JPWO2019182913A5 - - Google Patents

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JPWO2019182913A5
JPWO2019182913A5 JP2020550765A JP2020550765A JPWO2019182913A5 JP WO2019182913 A5 JPWO2019182913 A5 JP WO2019182913A5 JP 2020550765 A JP2020550765 A JP 2020550765A JP 2020550765 A JP2020550765 A JP 2020550765A JP WO2019182913 A5 JPWO2019182913 A5 JP WO2019182913A5
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workpiece
data
processing
manufacturing platform
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JP2021518674A (ja
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JP2020550765A 2018-03-20 2019-03-15 統合的な半導体処理モジュールを組み込んだ自己認識及び補正異種プラットフォーム及びその使用方法 Active JP7348440B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201862645685P 2018-03-20 2018-03-20
US62/645,685 2018-03-20
US201962787607P 2019-01-02 2019-01-02
US201962787608P 2019-01-02 2019-01-02
US62/787,607 2019-01-02
US62/787,608 2019-01-02
US201962788195P 2019-01-04 2019-01-04
US62/788,195 2019-01-04
PCT/US2019/022608 WO2019182913A1 (en) 2018-03-20 2019-03-15 Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same

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JP2021518674A JP2021518674A (ja) 2021-08-02
JPWO2019182913A5 true JPWO2019182913A5 (ko) 2022-03-23
JP7348440B2 JP7348440B2 (ja) 2023-09-21

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US (9) US20200083070A1 (ko)
JP (1) JP7348440B2 (ko)
KR (3) KR20200123480A (ko)
CN (1) CN112074940A (ko)
SG (1) SG11202009105YA (ko)
TW (5) TW202004993A (ko)
WO (2) WO2019182913A1 (ko)

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