CN118302858A - 具有中介层的堆叠结构 - Google Patents
具有中介层的堆叠结构 Download PDFInfo
- Publication number
- CN118302858A CN118302858A CN202280066706.0A CN202280066706A CN118302858A CN 118302858 A CN118302858 A CN 118302858A CN 202280066706 A CN202280066706 A CN 202280066706A CN 118302858 A CN118302858 A CN 118302858A
- Authority
- CN
- China
- Prior art keywords
- interposer
- laminate substrate
- redistribution layer
- conductive
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
- H10W40/613—Bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/63—Vias, e.g. via plugs
- H10W70/635—Through-vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/019—Manufacture or treatment of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W80/00—Direct bonding of chips, wafers or substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
- H10W90/794—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
- H10W70/692—Ceramics or glasses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
- H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163239783P | 2021-09-01 | 2021-09-01 | |
| US63/239,783 | 2021-09-01 | ||
| PCT/US2022/075576 WO2023034738A1 (en) | 2021-09-01 | 2022-08-29 | Stacked structure with interposer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118302858A true CN118302858A (zh) | 2024-07-05 |
Family
ID=85287152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280066706.0A Pending CN118302858A (zh) | 2021-09-01 | 2022-08-29 | 具有中介层的堆叠结构 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230069183A1 (https=) |
| EP (1) | EP4396872A4 (https=) |
| JP (1) | JP2024532903A (https=) |
| KR (1) | KR20240052815A (https=) |
| CN (1) | CN118302858A (https=) |
| WO (1) | WO2023034738A1 (https=) |
Families Citing this family (89)
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| US10580735B2 (en) | 2016-10-07 | 2020-03-03 | Xcelsis Corporation | Stacked IC structure with system level wiring on multiple sides of the IC die |
| US10719762B2 (en) | 2017-08-03 | 2020-07-21 | Xcelsis Corporation | Three dimensional chip structure implementing machine trained network |
| TWI910033B (zh) | 2016-10-27 | 2025-12-21 | 美商艾德亞半導體科技有限責任公司 | 用於低溫接合的結構和方法 |
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| KR20190092584A (ko) | 2016-12-29 | 2019-08-07 | 인벤사스 본딩 테크놀로지스 인코포레이티드 | 집적된 수동 컴포넌트를 구비한 접합된 구조체 |
| WO2018169968A1 (en) | 2017-03-16 | 2018-09-20 | Invensas Corporation | Direct-bonded led arrays and applications |
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| US12550799B2 (en) | 2021-03-31 | 2026-02-10 | Adeia Semiconductor Bonding Technologies Inc. | Direct bonding methods and structures |
| EP4315398A4 (en) | 2021-03-31 | 2025-03-05 | Adeia Semiconductor Bonding Technologies Inc. | DIRECT ADHESION AND REMOVING A CARRIER |
| KR20240036698A (ko) | 2021-08-02 | 2024-03-20 | 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 | 결합 구조체를 위한 보호 반도체 소자 |
| EP4406020A4 (en) | 2021-09-24 | 2026-01-21 | Adeia Semiconductor Bonding Technologies Inc | Bonded structure with active interposer |
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| KR20240128904A (ko) | 2021-12-20 | 2024-08-27 | 아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 | 다이 패키지를 위한 열전 냉각 |
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| JP2025517291A (ja) | 2022-05-23 | 2025-06-05 | アデイア セミコンダクター ボンディング テクノロジーズ インコーポレイテッド | ボンデッド構造体のための試験用素子 |
| US12506114B2 (en) | 2022-12-29 | 2025-12-23 | Adeia Semiconductor Bonding Technologies Inc. | Directly bonded metal structures having aluminum features and methods of preparing same |
| US12545010B2 (en) | 2022-12-29 | 2026-02-10 | Adeia Semiconductor Bonding Technologies Inc. | Directly bonded metal structures having oxide layers therein |
| US12341083B2 (en) | 2023-02-08 | 2025-06-24 | Adeia Semiconductor Bonding Technologies Inc. | Electronic device cooling structures bonded to semiconductor elements |
| US12598962B2 (en) | 2023-03-14 | 2026-04-07 | Adeia Semiconductor Bonding Technologies Inc. | System and method for bonding transparent conductor substrates |
| CN119133167B (zh) * | 2024-08-20 | 2025-08-05 | 丽水威固电子科技有限责任公司 | 多芯片封装结构及封装方法 |
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-
2022
- 2022-08-29 JP JP2024513736A patent/JP2024532903A/ja active Pending
- 2022-08-29 KR KR1020247010506A patent/KR20240052815A/ko active Pending
- 2022-08-29 WO PCT/US2022/075576 patent/WO2023034738A1/en not_active Ceased
- 2022-08-29 CN CN202280066706.0A patent/CN118302858A/zh active Pending
- 2022-08-29 EP EP22865698.9A patent/EP4396872A4/en active Pending
- 2022-08-30 US US17/823,430 patent/US20230069183A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023034738A1 (en) | 2023-03-09 |
| EP4396872A4 (en) | 2025-05-21 |
| KR20240052815A (ko) | 2024-04-23 |
| EP4396872A1 (en) | 2024-07-10 |
| JP2024532903A (ja) | 2024-09-10 |
| US20230069183A1 (en) | 2023-03-02 |
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