WO2018110397A1 - モジュール - Google Patents
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- WO2018110397A1 WO2018110397A1 PCT/JP2017/043916 JP2017043916W WO2018110397A1 WO 2018110397 A1 WO2018110397 A1 WO 2018110397A1 JP 2017043916 W JP2017043916 W JP 2017043916W WO 2018110397 A1 WO2018110397 A1 WO 2018110397A1
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- WIPO (PCT)
- Prior art keywords
- trench
- resin layer
- sealing resin
- module
- main surface
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
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- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
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Definitions
- the present invention relates to a module in which a trench is formed in a sealing resin layer that seals a component mounted on a wiring board.
- a trench 104 is formed between the circuit board 101, the mounting parts 102a and 102b mounted on the one main surface 101a of the circuit board 101, and the mounting parts 102a and 102b. , 102b and a shield 105 are provided.
- the shield 105 includes an outer shield part 105 a that covers the upper surface and side surfaces of the sealing body 103 and an inner shield part 105 b formed inside the trench 104.
- the circuit module 100 described above can reduce interference due to unnecessary electromagnetic waves between the mounting component 102a and the mounting component 102b, but cannot sufficiently cope with the high integration of the mounting components.
- the present invention has been made in view of the above-described problems, and can reduce interference due to unnecessary electromagnetic waves between a plurality of components mounted on a wiring board, and further improve the components mounted on the wiring board.
- An object is to provide a module that can be highly integrated.
- a module of the present invention includes a wiring board having one main surface and the other main surface, a first component and a second component mounted on the one main surface, and the one A first sealing resin layer for sealing the main surface with the first component and the second component; a third component and a fourth component mounted on the other main surface; and the other main A second sealing resin layer for sealing the surface and the third component and the fourth component, wherein the first sealing resin layer is perpendicular to the one main surface.
- a first trench is formed between the first component and the second component in a plan view as viewed from any direction, and the second sealing resin layer has the third trench in the plan view.
- a second trench is formed between the first part and the fourth part, and is disposed in the first trench.
- a first shield section which is characterized by further comprising a second shield portion disposed on the second trench.
- the components mounted on the wiring board can be further highly integrated. Thereby, the layout design freedom can be improved.
- first trench and the second trench are formed so as to overlap each other in plan view, and at least one of the first trench and the second trench overlaps each other.
- the first trench is formed so as not to penetrate the first sealing resin layer, or the second trench is formed so as not to penetrate the second sealing resin layer. May be.
- the first trench and the second trench are formed by, for example, laser processing, the first trench and the second trench overlap with each other on the one main surface side of the wiring substrate in a plan view. It is possible to prevent at least one of the portion and the portion on the other main surface side from being damaged. Thereby, a wiring board crack can be suppressed.
- first trench and the second trench may be formed so as not to overlap each other in plan view.
- first trench and the second trench are formed by, for example, laser processing, at least a portion on the other main surface side of the wiring board is damaged in a portion where the first trench is formed in a plan view. It is possible to prevent this, and it is possible to prevent the portion on the one main surface side of the wiring board from being damaged in the portion where the second trench is formed in plan view. Thereby, a wiring board crack can be suppressed.
- a fourth shield part laminated on each side surface of the first sealing resin layer, the second sealing resin layer, and the wiring board may be further provided. According to this configuration, the fourth shield part can prevent unnecessary electromagnetic waves from entering the module from the outside and leakage of unnecessary electromagnetic waves from the module to the outside.
- the present invention it is possible to reduce interference caused by unnecessary electromagnetic waves between a plurality of components mounted on both surfaces of a wiring board, and to further increase the integration of components mounted on the wiring board. it can. Thereby, the layout design freedom can be improved.
- FIG. 1 It is the perspective view of the module which concerns on 1st Embodiment of this invention, Comprising: (a) is the perspective view which looked at the module from the upper diagonal direction, (b) is the perspective view which looked at the module from the downward diagonal direction. . It is the perspective view seen from the upper diagonal direction before resin sealing of the module of FIG. (A) is a top view before resin sealing of the module of FIG. 1, (b) is a top view after trench formation of the module of FIG. (A) is a bottom view of the module of FIG. 1 before resin sealing, and (b) is a bottom view of the module of FIG. 1 after trench formation. It is a figure which shows the positional relationship of the trench formed in the upper and lower sides of the wiring board of the module of FIG. FIG.
- FIG. 2 is a cross-sectional view of one of the modules of FIG.
- FIG. 4 is another cross-sectional view of the module of FIG. 1.
- FIG. 1A is a perspective view of the module 1 viewed from the upper oblique direction
- FIG. 1B is a perspective view of the module 1 viewed from the lower oblique direction
- FIG. 2 is a perspective view of the module 1 shown in FIG. 1 as viewed from the upper oblique direction before resin sealing
- 3A is a plan view of the module 1 of FIG. 1 before resin sealing
- FIG. 3B is a plan view of the module 1 of FIG. 1 after trench formation.
- FIG. 3A does not actually exist in the plan view of the module 1 before resin sealing, but the first trench 5, the first electronic component 3 a, and the second in plan view. This is shown for convenience in order to clarify the positional relationship with the electronic component 3b.
- 4A is a bottom view of the module 1 of FIG. 1 before resin sealing
- FIG. 4B is a bottom view of the module 1 of FIG. 1 after trench formation. Note that the second trench 11 in FIG. 4A does not actually exist in the bottom view before the resin sealing of the module 1, but the second trench 11, the third electronic component 9 a, and the fourth in plan view. This is shown for convenience in order to clarify the positional relationship with the electronic component 9b.
- FIG. 4A is a bottom view of the module 1 of FIG. 1 before resin sealing
- FIG. 4B is a bottom view of the module 1 of FIG. 1 after trench formation. Note that the second trench 11 in FIG. 4A does not actually exist in the bottom view before the resin sealing of the module 1, but the second trench 11, the third electronic component 9 a
- FIG. 5 is a diagram showing a positional relationship in a plan view of trenches (first trench 5 and second trench 11) formed above and below the wiring substrate of the module 1 of FIG.
- FIG. 6 is a cross-sectional view of one of the modules 1 in FIG. 1, which is a cross-sectional view of a portion including a portion where trenches formed on the upper and lower sides of the wiring substrate overlap in plan view.
- FIG. 7 is another cross-sectional view of the module 1 of FIG. 1, and is a cross-sectional view of a portion not including a portion where trenches formed on the upper and lower sides of the wiring board overlap in plan view.
- the “plan view” in the embodiment for carrying out the invention means a plan view as viewed from a direction perpendicular to the one main surface 2 a of the wiring board 2.
- the module 1 according to the first embodiment is mounted on, for example, a mother board of an electronic device that uses a high-frequency signal.
- the module 1 includes a wiring board 2 (see FIGS. 2, 3A, 4A, 6, and 7) having one main surface 2a and the other main surface 2b, and one main surface of the wiring board 2.
- a plurality of first electronic components 3a and a plurality of second electronic components 3b mounted on 2a and a first trench 5 are formed.
- 1st sealing resin layer 4 (refer FIG.3 (b), FIG.6, FIG.7) which seals 3a, 3b etc. is provided.
- the module 1 includes a plurality of third electronic components 9a and a plurality of fourth electronic components 9b (see FIGS. 4A and 7) mounted on the other main surface 2b of the wiring board 2, and a second The trench 11 is formed and includes a second sealing resin layer 10 (see FIGS. 4B, 6 and 7) for sealing the electronic components 9a and 9b and the like.
- the module 1 includes a first shield layer 6 that covers a part of the surface of the first sealing resin layer 4, the side surface of the wiring board 2, and the side surface of the second sealing resin layer 10 (FIG. ), FIG. 6 and FIG. 7), and the second shield layer 12 (FIGS. 1A and 1B) covering a part of the surface of the second sealing resin layer 10 and the side surface of the first shield layer 6. b) and FIG. 6 and FIG. 7).
- the wiring board 2 is formed of, for example, low-temperature co-fired ceramics or glass epoxy resin, and a plurality of first electronic components 3a are mounted on the main surface 2a as shown in FIG.
- a plurality of second land electrodes 7b on which the land electrodes 7a and the respective second electronic components 3b are mounted are formed.
- a plurality of third land electrodes 14a on which the respective third electronic components 9a are mounted and a plurality of second electrodes on which the fourth electronic components 9b are mounted are mounted on the other main surface 2b.
- 4 land electrodes 14b are formed, and a plurality of mounting terminal electrodes 13 for transmitting and receiving signals to and from an external device are arranged as shown in FIGS. 2, 4A, and 7.
- the first metal film 8 is disposed on one main surface 2a of the wiring board 2, and the second metal film 15 is disposed on the other main surface 2b. ing. However, the first metal film 8 is disposed at a position corresponding to the first trench 5 formed in the first sealing resin layer 4, and the second metal film 15 is formed on the second sealing resin layer 10. It arrange
- a plurality of ground electrodes (not shown), a plurality of types of wiring electrodes (not shown), and a plurality of via conductors (not shown) are formed on the inner layer or the like of the wiring board 2. Here, each ground electrode is formed so as to be exposed from the side surface of the wiring substrate 2, for example, and is electrically connected to the first shield layer 6.
- each first land electrode 7a, each second land electrode 7b, each third land electrode 14a, each fourth land electrode 14b, each ground electrode, and each wiring electrode are Cu, Al, etc. It is made of a metal generally used as a wiring electrode.
- Each via conductor is formed of a metal such as Ag or Cu.
- Each first land electrode 7a, each second land electrode 7b, each third land electrode 14a, each fourth land electrode 14b, and each mounting terminal electrode 13 are subjected to Ni / Au plating. It may be.
- the first metal film 8 and the second metal film 15 are each formed of a metal such as Ag or Cu.
- Each mounting terminal electrode 13 is made of a metal such as Ag or Cu.
- the semiconductor element formed with semiconductors such as Si and GaAs, a chip inductor
- semiconductors such as Si and GaAs
- chip inductor examples include chip components such as chip capacitors and chip resistors.
- the first sealing resin layer 4 is formed on one side of the wiring board 2 except for a part of the first metal film 8 disposed on the one main surface 2 a of the wiring board 2.
- the main surface 2a, the first electronic components 3a, and the second electronic components 3b are provided to cover the main surface 2a.
- the first sealing resin layer 4 is formed with a first trench 5. That is, the first trench 5 is provided from the upper surface side of the first sealing resin layer 4 toward the one main surface 2 a of the wiring substrate 2.
- the 1st sealing resin layer 4 can be formed with resin generally employ
- the first shield layer 6 has an upper surface 4 a of the first sealing resin layer 4 (the side opposite to the surface facing the one main surface 2 a of the first sealing resin layer 4). And the side surface of the wiring board 2 and the side surface of the second sealing resin layer 10 so as to fill the first trench 5.
- the first shield layer 6 reduces leakage of unnecessary electromagnetic waves radiated from the first electronic components 3a, the second electronic components 3b, the wiring electrodes, and the like of the module 1 to the outside or from external devices. This is to reduce the arrival of unnecessary electromagnetic waves radiated from the first electronic components 3a, the second electronic components 3b, the wiring electrodes, etc. of the module 1.
- the first shield layer 6 can be formed of a conductive material such as Cu, Ag, Al, for example.
- the portion 6a of the first shield layer 6 filling the first trench 5 corresponds to the “first shield portion” of the present invention.
- the second sealing resin layer 10 includes a part of the second metal film 15 disposed on the other main surface 2 b of the wiring substrate 2 and the other main surface 2 b of the wiring substrate 2. Except for the surface 13a opposite to the surface of each mounting terminal electrode 13 facing the other main surface 2b, each third electronic component 9a, each fourth electronic component 9b, and each mounting terminal electrode 13 of the wiring board 2. And is provided so as to cover.
- a second trench 11 is formed in the second sealing resin layer 10 as shown in FIGS. 4B, 6, and 7. That is, the second trench 11 is provided from the lower surface side of the second sealing resin layer 10 toward the other main surface 2 b of the wiring substrate 2.
- the 2nd sealing resin layer 10 can be formed with resin generally employ
- adopted as sealing resin such as an epoxy resin.
- the surface 13a of each mounting terminal electrode 13 is exposed from the second sealing resin layer 10 as shown in FIGS. Details of the formation position and the like of the second trench 11 will be described later.
- the second shield layer 12 has a lower surface 10 a of the second sealing resin layer 10 (the side opposite to the surface facing the other main surface 2 b of the second sealing resin layer 10). Is provided so as to cover the second trench 11 and cover a partial region of the first surface) and the side surface of the first shield layer 6.
- the second shield layer 12 reduces leakage of unnecessary electromagnetic waves radiated from the third electronic components 9a, the fourth electronic components 9b, the wiring electrodes, and the like of the module 1 to the outside or from external devices. This is to reduce the arrival of electromagnetic waves radiated from the third electronic components 9a, the fourth electronic components 9b, the wiring electrodes, etc. of the module 1.
- the second shield layer 12 can be formed of a conductive material such as Cu, Ag, Al, for example.
- the portion 12a of the second shield layer 12 that fills the second trench 11 corresponds to the “second shield portion” of the present invention.
- the second shield layer 12 includes a region where the surface 13 a of each mounting terminal electrode 13 exists in the lower surface 10 a of the second sealing resin layer 10 and the surface.
- a covering region (corresponding to a partial region of the lower surface 10a of the second sealing resin layer 10) not including the peripheral region of the region where 13a exists is covered.
- the second shield layer 12 does not have a region overlapping the surface 13a of each mounting terminal electrode 13 in plan view, and does not have a periphery overlapping with the periphery of the surface 13a of each mounting terminal electrode 13.
- each mounting terminal electrode 13 and the second shield layer 12 are electrically insulated.
- a portion 12b of the second shield layer 12 that covers a partial region of the lower surface 10a of the second sealing resin layer 10 corresponds to the “third shield portion” of the present invention.
- the first trench 5 has the first sealing so as to be positioned between the first electronic component 3a and the second electronic component 3b in plan view. It is formed on the stop resin layer 4.
- the second trench 11 is positioned between the third electronic component 9a and the fourth electronic component 9b in a plan view. It is formed on the stop resin layer 10.
- the first trench 5 and the second trench 11 have portions that overlap each other in plan view.
- the part of the 1st trench 5 corresponding to the overlapping part is described as the overlapping part 5a
- the part of the second trench 11 corresponding to the overlapping part is described as the overlapping part 11a.
- the first trench 5 is opposite from the upper surface 4 a of the first sealing resin layer 4 toward the surface opposite to the upper surface 4 a of the first sealing resin layer 4. It is formed until it reaches the side surface. That is, the first trench 5 penetrates the first sealing resin layer 4.
- the 1st trench 5 has penetrated the 1st sealing resin layer 4 also in the superposition
- the second trench 11 is a surface on the opposite side of the lower surface 10 a of the second sealing resin layer 10 from the lower surface 10 a of the second sealing resin layer 10 in the portion including the overlapping portion 11 a. As shown in FIG. 6 and FIG. 7, it is formed until it reaches the opposite surface at a portion not including the overlapping portion 11 a. That is, the second trench 11 does not penetrate the second sealing resin layer 10 in the portion including the overlapping portion 11a, and penetrates the second sealing resin layer 10 in the portion not including the overlapping portion 11a. Yes.
- Module manufacturing method Next, a method for manufacturing the module 1 will be described.
- the wiring board 2 is prepared.
- a plurality of first land electrodes 7 a and second land electrodes 7 b are formed on one main surface 2 a of the wiring substrate 2, and a first metal film 8 is disposed.
- a plurality of third land electrodes 14a and a plurality of fourth land electrodes 14b are formed on the other main surface 2b of the wiring board 2, and a plurality of mounting terminal electrodes 13 are disposed.
- a second metal film 15 is disposed.
- a plurality of ground electrodes, a plurality of types of wiring electrodes, a plurality of via conductors, and the like are formed on the inner layer or the like of the wiring board 2.
- the electrodes can be formed by screen printing a conductive paste containing a metal such as Ag or Cu.
- Each via conductor can be formed by a well-known method after forming a via hole using a laser or the like.
- Each mounting terminal electrode 13 can be formed of a columnar metal.
- a plurality of first electronic components 3a and a plurality of second electronic components 3b are mounted on one main surface 2a of the wiring board 2 using a known surface mounting technique. Further, the plurality of third electronic components 9a and the plurality of fourth electronic components 9b are mounted on the other main surface 2b of the wiring board 2 by using a known surface mounting technique.
- a first sealing resin layer 4 is formed on one main surface 2 a of the wiring board 2. Further, the other main surface 2b of the wiring board 2, each third electronic component 9a and each fourth electronic component 9b mounted on the other main surface 2b, each mounting terminal electrode 13, and the second metal film 15 are connected. A second sealing resin layer 10 is formed on the other main surface 2b of the wiring board 2 so as to cover it.
- a coating method, a printing method, a compression mold method, a transfer mold method, or the like can be used for forming the first sealing resin layer 4.
- the surface of the first sealing resin layer 4 is polished or ground. Further, in order to flatten the surface of the second sealing resin layer 10, the surface of the second sealing resin layer 10 is polished or ground. At this time, the surface of the second sealing resin layer 10 is polished or ground until the surface 13 a of each mounting terminal electrode 13 is exposed from the lower surface 10 a of the second sealing resin layer 10.
- the first sealing resin layer 4 is irradiated to the first sealing resin layer 4 by irradiating a laser between the first electronic component 3a and the second electronic component 3b in a plan view.
- the first trench 5 is formed between the first electronic component 3a and the second electronic component 3b in plan view.
- the formation of the first trench 5 by this laser irradiation is performed until the first trench 5 reaches the surface opposite to the upper surface 4a of the first sealing resin layer 4 from the upper surface 4a of the first sealing resin layer 4.
- the first metal film 8 is for preventing the laser beam from being directly irradiated on the one main surface 2a of the wiring board 2 and damaging the one main surface 2a of the wiring board 2.
- the second sealing resin layer 10 is irradiated with a laser between the third electronic component 9a and the fourth electronic component 9b in plan view with respect to the second sealing resin layer 10.
- the second trench 11 is formed between the third electronic component 9a and the fourth electronic component 9b in plan view.
- the lower surface 10a of the second sealing resin layer 10 is changed from the lower surface 10a of the second sealing resin layer 10 in a portion where the second trench 11 does not include the overlapping portion 11a.
- the opposite side is directed from the lower surface 10a of the second sealing resin layer 10 to the surface opposite to the lower surface 10a of the second sealing resin layer 10. Go to the position before reaching the side surface.
- the second metal film 15 is for preventing the other main surface 2b of the wiring board 2 from being damaged by direct laser irradiation on the other main surface 2b of the wiring board 2.
- the upper surface 4 a and the side surface of the first sealing resin layer 4, the side surface of the wiring substrate 2, and the side surface of the second sealing resin layer 10 are covered so as to fill the first trench 5.
- 1 shield layer 6 is formed.
- a sputtering method, a vapor deposition method, a paste coating method, or the like can be used for forming the first shield layer 6.
- the second shield layer 12 is formed so as to cover the covering region of the lower surface 10 a of the second sealing resin layer 10 and the side surface of the first shield layer 6 and fill the second trench 11.
- a sputtering method, a vapor deposition method, a paste coating method, or the like can be used.
- Each opening 16 can be formed in the second shield layer 12 by applying a mask to a region excluding the covering region of the lower surface 10 a of the second sealing resin layer 10.
- the first electronic component 3a and the second electronic component 3b are mounted on the one main surface 2a of the wiring board 2, and the third electronic component 9a and the other main surface 2b are mounted on the other main surface 2b.
- a fourth electronic component 9b is mounted.
- the first sealing resin layer 4 is formed with a first trench 5 between the first electronic component 3 a and the second electronic component 3 b in a plan view. In plan view, a second trench 11 is formed between the third electronic component 9a and the fourth electronic component 9b.
- the first shield layer covers the upper surface 4 a and the side surface of the first sealing resin layer 4, the side surface of the wiring substrate 2, and the side surface of the second sealing resin layer 10 and fills the first trench 5. 6 is formed.
- the lower surface 10 a of the second sealing resin layer 10 is covered so as to isolate the surface 13 a of the mounting terminal electrode 13, the side surface of the first shield layer 6 is covered, and the second trench 11 is filled.
- a second shield layer 12 is formed.
- the interference of unnecessary electromagnetic waves between the first electronic component 3a and the second electronic component 3b is reduced, and the interference of unnecessary electromagnetic waves between the third electronic component 9a and the fourth electronic component 9b is reduced. Reduction can be achieved. Further, it is possible to further increase the integration of components mounted on the wiring board 2.
- a plurality of components that generate large unnecessary electromagnetic waves can be separately disposed on the one main surface 2a side and the other main surface 2b side, and further, the first shield portion disposed in the first trench 5
- 6a it can be arranged separately on one main surface 2a
- second shield part 12a arranged in the second trench 11 it can also be arranged separately on the other main surface 2b. become. Thereby, the layout design freedom can be improved.
- the second trench 11 is formed so as not to penetrate the second sealing resin layer 10. For this reason, when the first trench 5 and the second trench 11 are formed by, for example, laser processing, the other main surface of the wiring board 2 in a portion where the first trench 5 and the second trench 11 overlap in a plan view. It is possible to prevent the 2b portion from being damaged. Thereby, a wiring board crack can be suppressed.
- the thickness of the first shield layer 6 on the side surface of the module 1 tends to be thinner than the thickness on the upper surface
- the thickness of the second shield layer 12 on the side surface of the module 1 tends to be thinner than the thickness on the lower surface. is there.
- the module 1 since the side surface of the module 1 is covered with the two layers of the first shield layer 6 and the second shield layer 12, the thickness of the shield layer on the side surface of the module 1 (the first shield layer 6). And the total thickness of the second shield layer 12) can be increased. For this reason, the module 1 can effectively reduce electromagnetic waves that enter the inside of the module 1 from the side surface of the module 1 and electromagnetic waves that leak from the side surface of the module 1 to the outside of the module 1.
- the ratio of the thickness of the upper surface and the side surface of the shield layer of the module 1 is approximately 4: 1.
- the ratio of the thickness of the upper surface and the side surface of the shield layer of the module 1 is approximately 2: 1.
- the shield film having a sufficient thickness can be provided also on the side surface of the module 1, the shielding effect on the side surface can be improved.
- the side part of the module 1 of the first shield layer 6 and the side part of the module 1 of the second shield layer 12 correspond to the “fourth shield part” of the present invention.
- FIG. 8A is a plan view of the module 1A according to the second embodiment before resin sealing
- FIG. 8B is a bottom view of the module 1A before resin sealing.
- the first trench 5A in FIG. 8A does not actually exist in the plan view of the module 1A before resin sealing
- the first trench 5A, the first electronic component 3a, and the second electronic component are not present. It is shown for convenience in order to clarify the positional relationship with 3b.
- 8B does not actually exist in the bottom view before the resin sealing of the module 1A, the second trench 11A, the third electronic component 9a, and the fourth electronic component are not present.
- FIG. 9 is a diagram showing a positional relationship between trenches (first trench 5A, second trench 11A) formed above and below the wiring substrate of module 1A.
- FIG. 10 is a cross-sectional view of the module 1A.
- the module 1A according to the second embodiment differs from the module 1 according to the first embodiment described with reference to FIGS. 1 to 7 in the following points.
- the first trench 5 on the upper side of the wiring board 2 and the second trench 11 on the lower side of the wiring board 2 have portions that overlap each other.
- the first trench 5A on the upper side of the wiring board 2 and the second trench 11A on the lower side of the wiring board 2 overlap each other. There is no part. Since other configurations are the same as those of the module 1 according to the first embodiment, the description thereof is omitted by giving the same reference numerals.
- the first trench 5A is first sealed so as to be positioned between the first electronic component 3a and the second electronic component 3b in plan view. It is formed on the resin layer 4.
- the second trench 11 ⁇ / b> A is formed between the third electronic component 9 a and the fourth electronic component 9 b in plan view.
- the first trench 5A and the second trench 11A have no overlapping portion in plan view.
- the first trench 5 ⁇ / b> A is provided on the opposite surface from the upper surface 4 a of the first sealing resin layer 4 toward the surface opposite to the upper surface 4 a of the first sealing resin layer 4. It is formed until it reaches. That is, the first trench 5 ⁇ / b> A penetrates the first sealing resin layer 4.
- the second trench 11 ⁇ / b> A is formed on the opposite surface from the lower surface 10 a of the second sealing resin layer 10 toward the surface opposite to the lower surface 10 a of the second sealing resin layer 10. It is formed until it reaches. That is, the second trench 11 ⁇ / b> A penetrates the second sealing resin layer 10.
- the first trench 5A and the second trench 11A are formed by, for example, laser processing
- at least the wiring substrate in the portion where the first trench 5A is formed in plan view. 2 can be prevented from being damaged on the other main surface 2b side.
- the first trench 5 penetrates the first sealing resin layer 4 and the second trench
- the trench 11 is formed so as not to penetrate the second sealing resin layer 10, but is not limited to this.
- the second trench 11 is the second trench 11 so that the first trench 5 does not penetrate the first sealing resin layer 4. It may be formed so as to penetrate the sealing resin layer 10.
- the second trench 11 is the second trench 11 so that the first trench 5 does not penetrate the first sealing resin layer 4. It may be formed so as not to penetrate the sealing resin layer 10.
- the first trench 5 ⁇ / b> A penetrates the first sealing resin layer 4, and the second trench 11 ⁇ / b> A penetrates the second sealing resin layer 10.
- the first trench 5 ⁇ / b> A may be formed so as not to penetrate the first sealing resin layer 4, and the second trench 11 ⁇ / b> A may be formed so as to penetrate the second sealing resin layer 10.
- the first trench 5A may be formed so as to penetrate the first sealing resin layer 4, and the second trench 11A may be formed so as not to penetrate the second sealing resin layer 10.
- the first trench 5A may be formed so as not to penetrate the first sealing resin layer 4, and the second trench 11A may be formed so as not to penetrate the second sealing resin layer 10.
- the second metal film 15 is also provided in a portion where the first trench 5 and the second trench 11 overlap in a plan view, but the present invention is not limited to this.
- the second metal film 15 may not be provided in a portion where the first trench 5 and the second trench 11 overlap in plan view.
- the present invention can be applied to a module in which a trench is formed in a sealing resin layer for sealing a component mounted on a wiring board.
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Abstract
Description
本発明の第1実施形態に係るモジュール1について、図1ないし図7を参照して説明する。なお、図1はモジュール1の斜視図であり、(a)はモジュール1を上斜め方向から見た斜視図であり、(b)はモジュール1を下斜め方向から見た斜視図である。図2は図1のモジュール1の樹脂封止前の上斜め方向から見た斜視図である。図3(a)は図1のモジュール1の樹脂封止前の平面図であり、図3(b)は図1のモジュール1のトレンチ形成後の平面図である。なお、図3(a)の第1のトレンチ5はモジュール1の樹脂封止前の平面図では実際には存在しないが、平面視で第1のトレンチ5と第1の電子部品3aおよび第2の電子部品3bとの位置関係を明確にするために便宜上図示したものである。図4(a)は図1のモジュール1の樹脂封止前の底面図であり、図4(b)は図1のモジュール1のトレンチ形成後の底面図である。なお、図4(a)の第2のトレンチ11はモジュール1の樹脂封止前の底面図では実際には存在しないが、平面視で第2のトレンチ11と第3の電子部品9aおよび第4の電子部品9bとの位置関係を明確にするために便宜上図示したものである。図5は図1のモジュール1の配線基板の上下に形成されたトレンチ(第1のトレンチ5、第2のトレンチ11)の平面視での位置関係を示す図である。図6は図1のモジュール1の一の断面図であって、配線基板の上下に形成されたトレンチが平面視で重なり合う部分を含む箇所の断面図である。図7は図1のモジュール1の他の断面図であって、配線基板の上下に形成されたトレンチが平面視で重なり合う部分を含まない箇所の断面図である。なお、発明を実施するための形態での「平面視」は、配線基板2の一方主面2aに垂直な方向から見た平面視を意味する。
次に、モジュール1の製造方法について説明する。
本発明の第2実施形態に係るモジュールについて、図8ないし図10を参照して説明する。なお、図8(a)は第2実施形態に係るモジュール1Aの樹脂封止前の平面図であり、図8(b)はモジュール1Aの樹脂封止前の底面図である。なお、図8(a)の第1のトレンチ5Aはモジュール1Aの樹脂封止前の平面図では実際には存在しないが、第1のトレンチ5Aと第1の電子部品3aおよび第2の電子部品3bとの位置関係を明確にするために便宜上図示したものである。また、図8(b)の第2のトレンチ11Aはモジュール1Aの樹脂封止前の底面図では実際には存在しないが、第2のトレンチ11Aと第3の電子部品9aおよび第4の電子部品9bとの位置関係を明確にするために便宜上図示したものである。図9はモジュール1Aの配線基板の上下に形成されたトレンチ(第1のトレンチ5A、第2のトレンチ11A)の位置関係を示す図である。図10はモジュール1Aの断面図である。
2 配線基板
3a 第1の電子部品
3b 第2の電子部品
4 第1の封止樹脂層
5 第1のトレンチ
6 第1のシールド層
6a 第1のシールド部
9a 第3の電子部品
9b 第4の電子部品
10 第2の封止樹脂層
11 第2のトレンチ
12 第2のシールド層
12a 第2のシールド部
12b 第3のシールド部
13 実装端子電極
Claims (5)
- 一方主面と他方主面とを有する配線基板と、
前記一方主面に実装された第1の部品および第2の部品と、
前記一方主面と前記第1の部品および前記第2の部品とを封止する第1の封止樹脂層と、
前記他方主面に実装された第3の部品および第4の部品と、
前記他方主面と前記第3の部品および前記第4の部品とを封止する第2の封止樹脂層と
を備えるモジュールであって、
前記第1の封止樹脂層には、前記一方主面に垂直な方向から見た平面視において前記第1の部品と前記第2の部品との間に、第1のトレンチが形成され、
前記第2の封止樹脂層には、前記平面視において前記第3の部品と前記第4の部品との間に、第2のトレンチが形成されており、
前記第1のトレンチに配置された第1のシールド部と、
前記第2のトレンチに配置された第2のシールド部と
をさらに備えることを特徴とするモジュール。 - 平面視において前記第1のトレンチと前記第2のトレンチとは互いに重なり合う部分があるように形成されており、
前記第1のトレンチおよび前記第2のトレンチの少なくとも一方は、前記互いに重なり合う部分において、前記第1のトレンチが前記第1の封止樹脂層を貫通しないように、または、前記第2のトレンチが前記第2の封止樹脂層を貫通しないように、形成されている
ことを特徴とする請求項1に記載のモジュール。 - 前記他方主面に形成された実装端子電極であって、前記第2の封止樹脂層から露出している前記実装端子電極と、
前記実装端子電極の露出している面を隔離するように、前記第2の封止樹脂層を被覆する第3のシールド部と
をさらに備えることを特徴とする請求項1または請求項2に記載のモジュール。 - 平面視において、前記第1のトレンチと前記第2のトレンチとは互いに重なり合わないように形成されている
ことを特徴とする請求項1に記載のモジュール。 - 前記第1の封止樹脂層、前記第2の封止樹脂層及び前記配線基板それぞれの側面に積層された第4のシールド部をさらに備えることを特徴とする請求項1ないし4のいずれか1項に記載のモジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018556614A JP6760397B2 (ja) | 2016-12-14 | 2017-12-07 | モジュール |
KR1020197016496A KR102246040B1 (ko) | 2016-12-14 | 2017-12-07 | 회로 모듈 |
CN201780077561.3A CN110073488B (zh) | 2016-12-14 | 2017-12-07 | 模块 |
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JPWO2018110397A1 (ja) | 2019-10-24 |
KR102246040B1 (ko) | 2021-04-29 |
CN110073488B (zh) | 2023-05-02 |
KR20190077076A (ko) | 2019-07-02 |
US10849257B2 (en) | 2020-11-24 |
CN110073488A (zh) | 2019-07-30 |
US20190289758A1 (en) | 2019-09-19 |
JP6760397B2 (ja) | 2020-09-23 |
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