore, failure of various electronic components mounted on the substrate 61 due to static electricity is prevented.

<Modification>
Next, a modification of the removal operation of this embodiment will be described.

[First modification]
In the removal operation of the first modified example, as shown in FIG. 10, after ball bonding is performed outside the dimple plating via 150 of the third pad 113 of the substrate 61, the tip portion 210 of the capillary 200 is connected to the dimple plating via 150. Move upward.

  Then, the tip portion 210 of the capillary 200 is moved, for example, back and forth and left and right (up and down and left and right directions in FIG. 10), and the tip portion 210 of the capillary 200 is rubbed against the upper edge portion 154 of the dimple plating via 150. The metal residue J deposited on the tip portion 210 of the capillary 200 is removed.

  Further, at the time of the final rubbing, stitch bonding is performed on the edge portion 154 of the dimple plating via 150 to cut the wire 120.

[Second modification]
As shown in FIG. 11, the dimple plating via 151 of the third pad 113 of the substrate 61 is larger than the dimple plating via 150 shown in FIG. In this modification, the size is such that a plurality of (for example, three or more) tip portions 210 of the capillary 200 can be inserted into the dimple plating via 151.

  Then, the tip end portion 210 of the capillary 200 is rubbed against the edge portion 154 after ball bonding is performed in the vicinity of the edge portion 155 of the bottom portion 153 of the concave dimple plating via 151 of the third pad 113. Then, the metal residue J at the tip portion 210 of the capillary 200 is removed and stitch bonding is performed on the edge portion 154 to cut the wire 120.

  This removal operation is repeated while changing the direction, and the metal residue J at the tip portion 210 of the capillary 200 is removed. FIG. 11 shows a state in which the metal residue J is removed by performing the removing operation in the three directions of the S1, S2, and S3 directions.

  In the second modified example, since the dimple plating via 151 is large, a large number of portions to which the metal residue J is attached can be secured. Therefore, it is possible to cope with a large number of times of removing the metal residue J from the tip portion 210 of the capillary 200.

<Others>
In addition, this invention is not limited to the said embodiment.

  For example, in the embodiment described above, the metal debris mainly composed of aluminum is removed by the third pad 113, but the metal debris J is not limited to this.

  The metal debris J that may be attached to the tip portion 210 of the capillary 200 by wire bonding includes a metal constituting the component side pad 100, a metal constituting the second pad 112, and a metal constituting the third pad 113. Can be mentioned. For this reason, the metal debris containing at least one of the metal composing the component-side pad 100, the metal composing the second pad 112, and the metal composing the wire 120, which is an example of a wire rod, is formed on the tip portion 210 of the capillary 200. In the case where it is attached and deposited and needs to be removed, such metal debris may be removed by the third pad 113 by the removing operation described in the above embodiment.

  Further, for example, in the above-described embodiment, the third pad 113 is provided with only one dimple plating via 150, 151 as an example of a recess, but the present invention is not limited to this. The third pad 113 may be provided with a plurality of dimple plating vias 150 and 151. Moreover, the board | substrate provided with two or more 3rd pads 113 may be sufficient.

  Moreover, in the said embodiment, although the 3rd pad 113 and the 2nd pad 112 were integrated, it is not limited to this, The 3rd pad 113 may be provided independently, It may be integrated with a pad other than the second pad.

  In the above embodiment, the third pad 113 is electrically connected to the ground wiring (ground layer) 116 in a different layer by the dimple plating via 150. However, the present invention is not limited to this. It may not be electrically connected to the layer, or may be electrically connected to a layer other than the ground layer such as the power supply layer.

  Moreover, in the said embodiment, although this invention was applied to the exposure apparatus 70 provided with the board | substrate apparatus 60 with which the LED array 62 as an example of a light emitting element was mounted, it is not limited to this.

  For example, the present invention may be applied to a light receiving device 27 (an example of an optical device) of the image reading unit 25 including a substrate device on which a light receiving element is mounted. The light receiving device 27 to which the present invention is applied has the same configuration as that in which a light receiving element is mounted instead of the LED array 62 of the substrate device 60. Specifically, if the light emitting element (LED array 62) in the substrate device 60 is changed to a light receiving element, a light receiving substrate used in a contact image sensor (Contact Image Sensor) as an example of the image reading unit 25 is obtained. That is, in the present invention, a light receiving device 27 manufactured by using a light receiving substrate (an example of a substrate device) manufactured by changing a light emitting element to a light receiving element, and fixing the light receiving substrate and the lens array to face each other. Applicable to The light receiving device 27 is combined with the light source LED to form a contact image sensor. In the present invention, the light emitting element or the light receiving element is referred to as a component.

  The present invention may also be applied to a substrate device used for an apparatus other than the exposure apparatus 70 or the light receiving apparatus 27. Examples of components having component-side pads to be mounted on a substrate include an LSI (Large Scale Integration), a camera module, and a scanner head. Moreover, in the said embodiment, although the component side pad and the 2nd pad were provided with two or more, it is not limited to this, One may be sufficient.

  Further, for example, in the above-described embodiment, the wire rod is pressed and connected to the component-side terminal, the capillary is moved while the wire rod is pulled out, the wire rod is pressed against the second terminal and the wire rod is connected and cut, but the present invention is not limited thereto. . The wire may be pressed and connected to the second terminal, the capillary may be moved while the wire is pulled out, and the wire may be pressed against the component side terminal to connect the wire and cut.

  Further, the configuration of the image forming apparatus is not limited to the configuration of the above-described embodiment, and various configurations can be employed. Furthermore, it cannot be overemphasized that it can implement with a various aspect in the range which does not deviate from the summary of this invention.

10 Image forming apparatus.
12 Image forming unit 27 Light receiving device (an example of an optical device)
60 Substrate device 61 Substrate 62 LED array (an example of components and light-emitting elements)
70 exposure apparatus (an example of an optical apparatus)
80 Lens array (an example of a lens)
90 Housing 9
100 Component side pad (Example of component side terminal)
110 First pad (example of first terminal)
112 Second pad (example of second terminal)
113 Third pad (example of third terminal)
116 Ground wiring 120 Wire (an example of wire)
150 Dimple-plated via (an example of a recess)
151 Dimple plated via (an example of a recess)

Claims (2)

A first terminal on which a component having a component-side terminal is mounted; a second terminal connected to the component-side terminal by a wire; and a recess formed in the recess; a metal constituting the component-side terminal; A third terminal to which at least one of the metal constituting the two terminals and the metal constituting the wire adheres, and the component side terminal of the component mounted on the first terminal provided on the board provided with ,
The second terminal provided on the substrate;
A wire bonding method for connecting a wire with the wire,
The wire rod protruding from the tip of the capillary is pressed against one of the component-side terminal or the second terminal to connect the wire rod, and the capillary is moved while the wire rod is pulled out. Or a connection step of pressing the other terminal of the second terminal to connect the wire and cutting the wire once or a plurality of times.
After the connection step, at least one metal of the metal constituting the component-side terminal, the metal constituting the second terminal, and the metal constituting the wire rod attached to the tip of the concave portion of the third terminal A removal step of attaching and removing,
Wire bonding method with A first terminal on which a component having a component-side terminal is mounted; a second terminal connected to the component-side terminal by a wire; and a recess formed in the recess; a metal constituting the component-side terminal; The component having the component-side terminal is mounted on the first terminal provided on the substrate including a metal constituting the two terminals and a third terminal to which at least one metal of the metal constituting the wire is attached. Mounting process;
Using the wire bonding method according to claim 1 , a wire bonding step of connecting the component side terminal of the component mounted on the substrate and the second terminal provided on the substrate;
A method for manufacturing a substrate device comprising:

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