JPWO2013132794A1 - 蒸着装置 - Google Patents

蒸着装置 Download PDF

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Publication number
JPWO2013132794A1
JPWO2013132794A1 JP2014503461A JP2014503461A JPWO2013132794A1 JP WO2013132794 A1 JPWO2013132794 A1 JP WO2013132794A1 JP 2014503461 A JP2014503461 A JP 2014503461A JP 2014503461 A JP2014503461 A JP 2014503461A JP WO2013132794 A1 JPWO2013132794 A1 JP WO2013132794A1
Authority
JP
Japan
Prior art keywords
vapor deposition
cylindrical body
sensor
separation
source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014503461A
Other languages
English (en)
Japanese (ja)
Inventor
一樹 北村
一樹 北村
西森　泰輔
泰輔 西森
展幸 宮川
展幸 宮川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2014503461A priority Critical patent/JPWO2013132794A1/ja
Publication of JPWO2013132794A1 publication Critical patent/JPWO2013132794A1/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0623—Sulfides, selenides or tellurides
    • C23C14/0629—Sulfides, selenides or tellurides of zinc, cadmium or mercury
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5846—Reactive treatment
    • C23C14/5866—Treatment with sulfur, selenium or tellurium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
JP2014503461A 2012-03-07 2013-02-28 蒸着装置 Pending JPWO2013132794A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014503461A JPWO2013132794A1 (ja) 2012-03-07 2013-02-28 蒸着装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012049909 2012-03-07
JP2012049909 2012-03-07
JP2014503461A JPWO2013132794A1 (ja) 2012-03-07 2013-02-28 蒸着装置

Publications (1)

Publication Number Publication Date
JPWO2013132794A1 true JPWO2013132794A1 (ja) 2015-07-30

Family

ID=49116290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014503461A Pending JPWO2013132794A1 (ja) 2012-03-07 2013-02-28 蒸着装置

Country Status (5)

Country Link
JP (1) JPWO2013132794A1 (zh)
KR (1) KR20140107515A (zh)
CN (1) CN104136653A (zh)
TW (1) TW201348479A (zh)
WO (1) WO2013132794A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102188345B1 (ko) * 2014-08-21 2020-12-09 세메스 주식회사 기상 증착 장치 및 기판 처리 방법
KR102092251B1 (ko) * 2015-01-06 2020-03-23 주식회사 원익아이피에스 증착시스템
EP3124648B1 (de) * 2015-07-31 2018-03-28 Hilberg & Partner GmbH Verdampfersystem sowie verdampfungsverfahren für die beschichtung eines bandförmigen substrats
CN109423610B (zh) * 2017-08-24 2020-12-04 京东方科技集团股份有限公司 一种蒸镀装置及蒸镀方法
JP6941547B2 (ja) * 2017-12-06 2021-09-29 長州産業株式会社 蒸着装置、蒸着方法及び制御板
JP7314210B2 (ja) * 2021-06-30 2023-07-25 キヤノントッキ株式会社 成膜装置、成膜方法及び蒸発源ユニット
JP7314209B2 (ja) * 2021-06-30 2023-07-25 キヤノントッキ株式会社 成膜装置、成膜方法及び蒸発源ユニット

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0916960A (ja) * 1995-06-30 1997-01-17 Hitachi Maxell Ltd 情報記録媒体の製造装置
ATE497028T1 (de) * 2000-06-22 2011-02-15 Panasonic Elec Works Co Ltd Vorrichtung und verfahren zum vakuum-ausdampfen
JP4894193B2 (ja) * 2005-08-09 2012-03-14 ソニー株式会社 蒸着装置、および表示装置の製造システム
JP4966028B2 (ja) * 2007-01-15 2012-07-04 パナソニック株式会社 真空蒸着装置
KR101108152B1 (ko) * 2009-04-30 2012-01-31 삼성모바일디스플레이주식회사 증착 소스
JP5473675B2 (ja) * 2010-03-01 2014-04-16 株式会社アルバック 薄膜形成装置
US8894458B2 (en) * 2010-04-28 2014-11-25 Samsung Display Co., Ltd. Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method

Also Published As

Publication number Publication date
KR20140107515A (ko) 2014-09-04
CN104136653A (zh) 2014-11-05
WO2013132794A1 (ja) 2013-09-12
TW201348479A (zh) 2013-12-01

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