JPWO2019152340A5 - - Google Patents

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Publication number
JPWO2019152340A5
JPWO2019152340A5 JP2020540804A JP2020540804A JPWO2019152340A5 JP WO2019152340 A5 JPWO2019152340 A5 JP WO2019152340A5 JP 2020540804 A JP2020540804 A JP 2020540804A JP 2020540804 A JP2020540804 A JP 2020540804A JP WO2019152340 A5 JPWO2019152340 A5 JP WO2019152340A5
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JP
Japan
Prior art keywords
interposer
ultrasonic
chip
coupled
vias
Prior art date
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Pending
Application number
JP2020540804A
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English (en)
Japanese (ja)
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JP2021511750A (ja
JP2021511750A5 (https=
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Application filed filed Critical
Priority claimed from PCT/US2019/015518 external-priority patent/WO2019152340A1/en
Publication of JP2021511750A publication Critical patent/JP2021511750A/ja
Publication of JPWO2019152340A5 publication Critical patent/JPWO2019152340A5/ja
Publication of JP2021511750A5 publication Critical patent/JP2021511750A5/ja
Pending legal-status Critical Current

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JP2020540804A 2018-01-30 2019-01-29 超音波オンチップをパッケージする方法及び装置 Pending JP2021511750A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862623948P 2018-01-30 2018-01-30
US62/623,948 2018-01-30
PCT/US2019/015518 WO2019152340A1 (en) 2018-01-30 2019-01-29 Methods and apparatuses for packaging an ultrasound-on-a-chip

Publications (3)

Publication Number Publication Date
JP2021511750A JP2021511750A (ja) 2021-05-06
JPWO2019152340A5 true JPWO2019152340A5 (https=) 2022-02-04
JP2021511750A5 JP2021511750A5 (https=) 2022-02-04

Family

ID=67391191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020540804A Pending JP2021511750A (ja) 2018-01-30 2019-01-29 超音波オンチップをパッケージする方法及び装置

Country Status (7)

Country Link
US (2) US11389137B2 (https=)
EP (1) EP3745961B1 (https=)
JP (1) JP2021511750A (https=)
KR (1) KR20200115558A (https=)
CN (1) CN111683603A (https=)
TW (1) TW201935639A (https=)
WO (1) WO2019152340A1 (https=)

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CA3105492A1 (en) 2018-07-06 2020-01-09 Butterfly Network, Inc. Methods and apparatuses for packaging an ultrasound-on-a-chip
AU2019350989A1 (en) 2018-09-28 2021-03-25 Butterfly Network, Inc. Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities
CA3118563A1 (en) 2018-11-13 2020-05-22 Butterfly Network, Inc. Getter technology for micromachined ultrasonic transducer cavities
WO2020102492A1 (en) 2018-11-15 2020-05-22 Butterfly Network, Inc. Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices
AU2019392906A1 (en) 2018-12-07 2021-07-22 Octant, Inc. Systems for protein-protein interaction screening
TW202045099A (zh) 2019-02-07 2020-12-16 美商蝴蝶網路公司 用於微加工超音波傳感器裝置的雙層金屬電極
US11583894B2 (en) 2019-02-25 2023-02-21 Bfly Operations, Inc. Adaptive cavity thickness control for micromachined ultrasonic transducer devices
US11484911B2 (en) 2019-04-12 2022-11-01 Bfly Operations, Inc. Bottom electrode via structures for micromachined ultrasonic transducer devices
CN114555248A (zh) 2019-04-12 2022-05-27 布弗莱运营公司 用于微加工超声换能器器件的分段式吸气剂开口
US11501562B2 (en) 2019-04-30 2022-11-15 Bfly Operations, Inc. Ultrasound face scanning and identification apparatuses and methods
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TWI860876B (zh) * 2023-10-23 2024-11-01 啓碁科技股份有限公司 散熱結構

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