JPWO2019152340A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2019152340A5 JPWO2019152340A5 JP2020540804A JP2020540804A JPWO2019152340A5 JP WO2019152340 A5 JPWO2019152340 A5 JP WO2019152340A5 JP 2020540804 A JP2020540804 A JP 2020540804A JP 2020540804 A JP2020540804 A JP 2020540804A JP WO2019152340 A5 JPWO2019152340 A5 JP WO2019152340A5
- Authority
- JP
- Japan
- Prior art keywords
- interposer
- ultrasonic
- chip
- coupled
- vias
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862623948P | 2018-01-30 | 2018-01-30 | |
| US62/623,948 | 2018-01-30 | ||
| PCT/US2019/015518 WO2019152340A1 (en) | 2018-01-30 | 2019-01-29 | Methods and apparatuses for packaging an ultrasound-on-a-chip |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021511750A JP2021511750A (ja) | 2021-05-06 |
| JPWO2019152340A5 true JPWO2019152340A5 (https=) | 2022-02-04 |
| JP2021511750A5 JP2021511750A5 (https=) | 2022-02-04 |
Family
ID=67391191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020540804A Pending JP2021511750A (ja) | 2018-01-30 | 2019-01-29 | 超音波オンチップをパッケージする方法及び装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11389137B2 (https=) |
| EP (1) | EP3745961B1 (https=) |
| JP (1) | JP2021511750A (https=) |
| KR (1) | KR20200115558A (https=) |
| CN (1) | CN111683603A (https=) |
| TW (1) | TW201935639A (https=) |
| WO (1) | WO2019152340A1 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019152340A1 (en) | 2018-01-30 | 2019-08-08 | Butterfly Network, Inc. | Methods and apparatuses for packaging an ultrasound-on-a-chip |
| WO2019213449A2 (en) | 2018-05-03 | 2019-11-07 | Butterfly Network, Inc. | Ultrasound devices |
| CN112075090B (zh) | 2018-05-03 | 2022-10-14 | 蝴蝶网络有限公司 | 用于cmos传感器上的超声换能器的压力端口 |
| CA3105492A1 (en) | 2018-07-06 | 2020-01-09 | Butterfly Network, Inc. | Methods and apparatuses for packaging an ultrasound-on-a-chip |
| AU2019350989A1 (en) | 2018-09-28 | 2021-03-25 | Butterfly Network, Inc. | Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities |
| CA3118563A1 (en) | 2018-11-13 | 2020-05-22 | Butterfly Network, Inc. | Getter technology for micromachined ultrasonic transducer cavities |
| WO2020102492A1 (en) | 2018-11-15 | 2020-05-22 | Butterfly Network, Inc. | Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices |
| AU2019392906A1 (en) | 2018-12-07 | 2021-07-22 | Octant, Inc. | Systems for protein-protein interaction screening |
| TW202045099A (zh) | 2019-02-07 | 2020-12-16 | 美商蝴蝶網路公司 | 用於微加工超音波傳感器裝置的雙層金屬電極 |
| US11583894B2 (en) | 2019-02-25 | 2023-02-21 | Bfly Operations, Inc. | Adaptive cavity thickness control for micromachined ultrasonic transducer devices |
| US11484911B2 (en) | 2019-04-12 | 2022-11-01 | Bfly Operations, Inc. | Bottom electrode via structures for micromachined ultrasonic transducer devices |
| CN114555248A (zh) | 2019-04-12 | 2022-05-27 | 布弗莱运营公司 | 用于微加工超声换能器器件的分段式吸气剂开口 |
| US11501562B2 (en) | 2019-04-30 | 2022-11-15 | Bfly Operations, Inc. | Ultrasound face scanning and identification apparatuses and methods |
| US11684951B2 (en) | 2019-08-08 | 2023-06-27 | Bfly Operations, Inc. | Micromachined ultrasonic transducer devices having truncated circle shaped cavities |
| US11988640B2 (en) | 2020-03-11 | 2024-05-21 | Bfly Operations, Inc. | Bottom electrode material stack for micromachined ultrasonic transducer devices |
| TW202239483A (zh) | 2021-03-04 | 2022-10-16 | 美商蝴蝶營運公司 | 具有不均勻柱腳的電容式微加工超音波換能器 |
| TW202240165A (zh) | 2021-03-04 | 2022-10-16 | 美商蝴蝶營運公司 | 具有柱腳的微加工超音波換能器 |
| CN113441379B (zh) * | 2021-08-27 | 2021-11-23 | 南京声息芯影科技有限公司 | 适合高密度集成的PMUT-on-CMOS单元、阵列芯片及制造方法 |
| TWI860876B (zh) * | 2023-10-23 | 2024-11-01 | 啓碁科技股份有限公司 | 散熱結構 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003297966A (ja) * | 2002-03-29 | 2003-10-17 | Mitsubishi Electric Corp | 半導体装置 |
| US7550319B2 (en) * | 2005-09-01 | 2009-06-23 | E. I. Du Pont De Nemours And Company | Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
| US7687976B2 (en) * | 2007-01-31 | 2010-03-30 | General Electric Company | Ultrasound imaging system |
| US20080315331A1 (en) * | 2007-06-25 | 2008-12-25 | Robert Gideon Wodnicki | Ultrasound system with through via interconnect structure |
| JP2009065009A (ja) * | 2007-09-07 | 2009-03-26 | Mitsubishi Plastics Inc | 多層配線基板 |
| NZ589503A (en) | 2008-05-07 | 2013-07-26 | Signostics Ltd | Docking system for medical diagnostic scanning using a handheld device |
| US8426961B2 (en) * | 2010-06-25 | 2013-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Embedded 3D interposer structure |
| US8575558B2 (en) * | 2010-11-30 | 2013-11-05 | General Electric Company | Detector array with a through-via interposer |
| US8659148B2 (en) * | 2010-11-30 | 2014-02-25 | General Electric Company | Tileable sensor array |
| WO2012075153A2 (en) | 2010-12-03 | 2012-06-07 | Research Triangle Institute | Ultrasound device, and associated cable assembly |
| US8938136B2 (en) * | 2012-08-08 | 2015-01-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Opto-electronic system having flip-chip substrate mounting |
| WO2014123922A1 (en) | 2013-02-05 | 2014-08-14 | Butterfly Network, Inc. | Cmos ultrasonic transducers and related apparatus and methods |
| JP6232124B2 (ja) | 2013-03-15 | 2017-11-15 | バタフライ ネットワーク,インコーポレイテッド | 相補型金属酸化膜半導体(cmos)超音波振動子およびその形成方法 |
| KR20150065067A (ko) * | 2013-12-04 | 2015-06-12 | 삼성전자주식회사 | 정전용량 미세가공 초음파 변환기 및 그 제조방법 |
| US9067779B1 (en) | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| US9472483B2 (en) * | 2014-12-17 | 2016-10-18 | International Business Machines Corporation | Integrated circuit cooling apparatus |
| US20160009544A1 (en) | 2015-03-02 | 2016-01-14 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| JP6625441B2 (ja) | 2015-06-26 | 2019-12-25 | キヤノンメディカルシステムズ株式会社 | 超音波プローブ |
| KR20170019676A (ko) * | 2015-08-12 | 2017-02-22 | 삼성전자주식회사 | 반도체 장치의 제조 방법 |
| JP2017069652A (ja) * | 2015-09-28 | 2017-04-06 | キヤノン株式会社 | 超音波トランスデューサ及びこれを備えた被検体情報取得装置 |
| US11712221B2 (en) * | 2016-06-20 | 2023-08-01 | Bfly Operations, Inc. | Universal ultrasound device and related apparatus and methods |
| US10856840B2 (en) | 2016-06-20 | 2020-12-08 | Butterfly Network, Inc. | Universal ultrasound device and related apparatus and methods |
| US10196261B2 (en) * | 2017-03-08 | 2019-02-05 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| EP3642611B1 (en) | 2017-06-21 | 2024-02-14 | Butterfly Network, Inc. | Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections |
| EP3709894B1 (en) | 2017-11-15 | 2026-02-25 | BFLY Operations, Inc. | Ultrasound apparatuses and methods for fabricating ultrasound devices |
| WO2019152340A1 (en) | 2018-01-30 | 2019-08-08 | Butterfly Network, Inc. | Methods and apparatuses for packaging an ultrasound-on-a-chip |
| TW201947717A (zh) * | 2018-05-03 | 2019-12-16 | 美商蝴蝶網路公司 | 用於超音波晶片的垂直封裝及相關方法 |
-
2019
- 2019-01-29 WO PCT/US2019/015518 patent/WO2019152340A1/en not_active Ceased
- 2019-01-29 TW TW108103259A patent/TW201935639A/zh unknown
- 2019-01-29 CN CN201980010690.XA patent/CN111683603A/zh active Pending
- 2019-01-29 EP EP19747685.6A patent/EP3745961B1/en active Active
- 2019-01-29 US US16/260,242 patent/US11389137B2/en active Active
- 2019-01-29 JP JP2020540804A patent/JP2021511750A/ja active Pending
- 2019-01-29 KR KR1020207024309A patent/KR20200115558A/ko not_active Ceased
-
2022
- 2022-06-29 US US17/853,835 patent/US12178648B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2021511750A5 (https=) | ||
| JPWO2019152340A5 (https=) | ||
| JP2006512775A5 (https=) | ||
| JP2010251662A5 (https=) | ||
| JPH05211202A (ja) | 複合フリップ・チップ半導体装置とその製造およびバーンインの方法 | |
| JPWO2023034738A5 (https=) | ||
| CN101170867B (zh) | 配线电路基板和电子部件装置 | |
| JPH0917919A (ja) | 半導体装置 | |
| WO2004047168A1 (ja) | 電子装置 | |
| CN101236943A (zh) | 内埋芯片的散热型无芯板薄型基板及其制造方法 | |
| JP2010123592A (ja) | 半導体パッケージ及びその製造方法 | |
| JP2003007916A (ja) | 回路装置の製造方法 | |
| JP5184740B2 (ja) | 半導体チップパッケージ | |
| CN110600442A (zh) | 薄膜上芯片封装 | |
| JPH0575014A (ja) | 半導体チツプの実装構造 | |
| JP2008243966A (ja) | 電子部品が実装されたプリント基板及びその製造方法 | |
| TW200531235A (en) | Multi-chip package structure | |
| JP2001267449A (ja) | Lsiパッケ−ジ及びそれに用いる内部接続工法 | |
| JPH05211256A (ja) | 半導体装置 | |
| CN211208441U (zh) | 电子设备 | |
| JP4308765B2 (ja) | ボンディングワイヤ接続方法 | |
| JP2002093988A (ja) | 半導体集積回路パッケージ | |
| TWI231579B (en) | Flip chip package | |
| WO2022004403A1 (ja) | 多層配線基板および半導体装置 | |
| JP2004087700A (ja) | 半導体装置およびその製造方法 |