JPWO2018110397A1 - モジュール - Google Patents
モジュール Download PDFInfo
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- JPWO2018110397A1 JPWO2018110397A1 JP2018556614A JP2018556614A JPWO2018110397A1 JP WO2018110397 A1 JPWO2018110397 A1 JP WO2018110397A1 JP 2018556614 A JP2018556614 A JP 2018556614A JP 2018556614 A JP2018556614 A JP 2018556614A JP WO2018110397 A1 JPWO2018110397 A1 JP WO2018110397A1
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Abstract
Description
本発明の第1実施形態に係るモジュール1について、図1ないし図7を参照して説明する。なお、図1はモジュール1の斜視図であり、(a)はモジュール1を上斜め方向から見た斜視図であり、(b)はモジュール1を下斜め方向から見た斜視図である。図2は図1のモジュール1の樹脂封止前の上斜め方向から見た斜視図である。図3(a)は図1のモジュール1の樹脂封止前の平面図であり、図3(b)は図1のモジュール1のトレンチ形成後の平面図である。なお、図3(a)の第1のトレンチ5はモジュール1の樹脂封止前の平面図では実際には存在しないが、平面視で第1のトレンチ5と第1の電子部品3aおよび第2の電子部品3bとの位置関係を明確にするために便宜上図示したものである。図4(a)は図1のモジュール1の樹脂封止前の底面図であり、図4(b)は図1のモジュール1のトレンチ形成後の底面図である。なお、図4(a)の第2のトレンチ11はモジュール1の樹脂封止前の底面図では実際には存在しないが、平面視で第2のトレンチ11と第3の電子部品9aおよび第4の電子部品9bとの位置関係を明確にするために便宜上図示したものである。図5は図1のモジュール1の配線基板の上下に形成されたトレンチ(第1のトレンチ5、第2のトレンチ11)の平面視での位置関係を示す図である。図6は図1のモジュール1の一の断面図であって、配線基板の上下に形成されたトレンチが平面視で重なり合う部分を含む箇所の断面図である。図7は図1のモジュール1の他の断面図であって、配線基板の上下に形成されたトレンチが平面視で重なり合う部分を含まない箇所の断面図である。なお、発明を実施するための形態での「平面視」は、配線基板2の一方主面2aに垂直な方向から見た平面視を意味する。
次に、モジュール1の製造方法について説明する。
本発明の第2実施形態に係るモジュールについて、図8ないし図10を参照して説明する。なお、図8(a)は第2実施形態に係るモジュール1Aの樹脂封止前の平面図であり、図8(b)はモジュール1Aの樹脂封止前の底面図である。なお、図8(a)の第1のトレンチ5Aはモジュール1Aの樹脂封止前の平面図では実際には存在しないが、第1のトレンチ5Aと第1の電子部品3aおよび第2の電子部品3bとの位置関係を明確にするために便宜上図示したものである。また、図8(b)の第2のトレンチ11Aはモジュール1Aの樹脂封止前の底面図では実際には存在しないが、第2のトレンチ11Aと第3の電子部品9aおよび第4の電子部品9bとの位置関係を明確にするために便宜上図示したものである。図9はモジュール1Aの配線基板の上下に形成されたトレンチ(第1のトレンチ5A、第2のトレンチ11A)の位置関係を示す図である。図10はモジュール1Aの断面図である。
2 配線基板
3a 第1の電子部品
3b 第2の電子部品
4 第1の封止樹脂層
5 第1のトレンチ
6 第1のシールド層
6a 第1のシールド部
9a 第3の電子部品
9b 第4の電子部品
10 第2の封止樹脂層
11 第2のトレンチ
12 第2のシールド層
12a 第2のシールド部
12b 第3のシールド部
13 実装端子電極
Claims (5)
- 一方主面と他方主面とを有する配線基板と、
前記一方主面に実装された第1の部品および第2の部品と、
前記一方主面と前記第1の部品および前記第2の部品とを封止する第1の封止樹脂層と、
前記他方主面に実装された第3の部品および第4の部品と、
前記他方主面と前記第3の部品および前記第4の部品とを封止する第2の封止樹脂層と
を備えるモジュールであって、
前記第1の封止樹脂層には、前記一方主面に垂直な方向から見た平面視において前記第1の部品と前記第2の部品との間に、第1のトレンチが形成され、
前記第2の封止樹脂層には、前記平面視において前記第3の部品と前記第4の部品との間に、第2のトレンチが形成されており、
前記第1のトレンチに配置された第1のシールド部と、
前記第2のトレンチに配置された第2のシールド部と
をさらに備えることを特徴とするモジュール。 - 平面視において前記第1のトレンチと前記第2のトレンチとは互いに重なり合う部分があるように形成されており、
前記第1のトレンチおよび前記第2のトレンチの少なくとも一方は、前記互いに重なり合う部分において、前記第1のトレンチが前記第1の封止樹脂層を貫通しないように、または、前記第2のトレンチが前記第2の封止樹脂層を貫通しないように、形成されている
ことを特徴とする請求項1に記載のモジュール。 - 前記他方主面に形成された実装端子電極であって、前記第2の封止樹脂層から露出している前記実装端子電極と、
前記実装端子電極の露出している面を隔離するように、前記第2の封止樹脂層を被覆する第3のシールド部と
をさらに備えることを特徴とする請求項1または請求項2に記載のモジュール。 - 平面視において、前記第1のトレンチと前記第2のトレンチとは互いに重なり合わないように形成されている
ことを特徴とする請求項1に記載のモジュール。 - 前記第1の封止樹脂層、前記第2の封止樹脂層及び前記配線基板それぞれの側面に積層された第4のシールド部をさらに備えることを特徴とする請求項1ないし4のいずれか1項に記載のモジュール。
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JP7158463B2 (ja) * | 2018-03-23 | 2022-10-21 | 日立Astemo株式会社 | 電子制御装置 |
US20200051925A1 (en) * | 2018-08-13 | 2020-02-13 | Mediatek Inc. | Semiconductor device with an em-integrated damper |
CN112640102A (zh) | 2018-09-28 | 2021-04-09 | 株式会社村田制作所 | 电子部件模块及电子部件模块的制造方法 |
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WO2021006141A1 (ja) * | 2019-07-08 | 2021-01-14 | 株式会社村田製作所 | モジュールおよびその製造方法 |
US11089673B2 (en) * | 2019-07-19 | 2021-08-10 | Raytheon Company | Wall for isolation enhancement |
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US20220066036A1 (en) * | 2020-08-25 | 2022-03-03 | Lumentum Operations Llc | Package for a time of flight device |
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US11729897B1 (en) * | 2022-06-27 | 2023-08-15 | Meta Platforms Technologies, Llc | Electromagnetic shielding structure for an overmolded printed circuit board |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0458596A (ja) * | 1990-06-28 | 1992-02-25 | Nippon Telegr & Teleph Corp <Ntt> | 電磁シールド方法 |
US20140361428A1 (en) * | 2013-06-05 | 2014-12-11 | Soojeoung PARK | Semiconductor packages |
JP2015057803A (ja) * | 2013-08-09 | 2015-03-26 | 太陽誘電株式会社 | 回路モジュールの製造方法 |
US20150131231A1 (en) * | 2013-11-08 | 2015-05-14 | Samsung Electro-Mechanics Co., Ltd. | Electronic component module and manufacturing method thereof |
US20160035678A1 (en) * | 2014-07-30 | 2016-02-04 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package and method of manufacturing the same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6037846A (en) * | 1998-10-09 | 2000-03-14 | Nortel Networks Corporation | Surface mount EMI gasket filter |
WO2005078796A1 (ja) * | 2004-02-13 | 2005-08-25 | Murata Manufacturing Co., Ltd. | 電子部品及びその製造方法 |
CN101800215B (zh) * | 2009-02-11 | 2012-07-04 | 日月光半导体制造股份有限公司 | 无线通讯模组封装构造 |
JP2012019091A (ja) * | 2010-07-08 | 2012-01-26 | Sony Corp | モジュールおよび携帯端末 |
JP5837515B2 (ja) * | 2011-01-27 | 2015-12-24 | 株式会社村田製作所 | 回路モジュール |
WO2012165530A1 (ja) * | 2011-06-03 | 2012-12-06 | 株式会社村田製作所 | 多層基板の製造方法および多層基板 |
CN103828043B (zh) * | 2011-09-07 | 2017-11-24 | 株式会社村田制作所 | 模块的制造方法及模块 |
JP2014107372A (ja) * | 2012-11-27 | 2014-06-09 | Taiyo Yuden Co Ltd | 回路モジュール及びその製造方法 |
JP5756500B2 (ja) * | 2013-08-07 | 2015-07-29 | 太陽誘電株式会社 | 回路モジュール |
JP5576542B1 (ja) | 2013-08-09 | 2014-08-20 | 太陽誘電株式会社 | 回路モジュール及び回路モジュールの製造方法 |
JP5466785B1 (ja) * | 2013-08-12 | 2014-04-09 | 太陽誘電株式会社 | 回路モジュール及びその製造方法 |
TWI603456B (zh) * | 2016-09-30 | 2017-10-21 | 矽品精密工業股份有限公司 | 電子封裝結構及其製法 |
US10381300B2 (en) * | 2016-11-28 | 2019-08-13 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package including filling mold via |
-
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0458596A (ja) * | 1990-06-28 | 1992-02-25 | Nippon Telegr & Teleph Corp <Ntt> | 電磁シールド方法 |
US20140361428A1 (en) * | 2013-06-05 | 2014-12-11 | Soojeoung PARK | Semiconductor packages |
JP2015057803A (ja) * | 2013-08-09 | 2015-03-26 | 太陽誘電株式会社 | 回路モジュールの製造方法 |
US20150131231A1 (en) * | 2013-11-08 | 2015-05-14 | Samsung Electro-Mechanics Co., Ltd. | Electronic component module and manufacturing method thereof |
US20160035678A1 (en) * | 2014-07-30 | 2016-02-04 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package and method of manufacturing the same |
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