JPWO2013035164A1 - 接着剤組成物及び接続体 - Google Patents
接着剤組成物及び接続体 Download PDFInfo
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- JPWO2013035164A1 JPWO2013035164A1 JP2013532350A JP2013532350A JPWO2013035164A1 JP WO2013035164 A1 JPWO2013035164 A1 JP WO2013035164A1 JP 2013532350 A JP2013532350 A JP 2013532350A JP 2013532350 A JP2013532350 A JP 2013532350A JP WO2013035164 A1 JPWO2013035164 A1 JP WO2013035164A1
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Classifications
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract
Description
1.ポリウレタン樹脂の合成
還流冷却器、温度計及び撹拌器を備えたセパラブルフラスコに、エステル結合を有するジオールであるポリプロピレングリコール(Mn=2000)1000質量部及び溶媒としてのメチルエチルケトン4000重量部を加え、40℃で30分間撹拌した。溶液を70℃まで昇温した後、触媒としてのジメチル錫ラウレート12.7mgを加えた。次いで、この溶液に対して、4,4−ジフェニルメタン−ジイソシアネート125質量部をメチルエチルケトン125重量部に溶解して調製した溶液を、1時間かけて滴下した。その後、赤外分光光度計でNCOの吸収ピークが見られなくなるまでこの温度で撹拌を続けて、ポリウレタン樹脂のメチルエチルケトン溶液を得た。この溶液の固形分濃度(ポリウレタン樹脂の濃度)が30質量%となるように調整した。得られたポリウレタン樹脂の重量平均分子量は、GPCによる測定の結果、320000(標準ポリスチレン換算値)であった。以下にGPCの分析条件を記す。
温度計、攪拌機、不活性ガス導入口、及び還流冷却器を装着した2リットルの四つ口フラスコに、ポリカーボネートジオール(アルドリッチ社製、数平均分子量2000)4000質量部と、2−ヒドロキシエチルアクリレート238質量部と、ハイドロキノンモノメチルエーテル0.49質量部と、スズ系触媒4.9質量部とを仕込んで反応液を調製した。70℃に加熱した反応液に対して、イソホロンジイソシアネート(IPDI)666質量部を3時間かけて均一に滴下し、反応させた。滴下完了後15時間反応を継続し、NCO%が0.2%以下となった時点を反応終了とみなし、ウレタンアクリレートを得た。GPCによる分析の結果、ウレタンアクリレートの重量平均分子量は8500(標準ポリスチレン換算値)であった。
(アクリレート化合物A)
攪拌装置、還流冷却器および温度計を装着した反応器に、ビスフェノールF型エポキシ樹脂(ビスフェノールFのジグリシジルエーテル、JER806(製品名)、三菱化学社製、エポキシ当量160〜170)を330質量部と、アクリル酸72質量部(エポキシ樹脂中のエポキシ基2モルに対してアクリル酸1モルの比率)と、ベンジルトリエチルアンモニウムクロライド1質量部と、t−ブチルカテコール0.1質量部とを仕込んで、反応液を調製した。反応液を100℃で3時間攪拌しながら、エポキシ基とアクリル酸との反応を進行させた。反応終了後、反応液を室温に戻してから、ベンゼン300質量部を添加して生成物をこれに溶解させた。続いて、炭酸ナトリウム水溶液、蒸留水の順に添加して、溶液を3回ずつ洗浄した。その後ベンゼンを十分に蒸留除去して、粗生成物を得た。粗生成物を液相クロマトグラフィーにより分析したところ、目的化合物であるエポキシ基を1つ有するアクリレート化合物の他に、エポキシ基を有しない2官能アクリレート化合物、及び原料のビスフェノールF型エポキシ樹脂が粗生成物に含まれることがわかった。そこで粗生成物を精製して、エポキシ基及びアクリロイルオキシ基を一つずつ有し、ビスフェノールF骨格を有するアクリレート化合物Aを得た。
ビスフェノールF型エポキシ樹脂に代えて、水素化ビスフェノールAのジグリシジルエーテル(HBE−100(製品名)、新日本理化株式会社、エポキシ当量210〜220)を430質量部用いたことの他はアクリレート化合物Bと同様の手順により、エポキシ基及びアクリロイルオキシ基を一つずつ有し、水素化ビスフェノールA骨格を有するアクリレート化合物Bを得た。
ポリスチレン粒子の表面に、厚さ0.2μmのニッケル層を形成し、更にこのニッケル層の外側に、厚さ0.04μmの金層を形成させた。こうして平均粒径4μmの導電性粒子を作製した。
表2に示す原料を、表2に示す質量比で混合した。そこに上記導電性粒子を1.5体積%の割合で分散させて、フィルム状接着剤を形成するための塗工液を得た。この塗工液を厚み50μmのポリエチレンテレフタレート(PET)フィルムに塗工装置を用いて塗布した。塗膜を70℃で10分熱風乾燥して、厚み18μmのフィルム状接着剤を形成させた。
上記フィルム状接着剤を回路接続材料として用いて、ライン幅75μm、ピッチ150μm及び厚さ18μmの銅回路を2200本有するフレキシブル回路板(FPC)と、ガラス基板及びガラス基板上に形成された厚さ0.2μmの酸化インジウム(ITO)の薄層を有するITO基板(厚さ1.1mm、表面抵抗20Ω/□)とを接続した。接続は、熱圧着装置(加熱方式:コンスタントヒート型、東レエンジニアリング株式会社製)を用い、180℃、3MPa又は1MPaで5秒間の加熱及び加圧により行った。これにより、幅1.5mmにわたりFPCとITO基板とがフィルム状接着剤の硬化物により接続された接続体を作製した。加圧の圧力は、圧着面積を4.95cm2として計算した。また、ITO基板に代えて、ガラス基板及びガラス基板上に形成された厚さ0.2μmの窒化ケイ素(SiN)の薄層を有するSiN基板(厚さ0.7mm)を用いて、180℃、3MPaで5秒間の加熱及び加圧により、FPCとSiN基板との接続体を作製した。
得られた接続体の隣接回路間の抵抗値(接続抵抗)を、マルチメータで測定した。抵抗値は隣接回路間の抵抗37点の平均で示した。また、この接続体の接着力を、JIS−Z0237に準じて90度剥離法で測定した。接着強度の測定装置として、東洋ボールドウィン株式会社製のテンシロンUTM−4(剥離速度50mm/min、25℃)を使用した。接続抵抗及び接着力強度は、接続直後、及び、85℃、85%RHの高温高湿槽中に250時間保持する高温高湿試験の後の接続体について測定した。
顕微鏡(商品名:ECLIPSE L200、(株)ニコン製)を用いてITO基板及びSiN基板の接続体について、高温高湿試験後の回路接続材料の硬化物とFPC及びガラスとの界面のはく離の有無を調べた。界面はく離が無い場合を「A」、界面はく離が実用上問題ない程度にわずかに認められる場合を「B」、界面はく離が実用上問題がある程度に認められる場合(実用上問題あり)を「C」と判定した。
以下に説明するように、特開2007−224228号公報に記載の実施例と同様の回路接続材料を準備し、これを用いて作製した接続体を評価した。
Claims (5)
- (a)熱可塑性樹脂、(b)ラジカル重合性化合物及び(c)ラジカル重合開始剤を含有し、
前記ラジカル重合性化合物が、エポキシ基を有する化合物を含む、接着剤組成物。 - (d)下記式(1)で表されるシランカップリング剤を更に含有する、請求項1に記載の接着剤組成物。
- (e)導電性粒子を更に含有する、請求項1又は2に記載の接着剤組成物。
- 回路電極を有し対向配置された一対の回路部材と、
前記一対の回路部材の間に設けられ、前記一対の回路部材同士を接着する接続部材と、
を備え、
一方の前記回路部材の前記回路電極と他方の前記回路部材の前記回路電極とが電気的に接続されており、
前記接続部材が、請求項1〜3のいずれか一項に記載の接着剤組成物の硬化物である、接続体。 - 一方の前記回路部材がガラス基板を有し、もう一方の前記回路部材がフレキシブル基板を有する、請求項4に記載の接続体。
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JP6398570B2 (ja) * | 2013-10-09 | 2018-10-03 | 日立化成株式会社 | 回路接続材料、回路部材の接続構造体、及び回路部材の接続構造体の製造方法 |
JP6458985B2 (ja) * | 2014-10-22 | 2019-01-30 | ナミックス株式会社 | 樹脂組成物、それを用いた絶縁フィルムおよび半導体装置 |
WO2017037951A1 (ja) | 2015-09-04 | 2017-03-09 | 日立化成株式会社 | 接着剤組成物、異方導電性接着剤組成物、回路接続材料及び接続体 |
KR102608218B1 (ko) * | 2015-11-04 | 2023-11-30 | 가부시끼가이샤 레조낙 | 접착제 조성물 및 구조체 |
KR102556357B1 (ko) * | 2015-11-25 | 2023-07-14 | 가부시끼가이샤 레조낙 | 접착제 조성물 및 구조체 |
WO2018042701A1 (ja) * | 2016-08-30 | 2018-03-08 | 日立化成株式会社 | 接着剤組成物 |
JP7314801B2 (ja) | 2017-12-28 | 2023-07-26 | 株式会社レゾナック | 接続構造体及びその製造方法 |
JP6946395B2 (ja) * | 2019-10-25 | 2021-10-06 | 日本化学工業株式会社 | 導電性接着剤、それを用いた接着構造体及び電子部品 |
CN115232573B (zh) * | 2021-04-23 | 2024-03-26 | 大洲电子材料(株) | 高温可分离的导电性粘接剂及太阳能电池模块 |
CN114927256A (zh) * | 2022-04-29 | 2022-08-19 | 常州德创高新材料科技有限公司 | 一种电路连接材料 |
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