JPWO2018003603A1 - ペリクル膜、ペリクル枠体、ペリクル、及びその製造方法 - Google Patents
ペリクル膜、ペリクル枠体、ペリクル、及びその製造方法 Download PDFInfo
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- JPWO2018003603A1 JPWO2018003603A1 JP2018525081A JP2018525081A JPWO2018003603A1 JP WO2018003603 A1 JPWO2018003603 A1 JP WO2018003603A1 JP 2018525081 A JP2018525081 A JP 2018525081A JP 2018525081 A JP2018525081 A JP 2018525081A JP WO2018003603 A1 JPWO2018003603 A1 JP WO2018003603A1
- Authority
- JP
- Japan
- Prior art keywords
- pellicle
- frame
- substrate
- film
- pellicle film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
本明細書において、ある部材又は領域が、他の部材又は領域の「上に(又は下に)」あるとする場合、特段の限定がない限り、これは他の部材又は領域の直上(又は直下)にある場合のみでなく、他の部材又は領域の上方(又は下方)にある場合を含み、すなわち、他の部材又は領域の上方(又は下方)において間に別の構成要素が含まれている場合も含む。
本発明に係るペリクルの製造方法によって製造しようとするペリクルとは、フォトリソグラフィ用ペリクルである。まず、基板100(図1(a)。たとえばシリコンウェハ)上に、CVD法(Chemical Vapor Deposition)(たとえば、LP−CVD成膜、PE−CVD成膜など)やスパッタ製膜等の方法によって、ペリクル膜102を形成する(図1(b))。
本発明では、バックエッチング用のマスク材料をSiNマスク104ではなく金属(たとえば、クロム(Cr)等)を用いて、バックエッチング後に金属マスク204を除去する。本発明によれば、SiNマスク104ではなく、ペリクル膜202の構成成分と有意にエッチングレートが異なるマスクを用いることによって、基板200にもペリクル膜202にも影響を与えずにマスクを除去することが可能になり、マスクが庇状に残って庇部となってしまうことがない。結果として、庇状に残ったSiNマスク104が折れて発生するような粉塵の発生を防ぐことが可能となる。
通常、物質の輻射率(物体が熱放射で放出する光のエネルギー(放射輝度)を、同温の黒体が放出する光(黒体放射)のエネルギーを1としたときの比)は、膜厚にほぼ比例する関係にある。したがって、膜厚が薄い場合、通常であれば輻射率は低い。しかし、金属材料の一部には、非常に薄いところで局所的に輻射率が向上するものがある。たとえば、ルテニウム(Ru)と金(Au)では両者とも膜厚が非常に薄い部分においては局所的に輻射率が向上する。もっとも、ルテニウム(Ru)と金(Au)の輻射率の数値自体は異なるため、放熱の要求性能によって適した材料を選択することが可能である。
100、200 基板
102、202 ペリクル膜
104 SiNマスク
120 庇部
204 金属マスク
207 第1の枠体
208 第2の枠体
212 粘着シート
224 ブリッジ
230 孔
240 栓
309 表面金属コート層
Claims (8)
- 基板上にペリクル膜を形成し、
前記基板の前記ペリクル膜が形成された面とは反対側の面に金属マスクを形成し、
前記金属マスク側から前記基板の一部を除去し、
前記金属マスクを除去する、
ペリクルの製造方法。 - 前記基板と前記ペリクル膜との間に、表面金属コート層を形成することをさらに含む、
請求項1に記載のペリクルの製造方法。 - 前記金属マスクがクロムである、
請求項1に記載のペリクルの製造方法。 - 前記表面金属コート層がルテニウムである、
請求項2に記載のペリクルの製造方法。 - 前記基板の一部を除去する工程はウェットエッチング工程である、
請求項1に記載のペリクルの製造方法。 - ペリクル膜と第1の枠体とを有し、
前記ペリクル膜は前記第1の枠体に張架され、
前記第1の枠体は、0μm以上0.5μm以下の庇部を有することを特徴とする
ペリクル枠体。 - 前記ペリクル膜と前記第1の枠体との間に表面金属コート層を有する、
請求項6に記載のペリクル枠体。 - 請求項6のペリクル枠体に第2の枠体を接続したペリクル。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016127535 | 2016-06-28 | ||
JP2016127535 | 2016-06-28 | ||
PCT/JP2017/022688 WO2018003603A1 (ja) | 2016-06-28 | 2017-06-20 | ペリクル膜、ペリクル枠体、ペリクル、及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018003603A1 true JPWO2018003603A1 (ja) | 2019-03-28 |
JP6732019B2 JP6732019B2 (ja) | 2020-07-29 |
Family
ID=60785208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018525081A Active JP6732019B2 (ja) | 2016-06-28 | 2017-06-20 | ペリクル膜、ペリクル枠体、ペリクル、及びその製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20190121229A1 (ja) |
EP (1) | EP3477387A4 (ja) |
JP (1) | JP6732019B2 (ja) |
KR (1) | KR102189172B1 (ja) |
CN (1) | CN109313385A (ja) |
SG (1) | SG11201811360UA (ja) |
TW (1) | TWI731995B (ja) |
WO (1) | WO2018003603A1 (ja) |
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CN112041743A (zh) | 2018-05-04 | 2020-12-04 | Asml荷兰有限公司 | 用于euv光刻术的表膜 |
KR102209291B1 (ko) * | 2019-02-21 | 2021-01-29 | 한국과학기술원 | Euv 리소그래피 펠리클 박막의 제조 방법 및 장치 |
KR102207851B1 (ko) * | 2019-03-12 | 2021-01-26 | 주식회사 에프에스티 | 미세 금속 마스크 및 이를 이용한 초극자외선 리소그라피용 펠리클의 제조방법 |
KR20200141913A (ko) | 2019-06-11 | 2020-12-21 | 주식회사 에스앤에스텍 | 박막 주름이 개선된 펠리클 및 그의 제조방법 |
KR102282273B1 (ko) | 2020-01-17 | 2021-07-27 | 주식회사 에프에스티 | 극자외선 리소그래피용 펠리클의 제조방법 |
KR102482649B1 (ko) | 2020-07-09 | 2022-12-29 | (주)에프에스티 | 극자외선 리소그라피용 펠리클의 제조방법 |
JP7307281B2 (ja) * | 2020-08-05 | 2023-07-11 | 三井化学株式会社 | ペリクル、露光原版、露光装置、ペリクルの製造方法及び半導体装置の製造方法 |
KR102514745B1 (ko) | 2020-10-07 | 2023-03-29 | 주식회사 에프에스티 | 극자외선 리소그라피용 펠리클 및 그 제조방법 |
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KR20230069757A (ko) | 2021-11-12 | 2023-05-19 | 주식회사 에프에스티 | 다성분계 실리콘 화합물 층을 포함하는 극자외선 리소그래피용 펠리클 막 |
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- 2017-06-20 EP EP17819962.6A patent/EP3477387A4/en active Pending
- 2017-06-20 SG SG11201811360UA patent/SG11201811360UA/en unknown
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WO2015178250A1 (ja) * | 2014-05-19 | 2015-11-26 | 三井化学株式会社 | ペリクル膜、ペリクル、露光原版、露光装置及び半導体装置の製造方法 |
WO2016043301A1 (ja) * | 2014-09-19 | 2016-03-24 | 三井化学株式会社 | ペリクル、ペリクルの製造方法及びペリクルを用いた露光方法 |
KR101624078B1 (ko) * | 2015-04-24 | 2016-05-25 | 한양대학교 에리카산학협력단 | 펠리클 및 그 제조 방법 |
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EP3477387A1 (en) | 2019-05-01 |
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WO2018003603A1 (ja) | 2018-01-04 |
KR102189172B1 (ko) | 2020-12-09 |
US20190121229A1 (en) | 2019-04-25 |
CN109313385A (zh) | 2019-02-05 |
JP6732019B2 (ja) | 2020-07-29 |
EP3477387A4 (en) | 2020-03-11 |
TW201801147A (zh) | 2018-01-01 |
KR20190005911A (ko) | 2019-01-16 |
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