JPWO2013145161A1 - 金属酸化膜の製造方法および金属酸化膜 - Google Patents
金属酸化膜の製造方法および金属酸化膜 Download PDFInfo
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- JPWO2013145161A1 JPWO2013145161A1 JP2014507129A JP2014507129A JPWO2013145161A1 JP WO2013145161 A1 JPWO2013145161 A1 JP WO2013145161A1 JP 2014507129 A JP2014507129 A JP 2014507129A JP 2014507129 A JP2014507129 A JP 2014507129A JP WO2013145161 A1 JPWO2013145161 A1 JP WO2013145161A1
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- metal oxide
- oxide film
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- 229910044991 metal oxide Inorganic materials 0.000 title claims abstract description 143
- 150000004706 metal oxides Chemical class 0.000 title claims abstract description 143
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 239000002019 doping agent Substances 0.000 claims abstract description 103
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 34
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 26
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 26
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 21
- 238000005507 spraying Methods 0.000 claims abstract description 19
- 230000003647 oxidation Effects 0.000 claims description 25
- 238000007254 oxidation reaction Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 21
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 239000004327 boric acid Substances 0.000 claims description 12
- 239000011701 zinc Substances 0.000 description 41
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 19
- 230000015572 biosynthetic process Effects 0.000 description 19
- 229910052725 zinc Inorganic materials 0.000 description 18
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 11
- 150000002894 organic compounds Chemical class 0.000 description 10
- 229910052796 boron Inorganic materials 0.000 description 9
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 239000007800 oxidant agent Substances 0.000 description 8
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 230000009257 reactivity Effects 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- SRVXDMYFQIODQI-UHFFFAOYSA-K gallium(iii) bromide Chemical compound Br[Ga](Br)Br SRVXDMYFQIODQI-UHFFFAOYSA-K 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RMSOEGBYNWXXBG-UHFFFAOYSA-N 1-chloronaphthalen-2-ol Chemical compound C1=CC=CC2=C(Cl)C(O)=CC=C21 RMSOEGBYNWXXBG-UHFFFAOYSA-N 0.000 description 1
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminium flouride Chemical compound F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- -1 alkyl metals Chemical class 0.000 description 1
- CECABOMBVQNBEC-UHFFFAOYSA-K aluminium iodide Chemical compound I[Al](I)I CECABOMBVQNBEC-UHFFFAOYSA-K 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- YZYDPPZYDIRSJT-UHFFFAOYSA-K boron phosphate Chemical compound [B+3].[O-]P([O-])([O-])=O YZYDPPZYDIRSJT-UHFFFAOYSA-K 0.000 description 1
- 229910000149 boron phosphate Inorganic materials 0.000 description 1
- ILAHWRKJUDSMFH-UHFFFAOYSA-N boron tribromide Chemical compound BrB(Br)Br ILAHWRKJUDSMFH-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UPWPDUACHOATKO-UHFFFAOYSA-K gallium trichloride Chemical compound Cl[Ga](Cl)Cl UPWPDUACHOATKO-UHFFFAOYSA-K 0.000 description 1
- WXXZSFJVAMRMPV-UHFFFAOYSA-K gallium(iii) fluoride Chemical compound F[Ga](F)F WXXZSFJVAMRMPV-UHFFFAOYSA-K 0.000 description 1
- DWRNSCDYNYYYHT-UHFFFAOYSA-K gallium(iii) iodide Chemical compound I[Ga](I)I DWRNSCDYNYYYHT-UHFFFAOYSA-K 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PSCMQHVBLHHWTO-UHFFFAOYSA-K indium(iii) chloride Chemical compound Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- PUGUQINMNYINPK-UHFFFAOYSA-N tert-butyl 4-(2-chloroacetyl)piperazine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCN(C(=O)CCl)CC1 PUGUQINMNYINPK-UHFFFAOYSA-N 0.000 description 1
- JKNHZOAONLKYQL-UHFFFAOYSA-K tribromoindigane Chemical compound Br[In](Br)Br JKNHZOAONLKYQL-UHFFFAOYSA-K 0.000 description 1
- RMUKCGUDVKEQPL-UHFFFAOYSA-K triiodoindigane Chemical compound I[In](I)I RMUKCGUDVKEQPL-UHFFFAOYSA-K 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1291—Process of deposition of the inorganic material by heating of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Ceramic Engineering (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Chemical Vapour Deposition (AREA)
- Manufacturing Of Electric Cables (AREA)
- Oxygen, Ozone, And Oxides In General (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Abstract
Description
具体的に、本実施の形態に係る金属酸化膜の製造方法を、図4に示す製造装置(成膜装置)を用いて説明する。
2 加熱器
3A,3B,3C 容器
4A,4B,4C 霧化器
5 ドーパント溶液
6 酸化源
7 溶液
8 ノズル
L1,L2,L3 経路
Claims (9)
- (A)アルキル金属を含む溶液(7)を、非真空下に配置された基板(1)に対して噴霧する工程と、
(B)前記工程(A)の際に、前記基板に対して、無機化合物から成るドーパントを含むドーパント溶液(5)を噴霧する工程とを、備える
ことを特徴とする金属酸化膜の製造方法。 - 前記無機化合物から成るドーパントは、
ホウ酸である、
ことを特徴とする請求項1に記載の金属酸化膜の製造方法。 - 前記工程(A)および(B)において、
前記基板に供給される前記アルキル金属のモル濃度に対する、前記基板に供給される前記ドーパントのモル濃度が、1.8%未満である、
ことを特徴とする請求項2に記載の金属酸化膜の製造方法。 - 前記工程(A)および(B)において、
前記溶液および前記ドーパント溶液は各々、別系統(L1,L3)を介して、前記基板に供給される、
ことを特徴とする請求項1に記載の金属酸化膜の製造方法。 - (D)前記工程(A)および(B)の際に、前記基板に対して、酸化源(6)を噴霧する工程を、さらに備えている、
ことを特徴とする請求項1に記載の金属酸化膜の製造方法。 - 前記工程(A)および(D)において、
前記溶液および前記酸化源は各々、別系統(L1,L2)を介して、前記基板に供給される、
ことを特徴とする請求項5に記載の金属酸化膜の製造方法。 - 前記工程(A)、(B)および(D)において、
前記溶液、前記酸化源および前記ドーパント溶液は各々、別系統(L1,L2,L3)を介して、前記基板に供給される、
ことを特徴とする請求項5に記載の金属酸化膜の製造方法。 - 前記酸化源は、
水である、
ことを特徴とする請求項5に記載の金属酸化膜の製造方法。 - 請求項1乃至請求項8の何れかに記載の金属酸化膜の製造方法により作製された、ことを特徴とする金属酸化膜。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2012/058156 WO2013145161A1 (ja) | 2012-03-28 | 2012-03-28 | 金属酸化膜の製造方法および金属酸化膜 |
Publications (2)
Publication Number | Publication Date |
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JPWO2013145161A1 true JPWO2013145161A1 (ja) | 2015-08-03 |
JP5956560B2 JP5956560B2 (ja) | 2016-07-27 |
Family
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JP2014507129A Active JP5956560B2 (ja) | 2012-03-28 | 2012-03-28 | 金属酸化膜の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20150076422A1 (ja) |
JP (1) | JP5956560B2 (ja) |
KR (3) | KR20160130527A (ja) |
CN (1) | CN104220375A (ja) |
DE (1) | DE112012006123T5 (ja) |
TW (1) | TWI470680B (ja) |
WO (1) | WO2013145161A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2016001712A (ja) * | 2013-11-29 | 2016-01-07 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01264929A (ja) * | 1988-04-13 | 1989-10-23 | Mitsubishi Metal Corp | 透明導電性酸化亜鉛膜の製造方法 |
WO2010035313A1 (ja) * | 2008-09-24 | 2010-04-01 | 東芝三菱電機産業システム株式会社 | 金属酸化膜の成膜方法および金属酸化膜の成膜装置 |
WO2010123030A1 (ja) * | 2009-04-21 | 2010-10-28 | 東ソー・ファインケム株式会社 | ドープまたはノンドープの酸化亜鉛薄膜製造用組成物とそれを用いた酸化亜鉛薄膜の製造方法 |
WO2011155635A1 (ja) * | 2010-06-08 | 2011-12-15 | 住友金属鉱山株式会社 | 金属酸化物膜の製造方法及び金属酸化物膜、それを用いた素子、金属酸化物膜付き基板並びにそれを用いたデバイス |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0945140A (ja) | 1995-07-28 | 1997-02-14 | Sumitomo Metal Mining Co Ltd | 酸化亜鉛系透明導電性膜 |
JP5411681B2 (ja) | 2009-12-09 | 2014-02-12 | スタンレー電気株式会社 | 酸化亜鉛系半導体の成長方法及び半導体発光素子の製造方法 |
-
2012
- 2012-03-28 US US14/382,827 patent/US20150076422A1/en not_active Abandoned
- 2012-03-28 JP JP2014507129A patent/JP5956560B2/ja active Active
- 2012-03-28 DE DE201211006123 patent/DE112012006123T5/de active Pending
- 2012-03-28 KR KR1020167030595A patent/KR20160130527A/ko active Application Filing
- 2012-03-28 KR KR1020147025959A patent/KR20140129197A/ko active Application Filing
- 2012-03-28 KR KR1020197008862A patent/KR20190035964A/ko not_active Application Discontinuation
- 2012-03-28 WO PCT/JP2012/058156 patent/WO2013145161A1/ja active Application Filing
- 2012-03-28 CN CN201280071921.6A patent/CN104220375A/zh active Pending
- 2012-06-15 TW TW101121485A patent/TWI470680B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01264929A (ja) * | 1988-04-13 | 1989-10-23 | Mitsubishi Metal Corp | 透明導電性酸化亜鉛膜の製造方法 |
WO2010035313A1 (ja) * | 2008-09-24 | 2010-04-01 | 東芝三菱電機産業システム株式会社 | 金属酸化膜の成膜方法および金属酸化膜の成膜装置 |
WO2010123030A1 (ja) * | 2009-04-21 | 2010-10-28 | 東ソー・ファインケム株式会社 | ドープまたはノンドープの酸化亜鉛薄膜製造用組成物とそれを用いた酸化亜鉛薄膜の製造方法 |
WO2011155635A1 (ja) * | 2010-06-08 | 2011-12-15 | 住友金属鉱山株式会社 | 金属酸化物膜の製造方法及び金属酸化物膜、それを用いた素子、金属酸化物膜付き基板並びにそれを用いたデバイス |
Non-Patent Citations (1)
Title |
---|
JPN6015020789; J.G. LU, et al.: 'Zno-based thin films synthesized by atmosphericpressure mist chemical vapor deposition,' Journal of CrystalGrowth, Vol.299, 2007, p.1-10 * |
Also Published As
Publication number | Publication date |
---|---|
KR20140129197A (ko) | 2014-11-06 |
TWI470680B (zh) | 2015-01-21 |
US20150076422A1 (en) | 2015-03-19 |
KR20160130527A (ko) | 2016-11-11 |
JP5956560B2 (ja) | 2016-07-27 |
TW201340182A (zh) | 2013-10-01 |
DE112012006123T5 (de) | 2014-12-18 |
KR20190035964A (ko) | 2019-04-03 |
WO2013145161A1 (ja) | 2013-10-03 |
CN104220375A (zh) | 2014-12-17 |
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