WO2004051745A3 - Elektronisches bauelement mit mehreren chips und verfahren zur herstellung - Google Patents

Elektronisches bauelement mit mehreren chips und verfahren zur herstellung Download PDF

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Publication number
WO2004051745A3
WO2004051745A3 PCT/DE2003/003769 DE0303769W WO2004051745A3 WO 2004051745 A3 WO2004051745 A3 WO 2004051745A3 DE 0303769 W DE0303769 W DE 0303769W WO 2004051745 A3 WO2004051745 A3 WO 2004051745A3
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Prior art keywords
chips
electronic component
same
producing
relates
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PCT/DE2003/003769
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English (en)
French (fr)
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WO2004051745A2 (de
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Ulrich Bauernschmitt
Veit Meister
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Epcos Ag
Ulrich Bauernschmitt
Veit Meister
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Application filed by Epcos Ag, Ulrich Bauernschmitt, Veit Meister filed Critical Epcos Ag
Publication of WO2004051745A2 publication Critical patent/WO2004051745A2/de
Publication of WO2004051745A3 publication Critical patent/WO2004051745A3/de

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
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Abstract

Die Erfindung betrifft ein elektronisches Bauelement mit mehreren Chips (CH1, CH2), die auf einer Basisplatte (BP) angeordnet sind und mit dieser mittels unterschiedlicher Verbindungstechniken, z. B. Flip-Chip-Technik, Surface Mounted Design oder Drahtbondtechnik elektrisch verbunden sind. Die Erfindung schlägt eine Verkapselung der Chips (individuell oder als Gruppe aus zumindest zwei Chips) mit einer Abdeckung (AB) sowie ein Verfahren zur Herstellung vor.
PCT/DE2003/003769 2002-12-05 2003-11-13 Elektronisches bauelement mit mehreren chips und verfahren zur herstellung WO2004051745A2 (de)

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DE10256945A1 (de) 2004-06-17

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