JPWO2015040979A1 - 研磨用組成物 - Google Patents
研磨用組成物 Download PDFInfo
- Publication number
- JPWO2015040979A1 JPWO2015040979A1 JP2015537600A JP2015537600A JPWO2015040979A1 JP WO2015040979 A1 JPWO2015040979 A1 JP WO2015040979A1 JP 2015537600 A JP2015537600 A JP 2015537600A JP 2015537600 A JP2015537600 A JP 2015537600A JP WO2015040979 A1 JPWO2015040979 A1 JP WO2015040979A1
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- Prior art keywords
- polishing
- propyl
- group
- silica
- polishing composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005498 polishing Methods 0.000 title claims abstract description 169
- 239000000203 mixture Substances 0.000 title claims abstract description 77
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 173
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 78
- 125000000524 functional group Chemical group 0.000 claims abstract description 70
- 125000003277 amino group Chemical group 0.000 claims abstract description 33
- 125000005843 halogen group Chemical group 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000003002 pH adjusting agent Substances 0.000 claims abstract description 13
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 25
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 25
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 19
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 229910052707 ruthenium Inorganic materials 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 12
- 125000001309 chloro group Chemical group Cl* 0.000 claims description 9
- 125000001246 bromo group Chemical group Br* 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 5
- 125000001153 fluoro group Chemical group F* 0.000 claims description 4
- 125000002346 iodo group Chemical group I* 0.000 claims description 4
- 229910000510 noble metal Inorganic materials 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 2
- 229910052762 osmium Inorganic materials 0.000 claims description 2
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 32
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 26
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 24
- -1 aminopropyl Chemical group 0.000 description 24
- 239000002994 raw material Substances 0.000 description 14
- 239000006061 abrasive grain Substances 0.000 description 13
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- 239000007800 oxidant agent Substances 0.000 description 12
- 239000008119 colloidal silica Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 9
- 239000011164 primary particle Substances 0.000 description 9
- 239000011163 secondary particle Substances 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 230000008901 benefit Effects 0.000 description 8
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- 238000003786 synthesis reaction Methods 0.000 description 8
- 125000000250 methylamino group Chemical group [H]N(*)C([H])([H])[H] 0.000 description 7
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229910000929 Ru alloy Inorganic materials 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- 150000003304 ruthenium compounds Chemical class 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 125000004800 4-bromophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Br 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 4
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 125000004799 bromophenyl group Chemical group 0.000 description 4
- 125000000068 chlorophenyl group Chemical group 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 239000000417 fungicide Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000003100 immobilizing effect Effects 0.000 description 4
- 125000005647 linker group Chemical group 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 239000003755 preservative agent Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- GLISZRPOUBOZDL-UHFFFAOYSA-N 3-bromopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCBr GLISZRPOUBOZDL-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000005122 aminoalkylamino group Chemical group 0.000 description 3
- 230000002421 anti-septic effect Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000002612 dispersion medium Substances 0.000 description 3
- 238000005935 nucleophilic addition reaction Methods 0.000 description 3
- 238000010979 pH adjustment Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- HQKYAQMYVVOMPU-UHFFFAOYSA-N 3-[dibutoxy(butyl)silyl]propyl-trimethylazanium Chemical compound C(CCC)[Si](CCC[N+](C)(C)C)(OCCCC)OCCCC HQKYAQMYVVOMPU-UHFFFAOYSA-N 0.000 description 2
- BNYFUBOZYDQIDU-UHFFFAOYSA-N 3-[diethoxy(ethyl)silyl]propan-1-amine Chemical compound CCO[Si](CC)(OCC)CCCN BNYFUBOZYDQIDU-UHFFFAOYSA-N 0.000 description 2
- JMFBXUMHVSZUKY-UHFFFAOYSA-N 3-bromopropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCBr JMFBXUMHVSZUKY-UHFFFAOYSA-N 0.000 description 2
- 125000004179 3-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C(Cl)=C1[H] 0.000 description 2
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 2
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 229910002808 Si–O–Si Inorganic materials 0.000 description 2
- 229910001362 Ta alloys Inorganic materials 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
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- UZFGHLHEMGPLAR-UHFFFAOYSA-N butyl-(4-chlorophenyl)-diethoxysilane Chemical compound C(CCC)[Si](OCC)(OCC)C1=CC=C(C=C1)Cl UZFGHLHEMGPLAR-UHFFFAOYSA-N 0.000 description 1
- FTYDAVWVHMORQX-UHFFFAOYSA-N butyl-(4-chlorophenyl)-dimethoxysilane Chemical compound C(CCC)[Si](OC)(OC)C1=CC=C(C=C1)Cl FTYDAVWVHMORQX-UHFFFAOYSA-N 0.000 description 1
- OWYKQVDTWMICQE-UHFFFAOYSA-N butyl-(4-chlorophenyl)-dipropoxysilane Chemical compound ClC1=CC=C(C=C1)[Si](OCCC)(OCCC)CCCC OWYKQVDTWMICQE-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- DHNRXBZYEKSXIM-UHFFFAOYSA-N chloromethylisothiazolinone Chemical compound CN1SC(Cl)=CC1=O DHNRXBZYEKSXIM-UHFFFAOYSA-N 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000011246 composite particle Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- PLTKQPNYFHYCNQ-UHFFFAOYSA-N dibutoxy(ethyl)silane Chemical compound CCCCO[SiH](CC)OCCCC PLTKQPNYFHYCNQ-UHFFFAOYSA-N 0.000 description 1
- BFRUVJHDVUICRT-UHFFFAOYSA-N dibutoxy-(3-chlorophenyl)-ethylsilane Chemical compound ClC=1C=C(C=CC=1)[Si](OCCCC)(OCCCC)CC BFRUVJHDVUICRT-UHFFFAOYSA-N 0.000 description 1
- PGRYUMVMEBWGKM-UHFFFAOYSA-N dibutoxy-(3-chlorophenyl)-methylsilane Chemical compound ClC=1C=C(C=CC=1)[Si](OCCCC)(OCCCC)C PGRYUMVMEBWGKM-UHFFFAOYSA-N 0.000 description 1
- HFEOWWIHEQIYLV-UHFFFAOYSA-N dibutoxy-(3-chlorophenyl)-propylsilane Chemical compound ClC=1C=C(C=CC=1)[Si](OCCCC)(OCCCC)CCC HFEOWWIHEQIYLV-UHFFFAOYSA-N 0.000 description 1
- JXTGNRTUGONVSA-UHFFFAOYSA-N dibutoxy-(3-chloropropyl)-methylsilane Chemical compound CCCCO[Si](C)(CCCCl)OCCCC JXTGNRTUGONVSA-UHFFFAOYSA-N 0.000 description 1
- CSOPWTMSVDQDRQ-UHFFFAOYSA-N dibutoxy-(4-chlorophenyl)-ethylsilane Chemical compound C(C)[Si](OCCCC)(OCCCC)C1=CC=C(C=C1)Cl CSOPWTMSVDQDRQ-UHFFFAOYSA-N 0.000 description 1
- AOGWAFVHLZEZAV-UHFFFAOYSA-N dibutoxy-(4-chlorophenyl)-methylsilane Chemical compound ClC1=CC=C(C=C1)[Si](OCCCC)(OCCCC)C AOGWAFVHLZEZAV-UHFFFAOYSA-N 0.000 description 1
- XCAKXQZICLBFBY-UHFFFAOYSA-N dibutoxy-(4-chlorophenyl)-propylsilane Chemical compound C(CC)[Si](OCCCC)(OCCCC)C1=CC=C(C=C1)Cl XCAKXQZICLBFBY-UHFFFAOYSA-N 0.000 description 1
- BCLPQFKOTDMTRZ-UHFFFAOYSA-N dibutoxy-butyl-(4-chlorophenyl)silane Chemical compound ClC1=CC=C(C=C1)[Si](OCCCC)(OCCCC)CCCC BCLPQFKOTDMTRZ-UHFFFAOYSA-N 0.000 description 1
- PEFRGITVNPEOKK-UHFFFAOYSA-N dibutoxy-ethyl-propylsilane Chemical compound CCCCO[Si](CC)(CCC)OCCCC PEFRGITVNPEOKK-UHFFFAOYSA-N 0.000 description 1
- 230000037213 diet Effects 0.000 description 1
- 235000005911 diet Nutrition 0.000 description 1
- ZWTJVXCCMKLQKS-UHFFFAOYSA-N diethoxy(ethyl)silicon Chemical compound CCO[Si](CC)OCC ZWTJVXCCMKLQKS-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- JVUVKQDVTIIMOD-UHFFFAOYSA-N dimethoxy(dipropyl)silane Chemical compound CCC[Si](OC)(OC)CCC JVUVKQDVTIIMOD-UHFFFAOYSA-N 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- SGKDAFJDYSMACD-UHFFFAOYSA-N dimethoxy(propyl)silane Chemical compound CCC[SiH](OC)OC SGKDAFJDYSMACD-UHFFFAOYSA-N 0.000 description 1
- BBLGAWHITBYJEU-UHFFFAOYSA-N dipropoxy(propyl)silane Chemical compound CCCO[SiH](CCC)OCCC BBLGAWHITBYJEU-UHFFFAOYSA-N 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- XSAUEOCQIPDIQK-UHFFFAOYSA-N ethoxy(diethyl)silane Chemical compound CCO[SiH](CC)CC XSAUEOCQIPDIQK-UHFFFAOYSA-N 0.000 description 1
- DRUOQOFQRYFQGB-UHFFFAOYSA-N ethoxy(dimethyl)silicon Chemical compound CCO[Si](C)C DRUOQOFQRYFQGB-UHFFFAOYSA-N 0.000 description 1
- BNFBSHKADAKNSK-UHFFFAOYSA-N ethyl(dipropoxy)silane Chemical compound CCCO[SiH](CC)OCCC BNFBSHKADAKNSK-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 229940045996 isethionic acid Drugs 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- BEGLCMHJXHIJLR-UHFFFAOYSA-N methylisothiazolinone Chemical compound CN1SC=CC1=O BEGLCMHJXHIJLR-UHFFFAOYSA-N 0.000 description 1
- AMVXVPUHCLLJRE-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)hexane-1,6-diamine Chemical compound CO[Si](OC)(OC)CCCNCCCCCCN AMVXVPUHCLLJRE-UHFFFAOYSA-N 0.000 description 1
- KNEKGIMTTIJSJU-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]hexane-1,6-diamine Chemical compound CO[Si](C)(OC)CCCNCCCCCCN KNEKGIMTTIJSJU-UHFFFAOYSA-N 0.000 description 1
- GDYNEEHLNBYCLY-UHFFFAOYSA-N n'-[3-[methoxy(dimethyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(C)CCCNCCN GDYNEEHLNBYCLY-UHFFFAOYSA-N 0.000 description 1
- AQIQPUUNTCVHBS-UHFFFAOYSA-N n,n-dimethyl-3-triethoxysilylpropan-1-amine Chemical compound CCO[Si](OCC)(OCC)CCCN(C)C AQIQPUUNTCVHBS-UHFFFAOYSA-N 0.000 description 1
- QIOYHIUHPGORLS-UHFFFAOYSA-N n,n-dimethyl-3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN(C)C QIOYHIUHPGORLS-UHFFFAOYSA-N 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical group CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- MGMTWSRWICTLNN-UHFFFAOYSA-N n-methyl-3-tributoxysilylpropan-1-amine Chemical compound CCCCO[Si](CCCNC)(OCCCC)OCCCC MGMTWSRWICTLNN-UHFFFAOYSA-N 0.000 description 1
- DTPZJXALAREFEY-UHFFFAOYSA-N n-methyl-3-triethoxysilylpropan-1-amine Chemical compound CCO[Si](OCC)(OCC)CCCNC DTPZJXALAREFEY-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- MWNQXXOSWHCCOZ-UHFFFAOYSA-L sodium;oxido carbonate Chemical compound [Na+].[O-]OC([O-])=O MWNQXXOSWHCCOZ-UHFFFAOYSA-L 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- CBXCPBUEXACCNR-UHFFFAOYSA-N tetraethylammonium Chemical compound CC[N+](CC)(CC)CC CBXCPBUEXACCNR-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000005369 trialkoxysilyl group Chemical group 0.000 description 1
- OWNXEGRCIOMNSN-UHFFFAOYSA-N tribromo(3-bromopropyl)silane Chemical compound BrCCC[Si](Br)(Br)Br OWNXEGRCIOMNSN-UHFFFAOYSA-N 0.000 description 1
- AKZFRSVAIXEQQT-UHFFFAOYSA-N tribromo(3-chloropropyl)silane Chemical compound ClCCC[Si](Br)(Br)Br AKZFRSVAIXEQQT-UHFFFAOYSA-N 0.000 description 1
- OOXSLJBUMMHDKW-UHFFFAOYSA-N trichloro(3-chloropropyl)silane Chemical compound ClCCC[Si](Cl)(Cl)Cl OOXSLJBUMMHDKW-UHFFFAOYSA-N 0.000 description 1
- ZIILLBRFKOKOGU-UHFFFAOYSA-N trichloro-(3-chlorophenyl)silane Chemical compound ClC1=CC=CC([Si](Cl)(Cl)Cl)=C1 ZIILLBRFKOKOGU-UHFFFAOYSA-N 0.000 description 1
- ABADVTXFGWCNBV-UHFFFAOYSA-N trichloro-(4-chlorophenyl)silane Chemical compound ClC1=CC=C([Si](Cl)(Cl)Cl)C=C1 ABADVTXFGWCNBV-UHFFFAOYSA-N 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- DOZVVMRTHCONBE-UHFFFAOYSA-N trimethyl(3-tributoxysilylpropyl)azanium Chemical compound C(CCC)O[Si](CCC[N+](C)(C)C)(OCCCC)OCCCC DOZVVMRTHCONBE-UHFFFAOYSA-N 0.000 description 1
- ALUCWCKJAKDHAI-UHFFFAOYSA-N trimethyl(3-trimethoxysilylpropyl)azanium Chemical compound CO[Si](OC)(OC)CCC[N+](C)(C)C ALUCWCKJAKDHAI-UHFFFAOYSA-N 0.000 description 1
- BHEUEPKFDMDFHP-UHFFFAOYSA-N trimethyl(3-tripropoxysilylpropyl)azanium Chemical compound CCCO[Si](OCCC)(OCCC)CCC[N+](C)(C)C BHEUEPKFDMDFHP-UHFFFAOYSA-N 0.000 description 1
- IUPPGFSFTCAGHQ-UHFFFAOYSA-N trimethyl-[3-[methyl(dipropoxy)silyl]propyl]azanium Chemical compound C[Si](CCC[N+](C)(C)C)(OCCC)OCCC IUPPGFSFTCAGHQ-UHFFFAOYSA-N 0.000 description 1
- AKVRHXIUYHEOID-UHFFFAOYSA-N trimethyl-[3-[propoxy(dipropyl)silyl]propyl]azanium Chemical compound C(CC)[Si](CCC[N+](C)(C)C)(OCCC)CCC AKVRHXIUYHEOID-UHFFFAOYSA-N 0.000 description 1
- VUWVDNLZJXLQPT-UHFFFAOYSA-N tripropoxy(propyl)silane Chemical compound CCCO[Si](CCC)(OCCC)OCCC VUWVDNLZJXLQPT-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
条件(1):前記官能基がアミノ基を有する、
条件(2):前記官能基がハロゲノ基を有する。
本発明の第一は、下記条件(1)および(2)の少なくとも1つを満たす官能基が表面に固定化されてなるシリカ(以下、「特定の官能基が表面に固定化されてなるシリカ」または単に「シリカ」とも記す)と、pH調整剤とを含む研磨用組成物である;
条件(1):前記官能基がアミノ基を有する、
条件(2):前記官能基がハロゲノ基を有する。
本発明の研磨用組成物は、条件(1)および(2)の少なくとも1つを満たす官能基が表面に固定化されてなるシリカを必須に含む。当該シリカは、研磨用組成物において砥粒としての機能を有する。
アミノ基を有する官能基は、特に制限されず、アミノ基のみからなる場合であってもよいし、リンカー構造にアミノ基が結合したものであってもよい。また、後者の場合、1つの官能基は、アミノ基を1つ有していてもよいし、複数有していてもよい。リンカー構造も特に制限されないが、研磨用組成物中の砥粒の分散安定性や反応性の観点から、炭素原子数2〜5の直鎖又は分岐の、アルキレン基(−CnH2n−)、オキシアルキレン基(−OCnH2n−)、アリーレン基、またはこれらの組み合わせであることが好ましい。アミノ基を有する官能基の具体例としては、後述のシランカップリング剤由来の官能基が挙げられる。
本発明の特定の官能基が表面に固定化されてなるシリカの製造方法は、特に制限されないが、例えば、原料シリカに対して特定の官能基を有するシランカップリング剤を添加し、反応させ、シリカの表面に特定の官能基を結合させることで製造することができる。
本発明の研磨用組成物は、pHを所望の値に調整するために、pH調整剤を含む。pH調整剤としては、下記のような酸またはアルカリが挙げられる。
本発明の研磨用組成物は、分散媒または溶媒を含有してもよい。分散媒または溶媒としては有機溶媒、水が考えられるが、その中でも水を含むことが好ましい。他の成分の作用を阻害するという観点から、不純物をできる限り含有しない水が好ましい。具体的には、イオン交換樹脂にて不純物イオンを除去した後フィルタを通して異物を除去した純水や超純水、または蒸留水が好ましい。
本発明の研磨用組成物は、必要に応じて、上述の特定の官能基が表面に固定化されてなるシリカ以外の砥粒(以下、「その他の砥粒」とも称する)、錯化剤、金属防食剤、防腐剤、防カビ剤、酸化剤、還元剤、界面活性剤等の他の成分をさらに含んでもよい。以下、その他の砥粒、酸化剤、防腐剤、防カビ剤について説明する。
上記シリカ以外の砥粒は、無機粒子、有機粒子、および有機無機複合粒子のいずれであってもよい。無機粒子の具体例としては、例えばシリカ(ただし、上述の特定の官能基が表面に固定化されたものを除く)、アルミナ、セリア、チタニア等の金属酸化物からなる粒子、窒化ケイ素粒子、炭化ケイ素粒子、窒化ホウ素粒子が挙げられる。有機粒子の具体例としては、例えば、ポリメタクリル酸メチル(PMMA)粒子が挙げられる。その他の砥粒は、単独でもまたは2種以上混合して用いてもよい。また、その他の砥粒は、市販品を用いてもよいし合成品を用いてもよい。
酸化剤は、研磨対象物の表面を酸化し、研磨用組成物による研磨対象物の研磨レートを向上させる。
防腐剤または防カビ剤としては、例えば、2−メチル−4−イソチアゾリン−3−オンや5−クロロ−2−メチル−4−イソチアゾリン−3−オン等のイソチアゾリン系防腐剤、パラオキシ安息香酸エステル類、及びフェノキシエタノール等が挙げられる。これら防腐剤または防カビ剤は、単独でもまたは2種以上混合して用いてもよい。
本発明の研磨用組成物の製造方法は、特に制限されず、例えば、特定の官能基が表面に固定化されてなるシリカ、pH調整剤、および必要に応じて他の成分を、攪拌混合して得ることができる。すなわち、本発明の他の一形態に係る研磨用組成物の製造方法は、下記条件(1)および(2)の少なくとも1つを満たす官能基が表面に固定化されてなるシリカと、pH調整剤とを混合することを含む;条件(1):前記官能基がアミノ基を有する、条件(2):前記官能基がハロゲノ基を有する。
本発明の研磨用組成物は、Si含有材料を含む層を有する研磨対象物を研磨するのに好適である。Si含有材料としては、単結晶シリコン、多結晶シリコン(poly−Si)、シリコン酸化物、およびシリコン窒化物といったものが挙げられるが、中でも、本発明の効果がより効率的に得られるという観点から、Si含有材料は、多結晶シリコンまたはシリコン窒化物を含むことが好ましく、シリコン窒化物を含むことがより好ましく、多結晶シリコンおよびシリコン窒化物を含むことがさらに好ましい。
本発明の一形態によると、研磨対象物を有する被研磨材料を上記研磨用組成物を用いて研磨する工程を含む研磨方法が提供される。また、本発明の他の一形態によると、上記研磨方法で研磨する工程を含む、基板の製造方法が提供される。
(アミノ基を有する官能基が表面に固定されてなるシリカ(シリカA)の合成)
原料シリカとして、コロイダルシリカ水溶液1000g(濃度19.5質量%、平均一次粒子径が35nm、平均二次粒子径が68nm)を準備した。別途、シランカップリング剤である(3−アミノプロピル)トリエトキシシランを5mmol(1.12g)秤量し、メタノール50gに溶解させた。
原料シリカとして、コロイダルシリカ水溶液1000g(濃度19.5質量%、平均一次粒子径が35nm、平均二次粒子径が68nm)を準備した。別途、シランカップリング剤である(3−ブロモプロピル)トリメトキシシランを5mmol(1.22g)秤量し、メタノール50gに溶解させた。
研磨用組成物を、下記表1〜4に示す組成で、砥粒(シリカ)、pH調整剤、酸化剤を超純水中で混合することにより調製した(混合温度:約25℃、混合時間:約10分)。研磨用組成物のpHは、pHメータにより確認した。表中の「―」は未添加であることを示す。
得られた研磨用組成物を用い、研磨対象物を以下の研磨条件で研磨した際の研磨レートを測定した。
研磨機: 200mm用片面CMP研磨機
パッド: ポリウレタン製パッド
圧力: 2.5psi(17.2KPa)
定盤回転数: 60rpm
キャリア回転数: 40rpm
研磨用組成物の流量: 100ml/min
研磨時間:1分間。
Claims (9)
- 下記条件(1)および(2)の少なくとも1つを満たす官能基が表面に固定化されてなるシリカと、pH調整剤とを含む研磨用組成物;
条件(1):前記官能基がアミノ基を有する、
条件(2):前記官能基がハロゲノ基を有する。 - 前記条件(2)を満たす場合において、前記ハロゲノ基がフルオロ基、クロロ基、ブロモ基、およびヨード基からなる群より選択される少なくとも1つを含む、請求項1に記載の研磨用組成物。
- Si含有材料を含む層を有する研磨対象物を研磨する用途で使用される、請求項1または2に記載の研磨用組成物。
- 前記Si含有材料は、単結晶シリコン、多結晶シリコン、シリコン酸化物、およびシリコン窒化物からなる群より選択される少なくとも1つを含む、請求項3記載の研磨用組成物。
- 前記条件(1)を満たす場合において、貴金属を含む層を有する研磨対象物を研磨する用途で使用される、請求項1に記載の研磨用組成物。
- 前記貴金属が、金、銀、白金、パラジウム、ロジウム、ルテニウム、イリジウム、およびオスミウムからなる群より選択される少なくとも1つを含む、請求項5記載の研磨用組成物
- 研磨対象物を有する被研磨材料を請求項1〜6のいずれか1項に記載の研磨用組成物を用いて研磨する工程を含む、研磨方法。
- 請求項7に記載の研磨方法で研磨する工程を含む、基板の製造方法。
- 下記条件(1)および(2)の少なくとも1つを満たす官能基が表面に固定化されてなるシリカと、pH調整剤とを混合することを含む研磨用組成物の製造方法;
条件(1):前記官能基がアミノ基を有する、
条件(2):前記官能基がハロゲノ基を有する。
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