JPWO2015064232A1 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
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Abstract
Description
まず、本発明に係る第1の実施形態について説明する。
次に、本発明に係る第2の実施形態について説明する。
次に、本発明に係る第3の実施形態について説明する。
2 第1DCB基板
2a 第1セラミック絶縁基板
2b 第3金属箔
2c 第4金属箔
3a ハンダ
3b ハンダ
3c ハンダ
3d ハンダ
3e ハンダ
4 第2DCB基板
4a 第2セラミック絶縁基板
4b 第5金属箔
4c 第6金属箔
5 ピン配線基板
5a ピン配線用絶縁基板
5b 第1金属箔(回路層)
5c 第2金属箔
6 第1冷却器
6a 冷媒通路
6b 冷媒入口
6c 冷媒出口
7 第2冷却器
7a 冷媒通路
7b 冷媒入口
7c 冷媒出口
8a 端子
8a1 端子
8b 端子
8c 端子
9 封止樹脂
10 ピン
11 ヒートスプレッダ
100 半導体モジュール
101 半導体モジュール
102 半導体モジュール
103 半導体モジュール
また、本発明の上記の実施形態に係る半導体モジュールにおいては、前記ピン配線用絶縁基板は、Si 3 N 4 ,AlN,Al 2 O 3 から選ばれるいずれかの材料を使用できる。
本発明の上記の実施形態に係る半導体モジュールにおいては、前記半導体
素子および前記ピンの組は複数を備えることができる。
Claims (8)
- 半導体素子と、
前記半導体素子の上面に電気的および熱的に接続されたピンと、
ピン配線用絶縁基板、前記ピン配線用絶縁基板の裏面に配置した第1金属箔、および前記ピン配線用絶縁基板のおもて面に配置した第2金属箔を備えており、かつ前記第1金属箔と前記ピンとが接合しているピン配線基板と、
第1セラミック絶縁基板、前記第1セラミック絶縁基板のおもて面に配置した第3金属箔、および前記第1セラミック絶縁基板の裏面に配置した第4金属箔を備えており、前記第3金属箔は、前記半導体素子の下面に接合されている第1DCB基板と、
前記第4金属箔に熱的に接続された第1冷却器と、
前記第2金属箔に熱的に接続された第2冷却器と、
を備えることを特徴とする半導体モジュール。 - 第2セラミック絶縁基板、前記第2セラミック絶縁基板の裏面に配置した第5金属箔、および前記第2セラミック絶縁基板のおもて面に配置した第6金属箔を備えた第2DCB基板を備え、
前記第2金属箔と前記第2冷却器との間に第2DCB基板を配置して熱的に接続されている請求項1に記載の半導体モジュール。 - 前記第2金属箔と前記第2冷却器との間にヒートスプレッダを配置して熱的に接続されていることを特徴とする請求項1に記載の半導体モジュール。
- 前記半導体素子および前記ピンの組を複数備えている請求項1〜3のいずれか1項に記載の半導体モジュール。
- 前記半導体素子の入力端子および出力端子は、前記第1冷却器と前記第2冷却器との間から外部に導出されている請求項1〜4のいずれか1項に記載の半導体モジュール。
- 請求項1〜5のいずれか1項に記載の半導体モジュールを1単位とする、半導体モジュールユニットが、前記半導体素子の入力端子および出力端子が出ていない側面を対面させて、横一列に複数並べられていることを特徴とする半導体モジュール。
- 前記第1冷却器および第2冷却器はそれぞれ前記モジュールユニットの列全体を覆うように一体になっていることを特徴とする請求項6に記載の半導体モジュール。
- 前記半導体モジュールの前記第1冷却器および前記第1冷却器に熱的に接続される面と、
前記半導体モジュールの前記第2冷却器および前記第2冷却器に熱的に接続される面と、
を除いて封止樹脂で封止されている請求項1〜7のいずれか1項に記載の半導体モジュール。
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Application Number | Priority Date | Filing Date | Title |
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JP2013224424 | 2013-10-29 | ||
JP2013224424 | 2013-10-29 | ||
PCT/JP2014/074485 WO2015064232A1 (ja) | 2013-10-29 | 2014-09-17 | 半導体モジュール |
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JPWO2015064232A1 true JPWO2015064232A1 (ja) | 2017-03-09 |
JP6217756B2 JP6217756B2 (ja) | 2017-10-25 |
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JP (1) | JP6217756B2 (ja) |
CN (1) | CN105264658A (ja) |
DE (1) | DE112014002061T5 (ja) |
WO (1) | WO2015064232A1 (ja) |
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US10600718B1 (en) * | 2014-12-03 | 2020-03-24 | Ii-Vi Delaware, Inc. | Heat sink package |
JP6903051B2 (ja) * | 2015-10-07 | 2021-07-14 | セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングCeramTec GmbH | 二面冷却式回路 |
US10403601B2 (en) * | 2016-06-17 | 2019-09-03 | Fairchild Semiconductor Corporation | Semiconductor package and related methods |
FR3054928B1 (fr) * | 2016-08-05 | 2018-08-17 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede d'encapsulation d'un circuit integre pour former un module de puissance tridimensionnel |
KR101905995B1 (ko) | 2016-11-09 | 2018-10-10 | 현대자동차주식회사 | 양면냉각형 파워모듈 |
JP2020516054A (ja) * | 2017-04-06 | 2020-05-28 | セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングCeramTec GmbH | 両面で冷却される回路 |
CN107369657B (zh) * | 2017-08-30 | 2023-10-13 | 扬州国扬电子有限公司 | 一种多区域并列排布的双面散热功率模块 |
CN107634052A (zh) * | 2017-08-30 | 2018-01-26 | 扬州国扬电子有限公司 | 一种平行安装电极组合及功率模块 |
CN107634051A (zh) * | 2017-08-30 | 2018-01-26 | 扬州国扬电子有限公司 | 一种具有交叉排列电极组合的功率模组 |
CN107393901B (zh) * | 2017-08-30 | 2023-10-13 | 扬州国扬电子有限公司 | 一种叠层基板的双面散热功率模块 |
CN107403780A (zh) * | 2017-08-30 | 2017-11-28 | 扬州国扬电子有限公司 | 一种交叉排列电极组合及功率模块 |
EP3557614A1 (de) * | 2018-04-17 | 2019-10-23 | Siemens Aktiengesellschaft | Leistungsmodul mit einem leistungselektronischen bauelement auf einer substratplatte und leistungselektronische schaltung mit einem solchen leistungsmodul |
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JP7200825B2 (ja) * | 2019-05-15 | 2023-01-10 | 株式会社デンソー | 半導体装置 |
BR112020000879A2 (pt) * | 2019-07-09 | 2021-03-23 | Juliano Anflor | aperfeiçoamento em acoplamento térmico entre transistor e drivers de audio com dissipador de calor |
IT201900013743A1 (it) * | 2019-08-01 | 2021-02-01 | St Microelectronics Srl | Dispositivo elettronico di potenza incapsulato, in particolare circuito a ponte comprendente transistori di potenza, e relativo procedimento di assemblaggio |
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CN105264658A (zh) | 2016-01-20 |
US9460981B2 (en) | 2016-10-04 |
DE112014002061T5 (de) | 2016-01-07 |
JP6217756B2 (ja) | 2017-10-25 |
US20160064302A1 (en) | 2016-03-03 |
WO2015064232A1 (ja) | 2015-05-07 |
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