JPWO2023034738A5 - - Google Patents

Info

Publication number
JPWO2023034738A5
JPWO2023034738A5 JP2024513736A JP2024513736A JPWO2023034738A5 JP WO2023034738 A5 JPWO2023034738 A5 JP WO2023034738A5 JP 2024513736 A JP2024513736 A JP 2024513736A JP 2024513736 A JP2024513736 A JP 2024513736A JP WO2023034738 A5 JPWO2023034738 A5 JP WO2023034738A5
Authority
JP
Japan
Prior art keywords
interposer
laminate
substrate
redistribution layer
laminate substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024513736A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024532903A5 (https=
JP2024532903A (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/US2022/075576 external-priority patent/WO2023034738A1/en
Publication of JP2024532903A publication Critical patent/JP2024532903A/ja
Publication of JP2024532903A5 publication Critical patent/JP2024532903A5/ja
Publication of JPWO2023034738A5 publication Critical patent/JPWO2023034738A5/ja
Pending legal-status Critical Current

Links

JP2024513736A 2021-09-01 2022-08-29 インターポーザを備えた積層構造 Pending JP2024532903A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163239783P 2021-09-01 2021-09-01
US63/239,783 2021-09-01
PCT/US2022/075576 WO2023034738A1 (en) 2021-09-01 2022-08-29 Stacked structure with interposer

Publications (3)

Publication Number Publication Date
JP2024532903A JP2024532903A (ja) 2024-09-10
JP2024532903A5 JP2024532903A5 (https=) 2025-09-04
JPWO2023034738A5 true JPWO2023034738A5 (https=) 2025-09-04

Family

ID=85287152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024513736A Pending JP2024532903A (ja) 2021-09-01 2022-08-29 インターポーザを備えた積層構造

Country Status (6)

Country Link
US (1) US20230069183A1 (https=)
EP (1) EP4396872A4 (https=)
JP (1) JP2024532903A (https=)
KR (1) KR20240052815A (https=)
CN (1) CN118302858A (https=)
WO (1) WO2023034738A1 (https=)

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7109092B2 (en) 2003-05-19 2006-09-19 Ziptronix, Inc. Method of room temperature covalent bonding
US8735219B2 (en) 2012-08-30 2014-05-27 Ziptronix, Inc. Heterogeneous annealing method and device
US9953941B2 (en) 2015-08-25 2018-04-24 Invensas Bonding Technologies, Inc. Conductive barrier direct hybrid bonding
US10204893B2 (en) 2016-05-19 2019-02-12 Invensas Bonding Technologies, Inc. Stacked dies and methods for forming bonded structures
US10672663B2 (en) 2016-10-07 2020-06-02 Xcelsis Corporation 3D chip sharing power circuit
US10580735B2 (en) 2016-10-07 2020-03-03 Xcelsis Corporation Stacked IC structure with system level wiring on multiple sides of the IC die
US10719762B2 (en) 2017-08-03 2020-07-21 Xcelsis Corporation Three dimensional chip structure implementing machine trained network
TWI910033B (zh) 2016-10-27 2025-12-21 美商艾德亞半導體科技有限責任公司 用於低溫接合的結構和方法
US10002844B1 (en) 2016-12-21 2018-06-19 Invensas Bonding Technologies, Inc. Bonded structures
US20180182665A1 (en) 2016-12-28 2018-06-28 Invensas Bonding Technologies, Inc. Processed Substrate
KR102320673B1 (ko) 2016-12-28 2021-11-01 인벤사스 본딩 테크놀로지스 인코포레이티드 적층된 기판의 처리
KR20190092584A (ko) 2016-12-29 2019-08-07 인벤사스 본딩 테크놀로지스 인코포레이티드 집적된 수동 컴포넌트를 구비한 접합된 구조체
WO2018169968A1 (en) 2017-03-16 2018-09-20 Invensas Corporation Direct-bonded led arrays and applications
US10515913B2 (en) 2017-03-17 2019-12-24 Invensas Bonding Technologies, Inc. Multi-metal contact structure
US10508030B2 (en) 2017-03-21 2019-12-17 Invensas Bonding Technologies, Inc. Seal for microelectronic assembly
US10269756B2 (en) 2017-04-21 2019-04-23 Invensas Bonding Technologies, Inc. Die processing
US10879212B2 (en) 2017-05-11 2020-12-29 Invensas Bonding Technologies, Inc. Processed stacked dies
US10446441B2 (en) 2017-06-05 2019-10-15 Invensas Corporation Flat metal features for microelectronics applications
US10217720B2 (en) 2017-06-15 2019-02-26 Invensas Corporation Multi-chip modules formed using wafer-level processing of a reconstitute wafer
US10840205B2 (en) 2017-09-24 2020-11-17 Invensas Bonding Technologies, Inc. Chemical mechanical polishing for hybrid bonding
US11031285B2 (en) 2017-10-06 2021-06-08 Invensas Bonding Technologies, Inc. Diffusion barrier collar for interconnects
US11011503B2 (en) 2017-12-15 2021-05-18 Invensas Bonding Technologies, Inc. Direct-bonded optoelectronic interconnect for high-density integrated photonics
US11380597B2 (en) 2017-12-22 2022-07-05 Invensas Bonding Technologies, Inc. Bonded structures
US10727219B2 (en) 2018-02-15 2020-07-28 Invensas Bonding Technologies, Inc. Techniques for processing devices
US11169326B2 (en) 2018-02-26 2021-11-09 Invensas Bonding Technologies, Inc. Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
US11256004B2 (en) 2018-03-20 2022-02-22 Invensas Bonding Technologies, Inc. Direct-bonded lamination for improved image clarity in optical devices
US10991804B2 (en) 2018-03-29 2021-04-27 Xcelsis Corporation Transistor level interconnection methodologies utilizing 3D interconnects
US11056348B2 (en) 2018-04-05 2021-07-06 Invensas Bonding Technologies, Inc. Bonding surfaces for microelectronics
US11244916B2 (en) 2018-04-11 2022-02-08 Invensas Bonding Technologies, Inc. Low temperature bonded structures
US10790262B2 (en) 2018-04-11 2020-09-29 Invensas Bonding Technologies, Inc. Low temperature bonded structures
US10964664B2 (en) 2018-04-20 2021-03-30 Invensas Bonding Technologies, Inc. DBI to Si bonding for simplified handle wafer
US11004757B2 (en) 2018-05-14 2021-05-11 Invensas Bonding Technologies, Inc. Bonded structures
US11276676B2 (en) 2018-05-15 2022-03-15 Invensas Bonding Technologies, Inc. Stacked devices and methods of fabrication
US10923413B2 (en) 2018-05-30 2021-02-16 Xcelsis Corporation Hard IP blocks with physically bidirectional passageways
US11393779B2 (en) 2018-06-13 2022-07-19 Invensas Bonding Technologies, Inc. Large metal pads over TSV
US11749645B2 (en) 2018-06-13 2023-09-05 Adeia Semiconductor Bonding Technologies Inc. TSV as pad
WO2020010056A1 (en) 2018-07-03 2020-01-09 Invensas Bonding Technologies, Inc. Techniques for joining dissimilar materials in microelectronics
US11158606B2 (en) 2018-07-06 2021-10-26 Invensas Bonding Technologies, Inc. Molded direct bonded and interconnected stack
WO2020010265A1 (en) 2018-07-06 2020-01-09 Invensas Bonding Technologies, Inc. Microelectronic assemblies
US12406959B2 (en) 2018-07-26 2025-09-02 Adeia Semiconductor Bonding Technologies Inc. Post CMP processing for hybrid bonding
US11515291B2 (en) 2018-08-28 2022-11-29 Adeia Semiconductor Inc. Integrated voltage regulator and passive components
US11296044B2 (en) 2018-08-29 2022-04-05 Invensas Bonding Technologies, Inc. Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
US11011494B2 (en) 2018-08-31 2021-05-18 Invensas Bonding Technologies, Inc. Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
US11158573B2 (en) 2018-10-22 2021-10-26 Invensas Bonding Technologies, Inc. Interconnect structures
US11244920B2 (en) 2018-12-18 2022-02-08 Invensas Bonding Technologies, Inc. Method and structures for low temperature device bonding
CN113330557A (zh) 2019-01-14 2021-08-31 伊文萨思粘合技术公司 键合结构
US11387202B2 (en) 2019-03-01 2022-07-12 Invensas Llc Nanowire bonding interconnect for fine-pitch microelectronics
US11901281B2 (en) 2019-03-11 2024-02-13 Adeia Semiconductor Bonding Technologies Inc. Bonded structures with integrated passive component
US10854578B2 (en) 2019-03-29 2020-12-01 Invensas Corporation Diffused bitline replacement in stacked wafer memory
US11205625B2 (en) 2019-04-12 2021-12-21 Invensas Bonding Technologies, Inc. Wafer-level bonding of obstructive elements
US11373963B2 (en) 2019-04-12 2022-06-28 Invensas Bonding Technologies, Inc. Protective elements for bonded structures
US11610846B2 (en) 2019-04-12 2023-03-21 Adeia Semiconductor Bonding Technologies Inc. Protective elements for bonded structures including an obstructive element
US11355404B2 (en) 2019-04-22 2022-06-07 Invensas Bonding Technologies, Inc. Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
US11385278B2 (en) 2019-05-23 2022-07-12 Invensas Bonding Technologies, Inc. Security circuitry for bonded structures
US12374641B2 (en) 2019-06-12 2025-07-29 Adeia Semiconductor Bonding Technologies Inc. Sealed bonded structures and methods for forming the same
US11296053B2 (en) 2019-06-26 2022-04-05 Invensas Bonding Technologies, Inc. Direct bonded stack structures for increased reliability and improved yield in microelectronics
US12080672B2 (en) 2019-09-26 2024-09-03 Adeia Semiconductor Bonding Technologies Inc. Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
US12113054B2 (en) 2019-10-21 2024-10-08 Adeia Semiconductor Technologies Llc Non-volatile dynamic random access memory
US11862602B2 (en) 2019-11-07 2024-01-02 Adeia Semiconductor Technologies Llc Scalable architecture for reduced cycles across SOC
US11762200B2 (en) 2019-12-17 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded optical devices
US11876076B2 (en) 2019-12-20 2024-01-16 Adeia Semiconductor Technologies Llc Apparatus for non-volatile random access memory stacks
US11721653B2 (en) 2019-12-23 2023-08-08 Adeia Semiconductor Bonding Technologies Inc. Circuitry for electrical redundancy in bonded structures
KR20260009391A (ko) 2019-12-23 2026-01-19 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 결합형 구조체를 위한 전기적 리던던시
CN115943489A (zh) 2020-03-19 2023-04-07 隔热半导体粘合技术公司 用于直接键合结构的尺寸补偿控制
US11742314B2 (en) 2020-03-31 2023-08-29 Adeia Semiconductor Bonding Technologies Inc. Reliable hybrid bonded apparatus
US11735523B2 (en) 2020-05-19 2023-08-22 Adeia Semiconductor Bonding Technologies Inc. Laterally unconfined structure
US11631647B2 (en) 2020-06-30 2023-04-18 Adeia Semiconductor Bonding Technologies Inc. Integrated device packages with integrated device die and dummy element
US11728273B2 (en) 2020-09-04 2023-08-15 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
US11764177B2 (en) 2020-09-04 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
US11264357B1 (en) 2020-10-20 2022-03-01 Invensas Corporation Mixed exposure for large die
WO2022094587A1 (en) 2020-10-29 2022-05-05 Invensas Bonding Technologies, Inc. Direct bonding methods and structures
CN116762163A (zh) 2020-12-28 2023-09-15 美商艾德亚半导体接合科技有限公司 具有贯穿衬底过孔的结构及其形成方法
WO2022147429A1 (en) 2020-12-28 2022-07-07 Invensas Bonding Technologies, Inc. Structures with through-substrate vias and methods for forming the same
CN116848631A (zh) 2020-12-30 2023-10-03 美商艾德亚半导体接合科技有限公司 具有导电特征的结构及其形成方法
US12550799B2 (en) 2021-03-31 2026-02-10 Adeia Semiconductor Bonding Technologies Inc. Direct bonding methods and structures
EP4315398A4 (en) 2021-03-31 2025-03-05 Adeia Semiconductor Bonding Technologies Inc. DIRECT ADHESION AND REMOVING A CARRIER
KR20240036698A (ko) 2021-08-02 2024-03-20 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 결합 구조체를 위한 보호 반도체 소자
EP4406020A4 (en) 2021-09-24 2026-01-21 Adeia Semiconductor Bonding Technologies Inc Bonded structure with active interposer
US12604771B2 (en) * 2021-10-28 2026-04-14 Adeia Semiconductor Bonding Technologies Inc. Direct bonding methods and structures
US12563749B2 (en) 2021-10-28 2026-02-24 Adeia Semiconductor Bonding Technologies Inc Stacked electronic devices
US12557615B2 (en) 2021-12-13 2026-02-17 Adeia Semiconductor Technologies Llc Methods for bonding semiconductor elements
KR20240128904A (ko) 2021-12-20 2024-08-27 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 다이 패키지를 위한 열전 냉각
US12512425B2 (en) 2022-04-25 2025-12-30 Adeia Semiconductor Bonding Technologies Inc. Expansion controlled structure for direct bonding and method of forming same
JP2025517291A (ja) 2022-05-23 2025-06-05 アデイア セミコンダクター ボンディング テクノロジーズ インコーポレイテッド ボンデッド構造体のための試験用素子
US12506114B2 (en) 2022-12-29 2025-12-23 Adeia Semiconductor Bonding Technologies Inc. Directly bonded metal structures having aluminum features and methods of preparing same
US12545010B2 (en) 2022-12-29 2026-02-10 Adeia Semiconductor Bonding Technologies Inc. Directly bonded metal structures having oxide layers therein
US12341083B2 (en) 2023-02-08 2025-06-24 Adeia Semiconductor Bonding Technologies Inc. Electronic device cooling structures bonded to semiconductor elements
US12598962B2 (en) 2023-03-14 2026-04-07 Adeia Semiconductor Bonding Technologies Inc. System and method for bonding transparent conductor substrates
CN119133167B (zh) * 2024-08-20 2025-08-05 丽水威固电子科技有限责任公司 多芯片封装结构及封装方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6984571B1 (en) 1999-10-01 2006-01-10 Ziptronix, Inc. Three dimensional device integration method and integrated device
US6902987B1 (en) 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure
US6822326B2 (en) 2002-09-25 2004-11-23 Ziptronix Wafer bonding hermetic encapsulation
US6962835B2 (en) 2003-02-07 2005-11-08 Ziptronix, Inc. Method for room temperature metal direct bonding
US7109092B2 (en) 2003-05-19 2006-09-19 Ziptronix, Inc. Method of room temperature covalent bonding
US7060601B2 (en) * 2003-12-17 2006-06-13 Tru-Si Technologies, Inc. Packaging substrates for integrated circuits and soldering methods
US7485968B2 (en) 2005-08-11 2009-02-03 Ziptronix, Inc. 3D IC method and device
US8049338B2 (en) * 2006-04-07 2011-11-01 General Electric Company Power semiconductor module and fabrication method
KR20100037300A (ko) * 2008-10-01 2010-04-09 삼성전자주식회사 내장형 인터포저를 갖는 반도체장치의 형성방법
US8379917B2 (en) 2009-10-02 2013-02-19 DigitalOptics Corporation Europe Limited Face recognition performance using additional image features
US8466544B2 (en) * 2011-02-25 2013-06-18 Stats Chippac, Ltd. Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP
TWI492680B (zh) * 2011-08-05 2015-07-11 欣興電子股份有限公司 嵌埋有中介層之封裝基板及其製法
US8735219B2 (en) 2012-08-30 2014-05-27 Ziptronix, Inc. Heterogeneous annealing method and device
IL223414A (en) * 2012-12-04 2017-07-31 Elta Systems Ltd Integrated electronic device and method for creating it
US9633869B2 (en) * 2013-08-16 2017-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Packages with interposers and methods for forming the same
US9627358B2 (en) * 2013-09-27 2017-04-18 Intel Corporation Method for interconnecting stacked semiconductor devices
US10283492B2 (en) * 2015-06-23 2019-05-07 Invensas Corporation Laminated interposers and packages with embedded trace interconnects
US9953941B2 (en) 2015-08-25 2018-04-24 Invensas Bonding Technologies, Inc. Conductive barrier direct hybrid bonding
US9768145B2 (en) * 2015-08-31 2017-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of forming multi-die package structures including redistribution layers
US9852988B2 (en) 2015-12-18 2017-12-26 Invensas Bonding Technologies, Inc. Increased contact alignment tolerance for direct bonding
US10446532B2 (en) 2016-01-13 2019-10-15 Invensas Bonding Technologies, Inc. Systems and methods for efficient transfer of semiconductor elements
US10204893B2 (en) 2016-05-19 2019-02-12 Invensas Bonding Technologies, Inc. Stacked dies and methods for forming bonded structures
US11195748B2 (en) 2017-09-27 2021-12-07 Invensas Corporation Interconnect structures and methods for forming same
US10665554B2 (en) * 2017-10-30 2020-05-26 Taiwan Semiconductor Manufacturing Company Ltd. Magnetic structure for transmission lines in a package system
US10658313B2 (en) * 2017-12-11 2020-05-19 Invensas Bonding Technologies, Inc. Selective recess
KR102560697B1 (ko) * 2018-07-31 2023-07-27 삼성전자주식회사 인터포저를 가지는 반도체 패키지
KR102803426B1 (ko) * 2019-01-24 2025-05-07 삼성전기주식회사 브리지 내장 인터포저, 및 이를 포함하는 패키지 기판 및 반도체 패키지
US10903169B2 (en) * 2019-04-30 2021-01-26 Advanced Semiconductor Engineering, Inc. Conductive structure and wiring structure including the same
US11094635B2 (en) * 2019-08-22 2021-08-17 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure and method for forming the same
US11545438B2 (en) * 2019-12-25 2023-01-03 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor packages and methods of forming the same

Similar Documents

Publication Publication Date Title
JPWO2023034738A5 (https=)
JP4343044B2 (ja) インターポーザ及びその製造方法並びに半導体装置
JP6342120B2 (ja) 超薄埋設ダイモジュール及びその製造方法
JP5864180B2 (ja) 半導体パッケージ及びその製造方法
JP5193898B2 (ja) 半導体装置及び電子装置
JP3910493B2 (ja) 半導体装置及びその製造方法
TWI443791B (zh) 佈線基板之製造方法、半導體裝置之製造方法及佈線基板
JP5535494B2 (ja) 半導体装置
JP2006512775A5 (https=)
JP2009545180A5 (https=)
CN103594444B (zh) 在中介层及无芯基板之间具有双重连接通道的半导体组件
JP6029958B2 (ja) 配線基板の製造方法
JP2007053327A (ja) 電子部品実装構造及びその製造方法
JPWO2023278605A5 (https=)
CN101290889A (zh) 布线板制造方法、半导体器件制造方法和布线板
JP2013243345A5 (https=)
JP2010251395A (ja) 電子装置及びその製造方法
JPH09298255A (ja) セラミック回路基板及びこれを用いた半導体装置
JP2011044654A (ja) 半導体装置
JP2000138453A (ja) 配線基板
JP2004327624A (ja) 部品内蔵多層回路基板
JP4074040B2 (ja) 半導体モジュール
CN106252346A (zh) 指纹传感器模组及其制作方法
JP4320492B2 (ja) 半導体素子の実装構造および半導体素子の実装構造の製造方法
JPS59222954A (ja) 積層半導体集積回路およびその製法