JPWO2014136473A1 - 水晶振動装置 - Google Patents
水晶振動装置 Download PDFInfo
- Publication number
- JPWO2014136473A1 JPWO2014136473A1 JP2015504193A JP2015504193A JPWO2014136473A1 JP WO2014136473 A1 JPWO2014136473 A1 JP WO2014136473A1 JP 2015504193 A JP2015504193 A JP 2015504193A JP 2015504193 A JP2015504193 A JP 2015504193A JP WO2014136473 A1 JPWO2014136473 A1 JP WO2014136473A1
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- substrate
- quartz
- conductive adhesive
- resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 90
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000010453 quartz Substances 0.000 claims abstract description 35
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000012790 adhesive layer Substances 0.000 claims abstract description 24
- 230000005284 excitation Effects 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 230000010355 oscillation Effects 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 5
- 238000013016 damping Methods 0.000 abstract description 10
- 238000000605 extraction Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 240000006829 Ficus sundaica Species 0.000 description 1
- 241001428214 Polyides Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/09—Elastic or damping supports
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
Abstract
Description
2…ケース基板
3…第1の取付電極
4…第2の取付電極
5…配線電極
6…第1の外部電極
7…配線電極
8…第2の外部電極
9…ダミー電極
10…ダミー電極
11…水晶振動子
12…第1の導電性接着剤層
13…第2の導電性接着剤層
14…水晶基板
14a…長辺
14b…長辺
14c…短辺
14d…短辺
15…第1の励振電極
16…第2の励振電極
17…引き出し電極
18…第1の端子電極
19…引き出し電極
20…第2の端子電極
21…キャップ
Claims (4)
- ケース基板と、
前記ケース基板の上面に形成された第1及び第2の取付電極と、
前記ケース基板上に搭載されており、かつATカットの水晶基板を用いた水晶振動子と、
前記水晶振動子を前記第1及び第2の取付電極に電気的に接続するとともに、該水晶振動子を片持ち梁で支持している第1及び第2の導電性接着剤層とを備え、
前記第1及び第2の導電性接着剤層により前記水晶振動子を前記ケース基板に接合している接合部分の接合面積の合計S(mm2)が、水晶基板の厚みをt(μm)としたときに、S≦−0.001t+0.22の範囲とされている、水晶振動装置。 - 前記水晶振動子を構成している前記水晶基板が、長さ方向一端側で片持ち梁で支持されており、該長さ方向が水晶のX軸方向とされている、請求項1に記載の水晶振動装置。
- 前記導電性接着剤層が、エポキシ樹脂と、前記エポキシ樹脂に分散されている導電性材料とを有するエポキシ樹脂系接着剤からなる、請求項1または2に記載の水晶振動装置。
- 前記水晶振動子が、水晶基板の上面に設けられた第1の励振電極と、下面に設けられており、第1の励振電極と重なり合っている第2の励振電極と、前記第1及び第2の励振電極に電気的に接続されており、前記水晶基板の下面に設けられた第1,第2の端子電極とを有する、請求項1〜3のいずれか1項に記載の水晶振動装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013045680 | 2013-03-07 | ||
JP2013045680 | 2013-03-07 | ||
PCT/JP2014/050428 WO2014136473A1 (ja) | 2013-03-07 | 2014-01-14 | 水晶振動装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6075441B2 JP6075441B2 (ja) | 2017-02-08 |
JPWO2014136473A1 true JPWO2014136473A1 (ja) | 2017-02-09 |
Family
ID=51491005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015504193A Active JP6075441B2 (ja) | 2013-03-07 | 2014-01-14 | 水晶振動装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9509275B2 (ja) |
JP (1) | JP6075441B2 (ja) |
WO (1) | WO2014136473A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD760230S1 (en) | 2014-09-16 | 2016-06-28 | Daishinku Corporation | Piezoelectric vibration device |
KR101715183B1 (ko) * | 2015-06-01 | 2017-03-10 | 주식회사 성광이엔지 | 가축용 사료탱크의 사료배출장치 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03175713A (ja) * | 1989-12-04 | 1991-07-30 | Murata Mfg Co Ltd | 圧電共振子とその製造方法 |
JP2000138550A (ja) * | 1998-10-29 | 2000-05-16 | Toyo Commun Equip Co Ltd | 表面実装型圧電デバイス |
JP2001077651A (ja) | 1999-08-31 | 2001-03-23 | Kyocera Corp | 圧電デバイス |
JP2002100950A (ja) * | 2000-09-22 | 2002-04-05 | Kyocera Corp | 圧電デバイス |
JP4087186B2 (ja) * | 2002-06-25 | 2008-05-21 | 日本電波工業株式会社 | 水晶振動子の保持構造 |
JP4222147B2 (ja) * | 2002-10-23 | 2009-02-12 | セイコーエプソン株式会社 | 圧電発振器及び圧電発振器を利用した携帯電話装置および圧電発振器を利用した電子機器 |
JP2005197957A (ja) | 2004-01-06 | 2005-07-21 | Toyo Commun Equip Co Ltd | 圧電振動子、及び圧電発振器 |
JP2006211089A (ja) * | 2005-01-26 | 2006-08-10 | Daishinku Corp | 圧電振動デバイス |
JP2009188484A (ja) * | 2008-02-04 | 2009-08-20 | Epson Toyocom Corp | 圧電フィルタ |
JP4809447B2 (ja) | 2009-01-30 | 2011-11-09 | 日本電波工業株式会社 | 水晶振動子の製造方法 |
JP2011182155A (ja) | 2010-03-01 | 2011-09-15 | Seiko Epson Corp | 圧電デバイスと圧電デバイスの製造方法 |
JP2012199861A (ja) * | 2011-03-23 | 2012-10-18 | Nippon Dempa Kogyo Co Ltd | 水晶デバイス及び水晶デバイスの検査方法 |
JP2013021667A (ja) * | 2011-03-23 | 2013-01-31 | Nippon Dempa Kogyo Co Ltd | 水晶デバイス |
JP2013027003A (ja) * | 2011-07-26 | 2013-02-04 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス |
WO2014167980A1 (ja) * | 2013-04-08 | 2014-10-16 | 株式会社村田製作所 | 水晶振動装置 |
-
2014
- 2014-01-14 JP JP2015504193A patent/JP6075441B2/ja active Active
- 2014-01-14 WO PCT/JP2014/050428 patent/WO2014136473A1/ja active Application Filing
-
2015
- 2015-08-24 US US14/833,559 patent/US9509275B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2014136473A1 (ja) | 2014-09-12 |
JP6075441B2 (ja) | 2017-02-08 |
US20150365068A1 (en) | 2015-12-17 |
US9509275B2 (en) | 2016-11-29 |
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