CN112359320A - 一种用于制备掺杂非晶硅薄膜的气源 - Google Patents
一种用于制备掺杂非晶硅薄膜的气源 Download PDFInfo
- Publication number
- CN112359320A CN112359320A CN202011137583.4A CN202011137583A CN112359320A CN 112359320 A CN112359320 A CN 112359320A CN 202011137583 A CN202011137583 A CN 202011137583A CN 112359320 A CN112359320 A CN 112359320A
- Authority
- CN
- China
- Prior art keywords
- gas
- amorphous silicon
- doping
- borane
- gas source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910021417 amorphous silicon Inorganic materials 0.000 title claims abstract description 27
- 239000007789 gas Substances 0.000 claims abstract description 50
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims abstract description 40
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910000085 borane Inorganic materials 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000011261 inert gas Substances 0.000 claims abstract description 7
- 239000002019 doping agent Substances 0.000 claims abstract description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 14
- 229910052786 argon Inorganic materials 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 12
- 239000005922 Phosphane Substances 0.000 claims description 7
- 229910000064 phosphane Inorganic materials 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052743 krypton Inorganic materials 0.000 claims description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052754 neon Inorganic materials 0.000 claims description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 2
- 229910052704 radon Inorganic materials 0.000 claims description 2
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052724 xenon Inorganic materials 0.000 claims description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 abstract description 10
- 239000012535 impurity Substances 0.000 abstract description 5
- 238000011068 loading method Methods 0.000 abstract description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract description 3
- 239000007888 film coating Substances 0.000 abstract description 3
- 238000009501 film coating Methods 0.000 abstract description 3
- 229910000077 silane Inorganic materials 0.000 abstract description 3
- 239000012895 dilution Substances 0.000 abstract description 2
- 238000010790 dilution Methods 0.000 abstract description 2
- 231100000331 toxic Toxicity 0.000 abstract description 2
- 230000002588 toxic effect Effects 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 19
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- 239000010408 film Substances 0.000 description 10
- 238000005240 physical vapour deposition Methods 0.000 description 7
- 239000010409 thin film Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- PKPBCVSCCPTDIU-UHFFFAOYSA-N B.P Chemical compound B.P PKPBCVSCCPTDIU-UHFFFAOYSA-N 0.000 description 2
- -1 argon ions Chemical class 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910008423 Si—B Inorganic materials 0.000 description 1
- 229910006367 Si—P Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/028—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table
- H01L31/0288—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table characterised by the doping material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0376—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors
- H01L31/03762—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors including only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
- H01L31/202—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic Table
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
本发明公开了一种用于制备掺杂非晶硅薄膜的气源,所述气源是灌装储存在防爆容器里的掺杂气体与惰性气体的混合气体,在使用PVD方法掺杂非晶硅镀膜过程中,防爆容器中的混合气体流经减压阀、气体流量计,以固定流量导入镀膜腔体中进行镀膜使用;其中,掺杂气体的体积浓度为1‑15%,而磷烷或硼烷经稀释后其浓度大大降低,可有效解决纯磷烷、纯硼烷等剧毒、易燃的掺杂剂在运输、装卸、储存和使用上的安全风险问题,且掺杂过程中无其它杂质气体进入非晶硅薄膜,且工厂无需专门配备用于纯硅烷或硼烷存储及使用的特种设备,工厂相应的安全设施投入降低。
Description
技术领域
本发明涉及太阳能电池制备技术领域,特别涉及一种用于制备掺杂非晶硅薄膜的气源。
背景技术
在高效太阳能电池器件中,掺杂非晶硅薄膜的质量对整个太阳能电池的性能具有重要影响。掺杂非晶硅薄膜提供了场致钝化并对载流子选择性透过,与硅基底形成良好的钝化接触,使得多数载流子可以穿透钝化层,而少数载流子则被阻挡,从而实现最短的电流传输路径,极大地降低了传输电阻,从根本上消除了电流横向传输引起的损失,提升了太阳能电池的电流和填充因子。
目前,已有的非晶硅材料,尤其是PVD方法沉积掺杂非晶硅,大多采用磷烷或硼烷作为掺杂剂,在等离子体作用下磷烷或硼烷分解形成高活性的P或B离子,并与由硅靶溅射出来的硅共沉积形成Si-P或Si-B合金,由此制备N型或P型非晶硅薄膜。
为降低纯磷烷、硼烷的运输、使用风险,也有使用1-2%的磷烷(硼烷)和氢气的混合气体作为掺杂源,实现掺杂非晶硅薄膜的制备。由于磷烷、硼烷属于剧毒、易燃、易爆的危险化学气体,如直接购买纯磷烷、硼烷作为气体掺杂剂用于掺杂非晶硅薄膜的生产,在运输、装卸、储存和使用方面均存在较大安全风险。若使用浓度为1-2%的磷烷(硼烷)和氢气的混合气体作为掺杂源制备掺杂非晶硅薄膜,在沉积时氢气也会掺进非晶硅,并在后续高温退火时重新溢出,在膜层中形成气泡等缺陷,导致太阳能电池的性能和外观下降。
发明内容
为解决上述技术问题,本发明提供了一种用于制备掺杂非晶硅薄膜的气源,所述气源是灌装储存在防爆容器里的掺杂气体与惰性气体的混合气体,其中,掺杂气体的体积浓度为1-15%,而磷烷或硼烷经稀释后其浓度大大降低,可有效解决纯磷烷、纯硼烷等剧毒、易燃的掺杂剂在运输、装卸、储存和使用上的安全风险问题。
其中,所述掺杂气体为纯的磷烷或硼烷;所述惰性气体为氦气、氖气、氩气、氪气、氙气、氡气中的一种或多种混合。
本发明还提供了上述气源的使用方法,在掺杂非晶硅镀膜过程中,防爆容器中的混合气体流经减压阀、气体流量计,以固定流量导入镀膜腔体中进行镀膜使用。
本发明还提供了上述气源的用途,用于太阳能电池制备过程中的PVD方法沉积掺杂非晶硅。
通过上述技术方案,本发明具有如下有益效果:
1、氩气等惰性气体与磷烷或硼烷的混合气体在运输、装卸、存储和使用过程中安全风险低,镀膜时可以直接进行使用,使用方便;
2、掺杂过程中无其它杂质气体进入非晶硅薄膜;
3、相对成本低(在安全范围内尽量提高磷烷或硼烷浓度),工厂无需专门配备用于纯硅烷或硼烷存储及使用的特种设备,工厂相应的安全设施投入降低。
具体实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述。
实施例1:
将磷烷按照10%的体积浓度与氩气进行预混合,为保证掺杂质量应精确控制混合浓度;混合后的气体进行灌装储存在防爆的容器里,如钢瓶中,然后即可进行安全有效的运输、装卸、存储和使用。
实施例2:
本实施例2基于实施例1获得的磷烷与氩气的混合气体,在PVD镀膜制备掺杂非晶硅薄膜过程中,钢瓶中的混合气体流经减压阀、气体流量计,以固定流量导入镀膜腔体中进行使用。其中,PVD镀膜工艺为:在磁控电极上装上硅靶并放置在真空腔体里,按上述方法向腔体内通入磷烷与氩气的混合气体,腔体内真空压力为0.1-2Pa,硅靶上导入DC或AC电流,在电场作用下,硅靶放电产生等离子体,等离子体中的氩气离子经电场加速后轰击硅靶,溅射产生硅原子脱离硅靶,同时,磷掺杂气体也电离分解,轰击下来的硅原子和分解的掺杂磷原子共同沉积在经过的硅片上形成磷掺杂非晶硅薄膜。
实施例3:
将硼烷按照10%的体积浓度与氩气进行预混合,为保证掺杂质量应精确控制混合浓度;混合后的气体进行灌装储存在防爆的容器里,如钢瓶中,然后即可进行安全有效的运输、装卸、存储和使用。
实施例4:
本实施例4基于实施例3获得的硼烷与氩气的混合气体,在PVD镀膜制备掺杂非晶硅薄膜过程中,钢瓶中的混合气体流经减压阀、气体流量计,以固定流量导入镀膜腔体中进行使用。其中,PVD镀膜工艺为:在磁控电极上装上硅靶并放置在真空腔体里,按上述方法向腔体内通入硼烷与氩气的混合气体,腔体内真空压力为0.1-2Pa,硅靶上导入DC或AC电流,在电场作用下,硅靶放电产生等离子体,等离子体中的氩气离子经电场加速后轰击硅靶,溅射产生硅原子脱离硅靶,同时,硼掺杂气体也电离分解,轰击下来的硅原子和分解的掺杂硼原子共同沉积在经过的硅片上形成硼掺杂非晶硅薄膜。
本发明通过将氩气等惰性气体与磷烷或硼烷进行混合后并灌装储存在防爆的容器里,在运输、装卸、存储和使用过程中安全风险低,镀膜时可以直接进行使用,使用方便;在进行PVD等工艺时,掺杂过程中无其它杂质气体进入非晶硅薄膜;工厂无需专门配备用于纯硅烷或硼烷存储及使用的特种设备,工厂相应的安全设施投入降低。
对所公开的实施例的上述说明,使本领域专业技术人员能够实现或使用本发明。对上述实施例的多种修改对本领域的专业技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下,在其它实施例中实现。因此,本发明将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。
Claims (5)
1.一种用于制备掺杂非晶硅薄膜的气源,其特征在于,所述气源是灌装储存在防爆容器里的掺杂气体与惰性气体的混合气体,其中,掺杂气体的体积浓度为1-15%。
2.根据权利要求1所述的一种用于制备掺杂非晶硅薄膜的气源,其特征在于,所述掺杂气体为纯的磷烷或纯的硼烷。
3.根据权利要求1所述的一种用于制备掺杂非晶硅薄膜的气源,其特征在于,所述惰性气体为氦气、氖气、氩气、氪气、氙气、氡气中的一种或多种混合。
4.一种权利要求1-3任一项所述气源的使用方法,其特征在于,在掺杂非晶硅镀膜过程中,防爆容器中的混合气体流经减压阀、气体流量计,以固定流量导入镀膜腔体中进行镀膜使用。
5.一种权利要求1-3任一项所述气源的用途,其特征在于,用于太阳能电池制备过程中的PVD方法沉积掺杂非晶硅。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011137583.4A CN112359320A (zh) | 2020-10-22 | 2020-10-22 | 一种用于制备掺杂非晶硅薄膜的气源 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011137583.4A CN112359320A (zh) | 2020-10-22 | 2020-10-22 | 一种用于制备掺杂非晶硅薄膜的气源 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112359320A true CN112359320A (zh) | 2021-02-12 |
Family
ID=74511578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011137583.4A Pending CN112359320A (zh) | 2020-10-22 | 2020-10-22 | 一种用于制备掺杂非晶硅薄膜的气源 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112359320A (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0289374A (ja) * | 1988-09-27 | 1990-03-29 | Hitachi Constr Mach Co Ltd | シリコン薄膜ピエゾ抵抗素子の製造法 |
JP2010135579A (ja) * | 2008-12-05 | 2010-06-17 | Seiko Epson Corp | ドープシリコン膜の形成方法 |
CN102280502A (zh) * | 2011-08-26 | 2011-12-14 | 上海师范大学 | 一种梯度掺杂硅基异质结太阳能电池及其制备方法 |
CN111074217A (zh) * | 2019-12-24 | 2020-04-28 | 江苏杰太光电技术有限公司 | 一种掺杂非晶硅的靶材及太阳能电池制备方法 |
CN111243943A (zh) * | 2020-01-19 | 2020-06-05 | 江苏杰太光电技术有限公司 | 一种TOPCon电池的氧化硅和掺杂非晶硅的一体式镀膜方法 |
-
2020
- 2020-10-22 CN CN202011137583.4A patent/CN112359320A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0289374A (ja) * | 1988-09-27 | 1990-03-29 | Hitachi Constr Mach Co Ltd | シリコン薄膜ピエゾ抵抗素子の製造法 |
JP2010135579A (ja) * | 2008-12-05 | 2010-06-17 | Seiko Epson Corp | ドープシリコン膜の形成方法 |
CN102280502A (zh) * | 2011-08-26 | 2011-12-14 | 上海师范大学 | 一种梯度掺杂硅基异质结太阳能电池及其制备方法 |
CN111074217A (zh) * | 2019-12-24 | 2020-04-28 | 江苏杰太光电技术有限公司 | 一种掺杂非晶硅的靶材及太阳能电池制备方法 |
CN111243943A (zh) * | 2020-01-19 | 2020-06-05 | 江苏杰太光电技术有限公司 | 一种TOPCon电池的氧化硅和掺杂非晶硅的一体式镀膜方法 |
Non-Patent Citations (1)
Title |
---|
孙酣经等: "化工新材料产品及应用手册", 中国石化出版社, pages: 1127 - 1128 * |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2426233B1 (en) | Use of dialkyl monoalkoxy aluminum for the growth of Al2O3 thin films for photovoltaic applications | |
JP4553891B2 (ja) | 半導体層製造方法 | |
KR101668211B1 (ko) | 알루미늄 도펀트 조성물, 이러한 조성물을 함유하는 대기압 미만의 저장 및 전달 패키지, 및 이러한 조성물의 저장 및 전달 방법 | |
JP4441607B2 (ja) | 半導体基板を不動態化する方法 | |
JPS5892218A (ja) | 半導体装置作製方法 | |
EP3699317B1 (en) | Storage and delivery of antimony-containing materials to an ion implanter | |
JPH0143449B2 (zh) | ||
CN107516818A (zh) | 砷化镓激光器腔面及钝化方法、砷化镓激光器及制备方法 | |
CN106835017A (zh) | 基于氮离子源的离子束反应溅射沉积设备及氮化铝薄膜制备方法 | |
CN112359320A (zh) | 一种用于制备掺杂非晶硅薄膜的气源 | |
EP4365966A1 (en) | Bifacial solar cell and preparation method therefor | |
JP4910124B2 (ja) | 半導体薄膜製造装置および方法 | |
JPS61136220A (ja) | 微結晶シリコン膜の形成方法 | |
CN113053718B (zh) | 一种沉积掺杂晶硅薄膜后真空腔体的清洁方法 | |
Bubenzer et al. | Plasma processes under vacuum conditions | |
JP2010226136A (ja) | 半導体薄膜製造方法 | |
TW200402769A (en) | Removal of plasma deposited surface layers by dilution gas sputtering | |
US20200340098A1 (en) | Storage and delivery of antimony-containing materials to an ion implanter | |
EP0680384A1 (en) | Microwave energized process for the preparation of high quality semiconductor material | |
CN112018217A (zh) | 硅异质结太阳能电池的制备方法及其太阳能电池 | |
EP2426136B1 (en) | Use of trialkylaluminum for the growth of Al2O3 thin films for photovoltaic applications | |
US20220098736A1 (en) | Atomic layer deposition of lithium boron comprising nanocomposite solid electrolytes | |
CN207801155U (zh) | 砷化镓激光器腔面以及砷化镓激光器 | |
JP5956560B2 (ja) | 金属酸化膜の製造方法 | |
JP2001291882A (ja) | 薄膜の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210212 |
|
RJ01 | Rejection of invention patent application after publication |