JPWO2018186353A1 - パワーモジュール - Google Patents
パワーモジュール Download PDFInfo
- Publication number
- JPWO2018186353A1 JPWO2018186353A1 JP2019511232A JP2019511232A JPWO2018186353A1 JP WO2018186353 A1 JPWO2018186353 A1 JP WO2018186353A1 JP 2019511232 A JP2019511232 A JP 2019511232A JP 2019511232 A JP2019511232 A JP 2019511232A JP WO2018186353 A1 JPWO2018186353 A1 JP WO2018186353A1
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- Prior art keywords
- transistor
- gate
- source
- power
- power module
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
Abstract
Description
(基本構造)
第1の実施の形態に係るパワーモジュールの基本構造の模式的平面パターン構成は、図1(a)に示すように表され、図1(a)のI−I線に沿う模式的断面構造は、図1(b)に示すように表される。第1の実施の形態に係るパワーモジュールの基本構造は、例えば、1 in 1モジュールに適用可能である。
第1の実施の形態に係るパワーモジュールの模式的平面パターン構成は、図3(a)に示すように表され、図3(a)に対応するパワーモジュールにおいて、アクティブミラークランプ用トランジスタQM4近傍における模式的断面構造は、図3(b)に示すように表される。また、第1の実施の形態に係るパワーモジュールの動作説明図は、図4に示すように表され、第1の実施の形態に係るパワーモジュールの回路構成は、図5に示すように表される。ここで、図5の破線で囲まれた回路構成が、第1の実施の形態に係るパワーモジュール2のパワー回路1を示す。
(2 in 1構成)
第2の実施の形態に係るパワーモジュール2の模式的平面パターン構成は、図6に示すように表され、図6に対応するパワーモジュールの回路構成は、図7に示すように表される。ここで、図7の破線で囲まれた回路構成が、第2の実施の形態に係るパワーモジュール2のパワー回路1を示す。
第3の実施の形態に係るパワーモジュール2の模式的平面パターン構成は、図8に示すように表され、その回路構成は、図9に示すように表される。ここで、図9の破線で囲まれた回路構成が、第3の実施の形態に係るパワーモジュール2のパワー回路1を示す。
第4の実施の形態に係るパワーモジュール2の模式的平面パターン構成は、図10に示すように表され、その回路構成は、図11に示すように表される。また、第4の実施の形態に係るパワーモジュール2の動作説明は、図12に示すように表される。ここで、図11の破線で囲まれた回路構成が、第4の実施の形態に係るパワーモジュール2のパワー回路1を示す。
第5の実施の形態に係るパワーモジュール2の模式的平面パターン構成は、図13に示すように表され、その回路構成上の配置説明は、図14に示すように表される。
第6の実施の形態に係るパワーモジュール2の模式的平面パターン構成は、図15に示すように表され、その回路構成上の配置説明は、図16に示すように表される。
ゲート端子GT1・GT4とソースセンス端子SST1・SST4が互いに隣接し、ミラークランプゲート端子MGT1・MGT4とミラークランプソース端子MST1・MST4が互いに隣接するように各端子電極を配置することで、双方の端子の寄生インダクタンスが低減し、電力用トランジスタQ1・Q4のゲートインダクタンスをより低く抑えことができる。尚、信号端子の配置順については特に制限はない。
第7の実施の形態に係るパワーモジュール2の模式的平面パターン構成は、図17に示すように表される。図17に対応するパワーモジュールの回路構成は、図9と同様に表される。第7の実施の形態に係るパワーモジュール2は、様々な端子配置順でのモジュールレイアウト例の一例を表しており、例えば、信号端子の並びが、GT1−SST1、MST1−MGT1、GT4−SST4、MST4−MGT4となる例を表す。尚、信号端子の配置順については特に制限はない。
第8の実施の形態に係るパワーモジュール2の模式的平面パターン構成は、図18に示すように表される。第8の実施の形態に係るパワーモジュール2は、様々な端子配置順でのモジュールレイアウト例の一例を表しており、例えば、信号端子の並びが、GT1−SST1、MGT1−MST1、GT4−SST4、MGT4−MST4となる例を表す。尚、信号端子の配置順については特に制限はない。
実施の形態に係るパワーモジュール2に適用可能なゲートドライブ回路3の構成例は、図19に示すように表される。ゲートドライブ回路3は、ゲート入力信号増幅のため、図19に示すように、pnpトランジスタQp/npnトランジスタQnで構成されたプッシュプル回路を使用している。ゲートドライブ回路3は、ターンオン電圧生成用電源EONとゲート端子G間に接続されたnpnトランジスタQnと、ゲート端子Gとミラークランプソース端子MS間に接続されたpnpトランジスタQpとを備える。
実施の形態に係るパワーモジュール2において、電力回路のインダクタンスLPCの説明図は、図20(a)に示すように表される。図20(a)は、電力回路がフルブリッジ構成の例である。電力回路のインダクタンスLPCは、図20(a)に示すように、電圧E間に接続されたハーフブリッジ構成の電力用トランジスタQ1・Q4と、電力用トランジスタQ1・Q4と並列接続されたDCリンクコンデンサCPNからなるループ経路のインダクタンスを表している。図20(a)において、LRは平滑リアクトル、CSは出力コンデンサ、RSは抵抗負荷を表している。
MOSブリッジ動作時の誤動作の説明図は、図21(a)に示すように表され、実施の形態に係るパワーモジュールにおいて、アクティブミラークランプによる誤動作防止の説明図は、図21(b)に示すように表される。
実施の形態に係るパワーモジュールにおいて、ハーフブリッジ構成のミラークランプ内蔵モジュール4とゲートドライブ回路3の回路構成は、図23に示すように表される。
図23において、負バイアス印加用コンデンサCG1・CG4を内蔵する場合と内蔵しない場合の信号経路の説明図は、図24に示すように表される。図24において、LOAは、負バイアス印加用コンデンサを内蔵する場合の信号経路を表し、LOBは、負バイアス印加用コンデンサを内蔵しない場合の信号経路を表す。
第1の実施の形態に係るパワーモジュールの樹脂層を形成後の模式的鳥瞰構成は、図26(a)に示すように表され、第2の実施の形態に係るパワーモジュールの樹脂層を形成後の模式的鳥瞰構成は、図26(b)に示すように表され、第7の実施の形態に係るパワーモジュールの樹脂層を形成後の模式的鳥瞰構成は、図26(c)に示すように表される。いずれもツーインワンモジュールの外観構成に対応している。様々な端子配置順でのモジュールレイアウト例が可能であり、信号端子の配置順については特に制限はない。
実施の形態に係るパワーモジュールであって、1 in 1モジュール50のSiC MOSFETの模式的回路表現は、図27(a)に示すように表され、1 in 1モジュール50のIGBTの模式的回路表現は、図27(b)に示すように表される。図27(a)には、MOSFETに逆並列接続されるダイオードDIが示されている。MOSFETの主電極は、ドレイン端子DTおよびソース端子STで表される。同様に、図27(b)には、IGBTに逆並列接続されるダイオードDIが示されている。IGBTの主電極は、コレクタ端子CTおよびエミッタ端子ETで表される。
実施の形態に係るパワーモジュールであって、2 in 1モジュール100のSiC MOSFETの模式的回路表現は、図29(a)に示すように表され、2 in 1モジュール100のIGBTの模式的回路表現は、図29(b)に示すように表される。
実施の形態に係るパワーモジュールに適用可能な半導体デバイスQ1・Q4の例であって、ソースパッド電極SPD、ゲートパッド電極GPDを含むSiC MOSFET130Aの模式的断面構造は、図30に示すように表される。
実施の形態に係るパワーモジュールに適用可能な半導体デバイスの例であって、SiC DIMOSFET130Cの模式的断面構造は、図32に示すように表される。
実施の形態に係るパワーモジュールに適用可能な半導体デバイスの例であって、SiC TMOSFET130Dの模式的断面構造は、図33に示すように表される。
実施の形態に係るパワーモジュールを用いて構成した3相交流インバータ40Aの回路構成において、半導体デバイスとしてSiC MOSFETを適用し、電源端子PL・接地端子NL間にスナバコンデンサCを接続した回路構成例は、図34(a)に示すように表される。同様に、半導体デバイスとしてIGBTを適用し、電源端子PL・接地端子NL間にスナバコンデンサCを接続した3相交流インバータ40Bの回路構成例は、図34(b)に示すように表される。
次に、図35を参照して、半導体デバイスとしてSiC MOSFETを適用した3相交流インバータ42Aについて説明する。
上記のように、第1〜第8の実施の形態によって記載したが、この開示の一部をなす論述および図面は例示的なものであり、この発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施の形態、実施例および運用技術が明らかとなろう。また、主基板を使わずにパターンのみを金属板や金属フレームで用意し、樹脂封止や絶縁シートなどで主基板の役割であるパターン同士の配置関係保持、絶縁保持を実現したパワーモジュールについても同様の対策によって同様の効果が得られる。
2…パワーモジュール
3…ゲートドライブ回路
4…ミラークランプ内蔵パワーモジュール
8…セラミック基板(主基板、絶縁基板)
10、10U、10D…電極パターン
12、13…半田層
40A、40B、42A、42B…3相交流インバータ
50…ワンインワンモジュール
100…ツーインワンモジュール
120…樹脂層
Q、Q1、Q4…電力用トランジスタ(SiC MOSFET)
QM、QM1、QM4…アクティブミラークランプ用トランジスタ
MSW、MSW1、MSW4…第1接続導体(ミラークランプソースワイヤ)
MGW、MGW1、MGW4……第2接続導体(ミラークランプゲートワイヤ)
LFS、LFG…リードフレーム
P…正側電力端子
N…負側電力端子
O、U、V、W…出力端子
S1、S4…ソースパターン
D1、D4…ドレインパターン
GT1、GT4…ゲート端子
SST1、SST4…ソースセンス端子
MGT1、MGT4…ミラークランプゲート端子
MST1、MST4…ミラークランプソース端子
MDP1、MDP4…ミラークランプ用ドレインパターン
MSP1、MSP4…ミラークランプ用ソースパターン
GW1、GW4…ゲートワイヤ
SW1、SW4…ソースワイヤ
SSW1、SSW4…ソースセンスワイヤ
GL1、GL4…ゲート信号用配線パターン
SSP、SSP1、SSP4…ソース信号用配線パターン
MGP、MGP1、MGP4…ゲート信号用配線パターン
CG1、CG4…負バイアス印加用コンデンサ
DQ1、DQ4、DM1、DM4…距離
CPN…DCリンクコンデンサ(DCクランプ用コンデンサ)
Vgsp…ピーク電圧
LG…寄生インダクタンス
Claims (11)
- 絶縁基板上に配置され、少なくとも1組の上下アームを有するハーフブリッジを有し、前記上下アームに共に配置された第1のトランジスタと、
前記絶縁基板上に配置され、前記第1のトランジスタのゲート側にドレイン、前記第1のトランジスタのソース側にソースがそれぞれ接続された第2のトランジスタと、
前記絶縁基板上に配置され、前記第1のトランジスタのソースに接続された第1のソース信号用配線パターンと、
前記第1のソース信号用配線パターンと前記第2のトランジスタのソースとを接続する第1の接続導体と、
前記絶縁基板上に配置され、前記第2のトランジスタのゲートに接続された第2のゲート信号用配線パターンと、
前記第2のゲート信号用配線パターンと前記第2のトランジスタのゲートとを接続する第2の接続導体と
を備え、前記第1の接続導体の長さが、前記第2の接続導体の長さ以下であることを特徴とするパワーモジュール。 - 前記第1の接続導体および前記第2の接続導体が、ワイヤ、若しくはリードフレームを備えることを特徴とする請求項1に記載のパワーモジュール。
- 前記絶縁基板上に配置され、前記第2のトランジスタのソースに接続された第2のソース信号用配線パターンと、
前記第1のソース信号用配線パターンと前記第2のソース信号用配線パターンとの間に配置され、ゲート負バイアス印加用のコンデンサと、
前記絶縁基板上に配置され、前記第1のトランジスタのゲートと接続された第1のゲート信号用配線パターンと、
前記第1のゲート信号用配線パターンに接続された第1の信号端子と、
前記第1のソース信号用配線パターンに接続された第2の信号端子と、
前記第2のゲート信号用配線パターンに接続された第3の信号端子と、
前記第2のソース信号用配線パターンに接続された第4の信号端子と
を少なくとも備え、
前記第1の接続導体の一端が前記コンデンサを介して前記第1のソース信号用配線パターンに接続されることを特徴とする請求項1に記載のパワーモジュール。 - 正側電力端子および負側電力端子と、
前記絶縁基板上に配置され、前記正側電力端子に接続されると共に、前記第1のトランジスタのドレインに接続された第1の電極パターンと、
前記絶縁基板上に配置され、前記負側電力端子に接続されると共に、前記第1のトランジスタに直列接続されたトランジスタのソースに接続された第2の電極パターンと、
前記第1の電極パターンと前記第2の電極パターンとの間に配置されたDCリンクコンデンサと
を備えることを特徴とする請求項3に記載のパワーモジュール。 - 前記DCリンクコンデンサの接続部から前記第2のトランジスタまでの直線距離よりも、前記DCリンクコンデンサの接続部から前記第1のトランジスタまでの直線距離の方が近いことを特徴とする請求項4に記載のパワーモジュール。
- 前記第1の信号端子と前記第2の信号端子が互いに隣接し、前記第3の信号端子と前記第4の信号端子が互いに隣接していることを特徴とする請求項3に記載のパワーモジュール。
- 絶縁基板上に配置された第1配線パターン、第2配線パターン、第3配線パターンおよび第4配線パターンと、
前記第1配線パターン上に配置されてスイッチング動作を行う第1のトランジスタと、
前記第3配線パターン上に配置された第2のトランジスタと、
前記第1のトランジスタの第1電極と前記第2配線パターンとを接続する第1の接続導体と、
前記第2のトランジスタの第1電極と前記第2配線パターンとを接続する第2の接続導体と、
前記第2のトランジスタの第2電極と前記第4配線パターンとを接続する第3の接続導体と、
前記第1のトランジスタの第2電極と前記第3配線パターンとを接続する第4の接続導体と
を備え、
前記第2の接続導体の長さが、前記第3の接続導体の長さ以下であることを特徴とするパワーモジュール。 - 前記第1電極はソース電極またはエミッタ電極を備え、
前記第2電極はゲート電極を備え、
前記第3電極はドレイン電極またはコレクタ電極を備えることを特徴とする請求項7に記載のパワーモジュール。 - 前記第1のトランジスタは、SiC系MOSFET、SiC系IGBT、Si系MOSFET、Si系IGBT、GaN系FETのいずれか、またはこれらのうちの異なる複数を備えることを特徴とする請求項1〜7のいずれか1項に記載のパワーモジュール。
- 前記第1のトランジスタ及び前記第2のトランジスタは夫々複数のチップを並列接続した構成を備えることを特徴とする請求項1〜7のいずれか1項に記載のパワーモジュール。
- 前記ハーフブリッジは、
第1のトランジスタを第1電源と第2電源との間に直列に接続された複数のスイッチング回路と、
前記スイッチング回路の各トランジスタの動作を制御するドライバ回路と
を備え、前記複数のスイッチング回路の接続点を出力とするインバータまたはコンバータを構成することを特徴とする請求項1〜7のいずれか1項に記載のパワーモジュール。
Applications Claiming Priority (3)
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CN117637731A (zh) * | 2018-02-23 | 2024-03-01 | 罗姆股份有限公司 | 半导体装置及功率模块 |
WO2020172031A1 (en) * | 2019-02-21 | 2020-08-27 | North Carolina State University | Power devices having tunable saturation current clamps therein that support improved short-circuit capability and methods of operating same |
JP7368054B2 (ja) | 2019-05-16 | 2023-10-24 | ローム株式会社 | 半導体装置 |
US10955445B2 (en) | 2019-05-21 | 2021-03-23 | Nxp B.V. | Automatic miller plateau sampling |
US20220320054A1 (en) * | 2019-06-24 | 2022-10-06 | Rohm Co., Ltd. | Semiconductor device |
WO2021010210A1 (ja) * | 2019-07-12 | 2021-01-21 | ローム株式会社 | 半導体装置 |
US20220263425A1 (en) * | 2019-07-24 | 2022-08-18 | Hitachi Astemo, Ltd. | Electric circuit device |
WO2021033565A1 (ja) * | 2019-08-21 | 2021-02-25 | ローム株式会社 | パワーモジュール |
CN114467248A (zh) * | 2019-09-27 | 2022-05-10 | 罗姆股份有限公司 | 电力变换电路、功率模块、转换器以及逆变器 |
JP6752400B1 (ja) * | 2020-01-14 | 2020-09-09 | 三菱電機株式会社 | 電力変換基板 |
US20230068223A1 (en) * | 2020-02-19 | 2023-03-02 | Pierburg Gmbh | Electric power module |
DE112021001168B4 (de) | 2020-03-19 | 2023-10-12 | Rohm Co., Ltd. | Halbleiterbauteil |
WO2021192035A1 (ja) * | 2020-03-24 | 2021-09-30 | 三菱電機株式会社 | 半導体駆動装置、半導体装置、及び電力変換装置 |
JPWO2021229837A1 (ja) * | 2020-05-12 | 2021-11-18 | ||
DE112021004775T5 (de) * | 2020-11-09 | 2023-08-31 | Rohm Co., Ltd. | Entladeschaltungsmodul |
DE102022201640A1 (de) * | 2022-02-17 | 2023-08-17 | Zf Friedrichshafen Ag | Niederimpedante Klemmschaltung für ein Halbleiterschaltelement in einem Stromrichter |
CN116913910B (zh) * | 2022-11-25 | 2024-03-22 | 苏州悉智科技有限公司 | 叠层布线的功率模块封装结构 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010021082A1 (ja) * | 2008-08-21 | 2010-02-25 | 三菱電機株式会社 | 電力用半導体素子の駆動回路 |
US20110309372A1 (en) * | 2010-06-21 | 2011-12-22 | Velox Semiconductor Corporation | Enhancement-mode hfet circuit arrangement having high power and a high threshold voltage |
WO2012018073A1 (ja) * | 2010-08-04 | 2012-02-09 | ローム株式会社 | パワーモジュールおよび出力回路 |
JP2016195223A (ja) * | 2015-04-01 | 2016-11-17 | 富士電機株式会社 | 半導体装置及びその製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2795027B2 (ja) | 1992-02-17 | 1998-09-10 | 三菱電機株式会社 | Igbtのゲート駆動回路 |
JP4113436B2 (ja) * | 2003-01-24 | 2008-07-09 | 三菱電機株式会社 | ゲートドライブ装置 |
US7221195B2 (en) * | 2005-03-18 | 2007-05-22 | Alpha & Omega Semiconductor, Ltd. | MOSFET for synchronous rectification |
JP4739059B2 (ja) * | 2006-02-23 | 2011-08-03 | ルネサスエレクトロニクス株式会社 | Dc/dcコンバータ用半導体装置 |
JP4528321B2 (ja) * | 2007-09-26 | 2010-08-18 | シャープ株式会社 | スイッチング回路、回路、並びにスイッチング回路及び駆動パルス生成回路を含む回路 |
JP5254386B2 (ja) * | 2011-03-10 | 2013-08-07 | 株式会社東芝 | ゲート駆動回路、およびパワー半導体モジュール |
JP5619673B2 (ja) * | 2011-05-12 | 2014-11-05 | 日産自動車株式会社 | スイッチング回路及び半導体モジュール |
EP2712085B1 (en) | 2011-05-12 | 2016-02-03 | Nissan Motor Co., Ltd. | Switching circuit and semiconductor module |
US8901647B2 (en) * | 2011-12-08 | 2014-12-02 | Infineon Technologies Ag | Semiconductor device including first and second semiconductor elements |
JP2013258387A (ja) * | 2012-05-15 | 2013-12-26 | Rohm Co Ltd | パワーモジュール半導体装置 |
JP6425380B2 (ja) * | 2013-12-26 | 2018-11-21 | ローム株式会社 | パワー回路およびパワーモジュール |
JP2016174033A (ja) | 2015-03-16 | 2016-09-29 | 株式会社東芝 | 半導体装置 |
KR20160143909A (ko) * | 2015-06-04 | 2016-12-15 | 엘에스산전 주식회사 | Igbt 구동 장치 |
CN104935315B (zh) * | 2015-07-15 | 2019-02-19 | 北京京东方能源科技有限公司 | Igbt驱动电路 |
-
2018
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010021082A1 (ja) * | 2008-08-21 | 2010-02-25 | 三菱電機株式会社 | 電力用半導体素子の駆動回路 |
JP2013179828A (ja) * | 2008-08-21 | 2013-09-09 | Mitsubishi Electric Corp | 電力用半導体素子の駆動回路 |
US20110309372A1 (en) * | 2010-06-21 | 2011-12-22 | Velox Semiconductor Corporation | Enhancement-mode hfet circuit arrangement having high power and a high threshold voltage |
WO2012018073A1 (ja) * | 2010-08-04 | 2012-02-09 | ローム株式会社 | パワーモジュールおよび出力回路 |
JP2016195223A (ja) * | 2015-04-01 | 2016-11-17 | 富士電機株式会社 | 半導体装置及びその製造方法 |
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