JPWO2019130442A1 - モータ駆動装置 - Google Patents
モータ駆動装置 Download PDFInfo
- Publication number
- JPWO2019130442A1 JPWO2019130442A1 JP2018526266A JP2018526266A JPWO2019130442A1 JP WO2019130442 A1 JPWO2019130442 A1 JP WO2019130442A1 JP 2018526266 A JP2018526266 A JP 2018526266A JP 2018526266 A JP2018526266 A JP 2018526266A JP WO2019130442 A1 JPWO2019130442 A1 JP WO2019130442A1
- Authority
- JP
- Japan
- Prior art keywords
- radiator
- semiconductor element
- motor
- plate surface
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/30—Structural association with control circuits or drive circuits
- H02K11/33—Drive circuits, e.g. power electronics
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
- H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1009—Electromotor
Abstract
Description
図1は本発明の実施の形態に係るモータ駆動装置の第1の斜視図である。図2は本発明の実施の形態に係るモータ駆動装置の第2の斜視図である。図3は図1に示すモータ駆動装置の分解斜視図である。図4は図1に示す筐体及び放熱器を筐体及び放熱器の下側から見た図である。モータ駆動装置1は、マシニングセンタ、NC旋盤、レ−ザ加工機、放電加工機などの工作機械に設けられる複数のモータを駆動するための装置である。なお、本実施の形態では、4つのモータを駆動するモータ駆動装置1の構成例について説明するが、モータの数は2つ以上であればよく、2つに限定されるものではない。
TH2=(P6A+P6B+P7A+P7B+P7C)×R30+Ta・・・(1)
TH3=(P7A+P7B+P7C)×R20+TH2・・・(2)
T6A=P6A×R1+TH2・・・(3)
T6B=P6B×R2+TH2・・・(4)
T7A=P7A×R11+TH3・・・(5)
T7B=P7B×R12+TH3・・・(6)
T7C=P7C×R13+TH3・・・(7)
Claims (6)
- 制御盤に設けられ、複数のモータを駆動するモータ駆動装置であって、
第1の板面と前記第1の板面の裏面となる第2の板面とを有する板状の第1の放熱部と、
第3の板面を有し、前記第3の板面に垂直な第1の法線が前記第1の板面に垂直な第2の法線と交差するように設けられ、前記第1の板面に熱的に接続される板状の第2の放熱部と、
前記第2の放熱部と熱的に接続され、第1のモータを駆動する第1の発熱素子と、
前記第1の板面と熱的に接続され、第2のモータを駆動する第2の発熱素子と、
前記第2の板面と熱的に接続される第3の放熱部と、
を備えることを特徴とするモータ駆動装置。 - 前記第1の放熱部と前記第2の放熱部との間に設けられるサーマルグリスを備えることを特徴とする請求項1に記載のモータ駆動装置。
- 前記第1の放熱部は、前記第2の放熱部へ溶接で接続されていることを特徴とする請求項1に記載のモータ駆動装置。
- 前記第3の放熱部に風を送るファンを備えることを特徴とする請求項1から3の何れか一項に記載のモータ駆動装置。
- 前記第3の放熱部の体積は、前記第2の放熱部の体積よりも大きいことを特徴とする請求項1から4の何れか一項に記載のモータ駆動装置。
- 前記第3の放熱部は前記制御盤の外部に露出することを特徴とする請求項1から5の何れか一項に記載のモータ駆動装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/046754 WO2019130442A1 (ja) | 2017-12-26 | 2017-12-26 | モータ駆動装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6370526B1 JP6370526B1 (ja) | 2018-08-08 |
JPWO2019130442A1 true JPWO2019130442A1 (ja) | 2020-01-16 |
Family
ID=63104419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018526266A Active JP6370526B1 (ja) | 2017-12-26 | 2017-12-26 | モータ駆動装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10813255B2 (ja) |
JP (1) | JP6370526B1 (ja) |
CN (1) | CN110199466B (ja) |
TW (1) | TWI661656B (ja) |
WO (1) | WO2019130442A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN210042640U (zh) * | 2018-12-29 | 2020-02-07 | 台达电子企业管理(上海)有限公司 | 电子设备及其功率模块 |
WO2021049297A1 (ja) * | 2019-09-09 | 2021-03-18 | 三菱電機株式会社 | 電力変換装置および電力変換装置の製造方法 |
CN214592516U (zh) * | 2020-11-13 | 2021-11-02 | 阳光电源股份有限公司 | 逆变器及其散热结构 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4441140A (en) * | 1980-11-20 | 1984-04-03 | Raytheon Company | Printed circuit board holder |
DE4015030C1 (ja) * | 1990-05-10 | 1991-11-21 | Bicc-Vero Elektronics Gmbh, 2800 Bremen, De | |
US5648892A (en) * | 1995-09-29 | 1997-07-15 | Allen-Bradley Company, Inc. | Wireless circuit board system for a motor controller |
JP2002185172A (ja) | 2000-12-13 | 2002-06-28 | Toshiba Tec Corp | 回路放熱装置 |
US7151348B1 (en) * | 2003-04-14 | 2006-12-19 | Matsushita Electric Industrila Co., Ltd. | Motor driving apparatus |
JP2006524846A (ja) * | 2003-05-13 | 2006-11-02 | ザルマン テック カンパニー リミテッド | コンピュータ |
US6888719B1 (en) * | 2003-10-16 | 2005-05-03 | Micron Technology, Inc. | Methods and apparatuses for transferring heat from microelectronic device modules |
KR100624092B1 (ko) * | 2004-09-16 | 2006-09-18 | 잘만테크 주식회사 | 컴퓨터 |
JP4436843B2 (ja) * | 2007-02-07 | 2010-03-24 | 株式会社日立製作所 | 電力変換装置 |
JP4550919B2 (ja) * | 2008-05-20 | 2010-09-22 | ファナック株式会社 | モータ駆動装置 |
FI122215B (fi) * | 2009-03-13 | 2011-10-14 | Abb Oy | Järjestely moottoriohjainta varten |
JP5873702B2 (ja) * | 2011-12-08 | 2016-03-01 | 新電元工業株式会社 | 電子部品ユニット |
JP5853820B2 (ja) * | 2012-03-29 | 2016-02-09 | 株式会社デンソー | 駆動装置 |
JP5807846B2 (ja) * | 2012-03-29 | 2015-11-10 | 株式会社デンソー | 駆動装置 |
WO2013145267A1 (ja) * | 2012-03-30 | 2013-10-03 | 三菱電機株式会社 | モータ駆動装置 |
CN202906724U (zh) * | 2012-08-08 | 2013-04-24 | 群光电能科技股份有限公司 | 一种组合式电源装置及具有组合式电源装置的电源系统 |
JP5657716B2 (ja) | 2013-01-15 | 2015-01-21 | ファナック株式会社 | 放熱器を備えたモータ駆動装置 |
DE102013015824B4 (de) * | 2013-09-24 | 2017-02-16 | Sew-Eurodrive Gmbh & Co Kg | Anordnung zum Kühlen von in einem Elektrogerät angeordneten Wärme erzeugenden Bauteilen |
JP5997207B2 (ja) * | 2014-06-17 | 2016-09-28 | ファナック株式会社 | 制御盤冷却装置 |
JP6413396B2 (ja) * | 2014-06-30 | 2018-10-31 | 富士電機株式会社 | 電力変換装置及び電動モータ |
JP6399954B2 (ja) * | 2015-03-10 | 2018-10-03 | 三菱電機株式会社 | モータ駆動装置 |
JP2017093092A (ja) * | 2015-11-06 | 2017-05-25 | 富士電機株式会社 | 電源装置 |
US10206310B2 (en) * | 2017-04-07 | 2019-02-12 | Toyota Motor Engineering & Manufacturing North America, Inc. | Electronics assemblies incorporating three-dimensional heat flow structures |
-
2017
- 2017-12-26 CN CN201780049531.1A patent/CN110199466B/zh active Active
- 2017-12-26 JP JP2018526266A patent/JP6370526B1/ja active Active
- 2017-12-26 WO PCT/JP2017/046754 patent/WO2019130442A1/ja active Application Filing
- 2017-12-26 US US16/315,029 patent/US10813255B2/en active Active
-
2018
- 2018-12-14 TW TW107145263A patent/TWI661656B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN110199466B (zh) | 2020-11-03 |
US20190380223A1 (en) | 2019-12-12 |
US10813255B2 (en) | 2020-10-20 |
TW201929390A (zh) | 2019-07-16 |
TWI661656B (zh) | 2019-06-01 |
CN110199466A (zh) | 2019-09-03 |
JP6370526B1 (ja) | 2018-08-08 |
WO2019130442A1 (ja) | 2019-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6370526B1 (ja) | モータ駆動装置 | |
US10798841B2 (en) | Electronic apparatus and method for producing electronic apparatus | |
KR20170101828A (ko) | 콘트롤러 조립체 | |
JP5046087B2 (ja) | モータ制御装置 | |
JP2017098418A (ja) | 回路構成体、電気接続箱及び回路構成体の製造方法 | |
JP2005136211A (ja) | 冷却装置 | |
JP7245756B2 (ja) | 電子制御装置 | |
JP2016213375A (ja) | 放熱基板及びこれを収納する放熱ケース。 | |
JP2016157715A (ja) | 放熱基板及びこれを収納する放熱ケース。 | |
JP2009017624A (ja) | モータ制御装置 | |
US11540424B2 (en) | Electric power converter | |
EP3684154B1 (en) | Thermally conductive insert element for electronic unit | |
JP7404652B2 (ja) | 電力変換装置 | |
JP7056364B2 (ja) | 回路構成体及び電気接続箱 | |
KR101360730B1 (ko) | 방열 장치 및 이를 포함하는 전기 장치 | |
WO2019123935A1 (ja) | モータ制御装置及びモータ制御装置セット | |
JP7106269B2 (ja) | モータ制御装置 | |
JP2019092337A (ja) | ヒートシンク及び電力変換装置 | |
JP4930406B2 (ja) | パワー半導体装置及びこれを用いたインバータ装置 | |
WO2019220485A1 (ja) | 電力変換装置 | |
JP2021114508A (ja) | 電気機器 | |
JP2020064953A (ja) | 電力変換装置 | |
WO2019176064A1 (ja) | 情報処理装置 | |
JP2017027994A (ja) | 放熱基板及びこれを収納する放熱ケース。 | |
JP2009193990A (ja) | Dc−dcコンバータ回路の冷却構造 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180518 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180518 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20180518 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20180608 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180612 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180710 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6370526 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |