JPWO2016143640A1 - 導電性構造体、及び導電性構造体の製造方法 - Google Patents

導電性構造体、及び導電性構造体の製造方法 Download PDF

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Publication number
JPWO2016143640A1
JPWO2016143640A1 JP2017505013A JP2017505013A JPWO2016143640A1 JP WO2016143640 A1 JPWO2016143640 A1 JP WO2016143640A1 JP 2017505013 A JP2017505013 A JP 2017505013A JP 2017505013 A JP2017505013 A JP 2017505013A JP WO2016143640 A1 JPWO2016143640 A1 JP WO2016143640A1
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JP
Japan
Prior art keywords
conductive
meth
acrylate
conductive structure
composition
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Pending
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JP2017505013A
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English (en)
Japanese (ja)
Inventor
祐輔 岡部
祐輔 岡部
宏士 山家
宏士 山家
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cemedine Co Ltd
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Cemedine Co Ltd
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Application filed by Cemedine Co Ltd filed Critical Cemedine Co Ltd
Publication of JPWO2016143640A1 publication Critical patent/JPWO2016143640A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F292/00—Macromolecular compounds obtained by polymerising monomers on to inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/24—Homopolymers or copolymers of amides or imides
    • C08L33/26—Homopolymers or copolymers of acrylamide or methacrylamide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)
JP2017505013A 2015-03-11 2016-03-02 導電性構造体、及び導電性構造体の製造方法 Pending JPWO2016143640A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015048601 2015-03-11
JP2015048601 2015-03-11
PCT/JP2016/056484 WO2016143640A1 (ja) 2015-03-11 2016-03-02 導電性構造体、及び導電性構造体の製造方法

Publications (1)

Publication Number Publication Date
JPWO2016143640A1 true JPWO2016143640A1 (ja) 2017-12-28

Family

ID=56879386

Family Applications (1)

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JP2017505013A Pending JPWO2016143640A1 (ja) 2015-03-11 2016-03-02 導電性構造体、及び導電性構造体の製造方法

Country Status (4)

Country Link
JP (1) JPWO2016143640A1 (zh)
KR (1) KR20170126877A (zh)
CN (1) CN107408422A (zh)
WO (1) WO2016143640A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024009895A1 (ja) * 2022-07-08 2024-01-11 株式会社レゾナック （メタ）アクリルポリマー及び金属粒子を含有する組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5616070B2 (ja) * 2010-01-21 2014-10-29 株式会社フジクラ 電子線硬化用導電性ペースト及びこれを用いた回路基板の製造方法
US20110256383A1 (en) * 2010-04-01 2011-10-20 Bayer Materialscience Ag Polymer material comprising a polymer and silver nanoparticles dispersed herein
JP5521848B2 (ja) * 2010-07-21 2014-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体及びそれらの製造方法
JP2013035974A (ja) * 2011-08-10 2013-02-21 Tokai Rubber Ind Ltd 柔軟導電材料
JP5928453B2 (ja) * 2012-03-28 2016-06-01 東レ株式会社 感光性導電ペーストおよび導電パターンの製造方法
WO2013161713A1 (ja) * 2012-04-25 2013-10-31 日立化成株式会社 回路接続材料、回路接続構造体、接着フィルム及び巻重体
JP5463498B1 (ja) * 2012-12-28 2014-04-09 東洋インキＳｃホールディングス株式会社 感光性導電性インキ及びその硬化物
CN103515025B (zh) * 2013-09-30 2016-04-06 无锡晶睿光电新材料有限公司 一种低温固化型感光导电浆料及用其制作导电线路的方法

Also Published As

Publication number Publication date
CN107408422A (zh) 2017-11-28
WO2016143640A1 (ja) 2016-09-15
KR20170126877A (ko) 2017-11-20

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