JPWO2018110285A1 - 導電性粘着テープ - Google Patents

導電性粘着テープ Download PDF

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Publication number
JPWO2018110285A1
JPWO2018110285A1 JP2018556549A JP2018556549A JPWO2018110285A1 JP WO2018110285 A1 JPWO2018110285 A1 JP WO2018110285A1 JP 2018556549 A JP2018556549 A JP 2018556549A JP 2018556549 A JP2018556549 A JP 2018556549A JP WO2018110285 A1 JPWO2018110285 A1 JP WO2018110285A1
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JP
Japan
Prior art keywords
pressure
adhesive
adhesive tape
conductive
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018556549A
Other languages
English (en)
Japanese (ja)
Inventor
克明 今井
克明 今井
晃 山上
晃 山上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp filed Critical DIC Corp
Publication of JPWO2018110285A1 publication Critical patent/JPWO2018110285A1/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2018556549A 2016-12-12 2017-11-30 導電性粘着テープ Pending JPWO2018110285A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016240300 2016-12-12
JP2016240300 2016-12-12
PCT/JP2017/042977 WO2018110285A1 (fr) 2016-12-12 2017-11-30 Bande adhésive électroconductrice

Publications (1)

Publication Number Publication Date
JPWO2018110285A1 true JPWO2018110285A1 (ja) 2019-04-18

Family

ID=62558408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018556549A Pending JPWO2018110285A1 (ja) 2016-12-12 2017-11-30 導電性粘着テープ

Country Status (4)

Country Link
JP (1) JPWO2018110285A1 (fr)
KR (1) KR102430049B1 (fr)
CN (1) CN109996851B (fr)
WO (1) WO2018110285A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07138542A (ja) * 1993-11-17 1995-05-30 Sekisui Chem Co Ltd 建築内装材固定用両面粘着テープ
JP2000351945A (ja) * 1999-06-09 2000-12-19 Seiwa Electric Mfg Co Ltd 導電性粘着テープ
JP2007154144A (ja) * 2005-12-05 2007-06-21 Yoshihiro Suzuki 粘着加工シート及び粘着剤付剥離紙
JP2013189297A (ja) * 2012-03-14 2013-09-26 Dexerials Corp リール部材、接続体の製造方法、接着フィルムの貼り合わせ方法、接着フィルムの引き出し方法及び接着フィルム
WO2013176031A1 (fr) * 2012-05-21 2013-11-28 Dic株式会社 Bande adhésive
WO2015076174A1 (fr) * 2013-11-20 2015-05-28 Dic株式会社 Feuille adhésive conductrice et dispositif électronique
JP2015120877A (ja) * 2013-11-22 2015-07-02 日東電工株式会社 両面粘着シート
JP2015214134A (ja) * 2014-04-24 2015-12-03 日東電工株式会社 積層シート
WO2016111208A1 (fr) * 2015-01-08 2016-07-14 株式会社寺岡製作所 Ruban adhésif

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004211053A (ja) * 2002-06-26 2004-07-29 Hitachi Chem Co Ltd フィルム状接着剤、接着シート及び半導体装置
JP2005272763A (ja) * 2004-03-26 2005-10-06 J-Film Corp 貼着用粘着シート
WO2005100498A1 (fr) * 2004-04-16 2005-10-27 Riken Technos Corporation Feuille adhesive sensible a la pression et materiau de separation
JP4875357B2 (ja) 2005-12-19 2012-02-15 リンテック株式会社 両面粘着テープ
DE102006062247A1 (de) * 2006-12-22 2008-06-26 Tesa Ag Klebschicht für eine blasenfreie Verklebung
WO2010064358A1 (fr) * 2008-12-04 2010-06-10 日東電工株式会社 Ruban adhésif double face sensible à la pression pour module de cellule solaire
JP5110113B2 (ja) * 2009-03-31 2012-12-26 Ｄｉｃ株式会社 放熱シート用粘着テープ及び放熱シート
DE102009046256A1 (de) * 2009-10-30 2011-05-12 Tesa Se Verfahren zum Verkleben von hitzeaktiviert verklebbaren Flächenelementen
JP5619466B2 (ja) * 2010-04-13 2014-11-05 デクセリアルズ株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、ダイボンド剤、非導電性ペースト、接着性エポキシ樹脂フィルム、非導電性エポキシ樹脂フィルム、異方性導電ペースト及び異方性導電フィルム
KR20130130698A (ko) * 2010-08-18 2013-12-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 응력 제거 광학 접착제를 포함하는 광학 조립체 및 그의 제조 방법
JP5877087B2 (ja) * 2012-02-24 2016-03-02 古河電気工業株式会社 接着フィルムおよびウェハ加工用テープ
JP2014005319A (ja) * 2012-06-21 2014-01-16 Nitto Denko Corp 熱伝導性粘着組成物
WO2015029834A1 (fr) * 2013-08-30 2015-03-05 Dic株式会社 Feuille adhésive, article, et dispositif électronique
JP6330513B2 (ja) * 2014-06-26 2018-05-30 Dic株式会社 延伸剥離用両面粘着テープ及び電子機器
KR20160035704A (ko) * 2014-09-23 2016-04-01 (주)엘지하우시스 아크릴 폼 점착 테이프
JP6245381B2 (ja) * 2014-12-08 2017-12-13 Dic株式会社 粘着シート及び電子機器
JP2016151006A (ja) * 2015-02-19 2016-08-22 Dic株式会社 粘着シート、その製造方法及び電子機器

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07138542A (ja) * 1993-11-17 1995-05-30 Sekisui Chem Co Ltd 建築内装材固定用両面粘着テープ
JP2000351945A (ja) * 1999-06-09 2000-12-19 Seiwa Electric Mfg Co Ltd 導電性粘着テープ
JP2007154144A (ja) * 2005-12-05 2007-06-21 Yoshihiro Suzuki 粘着加工シート及び粘着剤付剥離紙
JP2013189297A (ja) * 2012-03-14 2013-09-26 Dexerials Corp リール部材、接続体の製造方法、接着フィルムの貼り合わせ方法、接着フィルムの引き出し方法及び接着フィルム
WO2013176031A1 (fr) * 2012-05-21 2013-11-28 Dic株式会社 Bande adhésive
WO2015076174A1 (fr) * 2013-11-20 2015-05-28 Dic株式会社 Feuille adhésive conductrice et dispositif électronique
JP2015120877A (ja) * 2013-11-22 2015-07-02 日東電工株式会社 両面粘着シート
JP2015214134A (ja) * 2014-04-24 2015-12-03 日東電工株式会社 積層シート
WO2016111208A1 (fr) * 2015-01-08 2016-07-14 株式会社寺岡製作所 Ruban adhésif

Also Published As

Publication number Publication date
CN109996851B (zh) 2022-05-06
WO2018110285A1 (fr) 2018-06-21
KR20190093559A (ko) 2019-08-09
KR102430049B1 (ko) 2022-08-05
CN109996851A (zh) 2019-07-09

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